v01.0907 GaAs MMIC SPDT SWITCH HMC240 ideal for: Telecom Inf
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HMC240
v01.0907
GaAs MMIC SPDT SWITCH
HMC240 ideal for: Telecom Infrastructure Microwave Radio VSAT Military Space
Features
Broadband Performance: Insertion Loss: High IIP3: Small Size: 0.70 0.70 0.13
SWITCHES CHIP
Test Instrumentation
Functional Diagram
General Description
HMC240 cost GaAs MESFET SPDT switch chip. Covering GHz, this switch offers high isolation insertion loss. reflective shorts when "off". switch operate using either negative control logic inputs -5/0V positive control voltage logic inputs 0/+5V. data tested with chip test fixture connected 0.025 mil) diameter wire bonds 0.31 mils) length.
Pads alternate Control Inputs.
Electrical Specifi cations, +25° With 0/-5V Control +5/0V Control, System
Parameter Frequency Min. Typ. Max. Units
Insertion Loss
Isolation
Return Loss
State"
Input Power Compression Input Third Order Intercept (Two-Tone Input Power= Each Tone) Switching Characteristics tRISE, tFALL (10/90% tON, tOFF (50% 10/90%
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC240
v01.0907
GaAs MMIC SPDT SWITCH
Insertion Loss Temperature
-0.5 INSERTION LOSS (dB) -1.5 -2.5 FREQUENCY (GHz)
Isolation
ISOLATION (dB)
FREQUENCY (GHz)
Return Loss
RETURN LOSS (dB) FREQUENCY (GHz)
RF1, RF2,
Input Compression Point
P1dB (dBm)
Compression Point Compression Point
FREQUENCY (GHz)
Input Third Order Intercept Point
(dBm)
FREQUENCY (GHz)
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
SWITCHES CHIP
HMC240
v01.0907
GaAs MMIC SPDT SWITCH
Positive Control Voltage
State High Bias Condition
Negative Control Voltage
State High Bias Condition
Control input voltage tolerences ±0.2 Vdc.
Control input voltage tolerences ±0.2 Vdc.
SWITCHES CHIP
Truth Table: Positive Control Voltage
Control Input (Vdc) (Vdc) Control Current (uA) (uA) Signal Path State
Truth Table: Negative Control Voltage
Control Input (Vdc) (Vdc) Control Current (uA) (uA) Signal Path State
Absolute Maximum Ratings
Input Power Vctrl= 0/+5 (-5)V -0.2 +0.2 +150 Class
Control Voltage Range 0/+5V) Control Voltage Range -5/0V) Storage Temperature Operating Temperature Sensitivity (HBM)
Note: This part controlled with either positive negative voltages above table. blocks required ports RFC, positive control voltage used.
ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC240
v01.0907
GaAs MMIC SPDT SWITCH
Outline Drawing
SWITCHES CHIP
Interface Schematic
Packaging Information
Standard WP-6 (Waffle Pack) Alternate
NOTES: DIMENSIONS INCHES [MILLIMETERS]. THICKNESS 0.005". TYPICAL BOND 0.004" SQUARE. TYPICAL BOND SPACING 0.006" CENTER CENTER. BOND METALLIZATION: GOLD. PADS MUST CONNECTED RF/DC GROUND.
Refer "Packaging Information" section packaging dimensions. alternate packaging information contact Hittite Microwave Corporation.
Descriptions
Number Function Description
(alt.)
truth table control voltage table. Connect either control logic input.
RF1, RFC,
These pads coupled matched Ohms. Blocking capacitors required.
(alt.)
truth table control voltage table. Connect either control logic input.
Must connected RF/DC ground.
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC240
v01.0907
GaAs MMIC SPDT SWITCH
Assembly Diagram
SWITCHES CHIP
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC240
v01.0907
GaAs MMIC SPDT SWITCH
Handling Precautions
Follow these precautions avoid permanent damage. Storage: bare placed either Waffle based protective containers, then sealed protective shipment. Once sealed protective been opened, should stored nitrogen environment. Cleanliness: Handle chips clean environment. attempt clean chip using liquid cleaning systems. Static Sensitivity: Follow precautions protect against strikes. Transients: Suppress instrument bias supply transients while bias applied. shielded signal bias cables minimize inductive pick-up. General Handling: Handle chip along edges with vacuum collet with sharp pair bent tweezers. surface chip fragile bridges should touched with vacuum collet, tweezers, fingers.
SWITCHES CHIP
Mounting
chip back-metallized mounted with electrically conductive epoxy. mounting surface should clean Epoxy Attach: Apply minimum amount epoxy mounting surface that thin epoxy fillet observed around perimeter chip once placed into position. Cure epoxy manufacturer's schedule.
Wire Bonding
Ball wedge bond with 0.025mm mil) diameter pure gold wire. Thermosonic wirebonding with nominal stage temperature deg. ball bonding force grams wedge bonding force grams recommended. minimum level ultrasonic energy achieve reliable wirebonds. Wirebonds should started chip terminated package substrate. bonds should short possible <0.31mm mils).
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
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