GaAs MMIC DOUBLE-BALANCED MIXER, Conversion Loss: Isolation: Pass

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GaAs MMIC DOUBLE-BALANCED MIXER, Conversion Loss: Isolation: Pass

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HMC203
GaAs MMIC DOUBLE-BALANCED MIXER,
Conversion Loss: Isolation: Passive: Bias Required Size: 1.49 0.89
Typical Applications
HMC203 ideal for: SATCOM Microwave Radio Military Space Radar
MIXERS DOUBLE-BALANCED CHIP
Test Equipment Sensors
Functional Diagram
General Description
HMC203 chip miniature double-balanced mixer which used upconverter downconverter. Excellent isolations provided on-chip baluns, which require external components bias. mixer chip integrated directly into MMIC hybrid applications. Unless otherwise stated, data measured with mixer mounted MMIC test fixture. MMIC connected thin film transmission lines with diameter wirebonds mils length.
Electrical Specifi cations, +25° Drive
Parameter Frequency Range, Frequency Range, Conversion Loss Noise Figure (SSB) Isolation Isolation Isolation (Input) (Input) Gain Compression (Input) Min. Typ. Max. Min. Typ. Max. Units
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC203
GaAs MMIC DOUBLE-BALANCED MIXER,
Isolation,
RF/IF LO/IF LO/RF
Conversion Loss Drive
CONVERSION LOSS (dB)
ISOLATION (dB)
FREQUENCY (GHz)
FREQUENCY (GHz)
Conversion Loss Drive
Bandwidth
FREQUENCY (GHz)
FREQUENCY (GHz)
Conversion Loss Drive
Coplanar Probe Data
CONVERSION LOSS ISOLATION (dB) CONVERSION LOSS FREQUENCY (GHz) LO/RF RF/IF
CONVERSION LOSS (dB)
LO/IF
FREQUENCY (GHz)
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
MIXERS DOUBLE-BALANCED CHIP
CONVERSION LOSS (dB)
CONVERSION LOSS (dB)
HMC203
GaAs MMIC DOUBLE-BALANCED MIXER,
Absolute Maximum Ratings
Input Drive Storage Temperature Operating Temperature +150
ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS
MIXERS DOUBLE-BALANCED CHIP
Outline Drawing
Packaging Information
Standard WP-8 (Waffle Pack) Alternate
NOTES: DIMENSIONS INCHES [MM]. THICKNESS .004". BOND PADS .004" SQUARE. BOND SPACING CENTER CENTER .006". BACKSIDE METALLIZATION: GOLD. BOND METALLIZATION: GOLD. BACKSIDE METAL GROUND. CONNECTION REQUIRED UNLABELED BOND PADS.
Refer "Packaging Information" section packaging dimensions. alternate packaging information contact Hittite Microwave Corporation.
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com
HMC203
GaAs MMIC DOUBLE-BALANCED MIXER,
Descriptions
Number Function Description Interface Schematic
This coupled matched Ohms.
This coupled matched Ohms.
MIXERS DOUBLE-BALANCED CHIP
This coupled. applications requiring operation this port should blocked externally using series capacitor whose value been chosen pass necessary frequency range. operation this must source/sink more than current non-function possible failure will result. bottom must connected RF/DC ground.
Bottom
Handling Precautions
Follow these precautions avoid permanent damage. Storage: bare placed either Waffle based protective containers, then sealed protective shipment. Once sealed protective been opened, should stored nitrogen environment. Cleanliness: Handle chips clean environment. attempt clean chip using liquid cleaning systems. Static Sensitivity: Follow precautions protect against strikes. Transients: Suppress instrument bias supply transients while bias applied. shielded signal bias cables minimize inductive pick-up. General Handling: Handle chip along edges with vacuum collet with sharp pair bent tweezers. surface chip fragile bridges should touched with vacuum collet, tweezers, fingers.
Mounting
chip back-metallized mounted with AuSn eutectic preforms with electrically conductive epoxy. mounting surface should clean flat. Eutectic Attach: 80/20 gold preform recommended with work surface temperature tool temperature When 90/10 nitrogen/hydrogen applied, tool temperature should expose chip temperature greater than more than seconds. more than seconds scrubbing should required attachment. Epoxy Attach: Apply minimum amount epoxy mounting surface that thin epoxy fillet observed around perimeter chip once placed into position. Cure epoxy manufacturer's schedule.
Wire Bonding
bonds made with 0.003" 0.0005" ribbon recommended. These bonds should thermosonically bonded with force 40-60 grams. bonds 0.001" (0.025 diameter, thermosonically bonded, recommended. Ball bonds should made with force 40-50 grams wedge bonds 18-22 grams. bonds should made with nominal stage temperature minimum amount ultrasonic energy should applied achieve reliable bonds. bonds should short possible, less than mils (0.31 mm).
price, delivery, place orders, please contact Hittite Microwave Corporation: Alpha Road, Chelmsford, 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line www.hittite.com

GaAs MMIC DOUBLE-BALANCED MIXER, Conversion Loss: Isolation: Pass

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