Mounting Instructions Power Modules Pierre-Laurent Doumergue Engi

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Mounting Instructions Power Modules Pierre-Laurent Doumergue Engi

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Application note 1904 October 2007
Mounting Instructions Power Modules
Pierre-Laurent Doumergue Engineer Microsemi Power Module Products Chemin Magret France Introduction: This application note gives main recommendations appropriately connect power module onto heatsink, (Printed Circuit Board) power module. very important follow mounting instructions limit both thermal mechanical stresses. Power module mounting onto heatsink. Proper mounting module base plate onto heat sink essential guarantee good heat transfer. heat sink power module contact surface must flat (recommended flatness <50µm 100mm continuous, recommended roughness clean dirt, corrosion, damage) order avoid mechanical stress when power module mounted, avoid increase thermal resistance. Thermal grease application achieve lowest case heat sink thermal resistance, thin layer thermal grease must applied between power module heat sink. grease applied onto module base plate, minimum thickness 60µm (2.4 mils) grease should applied with roller spatula. grease applied onto heat sink, recommended screen printing technique ensure uniform deposition minimum thickness 60µm (2.4 mils). case, module bottom surface must wetted completely with thermal grease.
Mounting power module onto heat sink. Place power module above heat sink holes, apply small pressure Insert screw with lock flat washers each mounting hole screw used instead M4). screw length must least (0.5"). First lightly tighten mounting screws. Tighten alternatively screws until their final torque value reached (4.7 max, recommended screwdriver with controlled torque this operation. possible, screws tightened again after three hours. quantity thermal grease correct when small amount grease appears around power module once bolted down onto heat sink with appropriate mounting torque (see figure screws tightened with mounting torque N.m, 2.95 Figure shows thermal grease module base plate when removed from heat sink. Screws tightened with mounting torque N.m. Note: insulation purposes, maximum height screw head plus washer must exceed maintain safe spacing between screw head nearest terminal power module.
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Application note 1904 October 2007
washers screw
washers screw
Heatsink
Thermal grease flows when screws tightened
Proper application thermal grease power module.
base plate with properly applied thermal grease after removal from heat sink.
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Application note 1904 October 2007 Mounting onto power module. First, place spacers heat sink close power module (see figure spacers must have 12±0.2mm height. must mounted onto power module screwed onto spacers. mounting torque 0.6N.m recommended. second step consists soldering signal terminals power module PCB. Manual soldering process recommended solder terminals PCB. No-clean solder flux required attach onto module since aqueous module cleaning allowed. reverse these steps, because pins soldered first PCB, screwing onto spacers will create deformation PCB, leading some mechanical stress that damage traces break components PCB. long large used, other additional spacers between heat sink necessary. recommended keep distance least between each spacer. Note plastic frame height same height Isotop® (SOT-227). same PCB, Isotop® power module used distance between power modules does exceed necessary install spacer. Note reduce switching over-voltages, decoupling capacitors must placed close possible VBUS 0/VBUS terminals (See figure Note efficient production, wave soldering process used solder terminals PCB. Each application, heat sink different; wave soldering must evaluated case-by-case basis. case, well-balanced layer solder should surround each pin. Note specific applications some power modules manufactured with AlSiC (Aluminium Silicon Carbide) baseplate suffix part number). AlSiC baseplate higher than copper baseplate, spacers must 12.5±0.2mm height.
Spacer
12±0.2
POWER MODULE
Spacer
Heat sink
onto power module.
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Application note 1904 October 2007 Holes diameters PCB.
hole 1.7±0.1(12x) 2.8±0.1 (12x)
Heat sink
Hole 10±0.1 (2x)
Decoupling capacitors
Screw spacer (2x)
hole diameters millimeters) phase configuration. Example specification: Material Epoxy Type double side Metallized holes Plating: tinning gold Conductor layers thicknesses accordance with current capability. location change according configuration (full bridge, boost chopper, fast diode full bridge.). Refer datasheet pins connect PCB. Note: Holes necessary insert tighten mounting screws that bolt down power module heat sink. These access holes must large enough screw head washers pass through freely, allowing normal tolerance hole location. Connection push pull forces. Power module must mounted such that resulting pull push forces
ISOTOP® registered trademark Microelectronics
limited (6.75lbf) terminals. This acceptable maximum value pull push forces vary depending mounting operating conditions.
Conclusion: This application note gives main recommendations regarding mounting modules. Applying these instructions will help decreasing mechanical stress both power module therefore will ensure long term operation system. Mounting instructions heat sink must also followed achieve lowest thermal resistance from power chips down cooler. these operations essential guarantee best system reliability achieve highest possible MTBF (Mean Time Between Failure).
www.microsemi.com

Mounting Instructions Power Modules Pierre-Laurent Doumergue Engi

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