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TLE42744 Dropout Linear Voltage Regulator Automotive Power
Top Searches for this datasheetData Sheet, Rev. 1.0, January 2009 TLE42744 Dropout Linear Voltage Regulator Automotive Power Dropout Linear Voltage Regulator TLE42744 Features Overview Very Current Consumption Output Voltage Output Current Very Dropout Voltage Output Current Limitation Reverse Polarity Protection Overtemperature Shutdown Wide Temperature Range From Green Product (RoHS compliant) Qualified PG-TO252-3 Description TLE42744 monolithic integrated dropout voltage regulator load currents input voltage regulated VQ,nom with precision ±2%. device designed harsh environment automotive applications. Therefore protected against overload, short circuit overtemperature conditions PG-TO263-3 implemented output current limitation overtemperature shutdown circuit. TLE42744 also used other applications requiring stabilized voltage. very quiescent current TLE42744 dedicated applications permanently connected VBAT. Type TLE42744DV50 TLE42744GV50 Package PG-TO252-3 PG-TO263-3 Marking 42744V5 42744V5 Data Sheet Rev. 1.0, 2009-01-14 TLE42744 Block Diagram Block Diagram Temperature Sensor Saturation Control Protection Circuit Control Amplifier Buffer Bandgap Reference AEB01959 Figure Block Diagram Data Sheet Rev. 1.0, 2009-01-14 TLE42744 Configuration Configuration Assignment PG-TO252-3, PG-TO263-3 AEP02561 AEP02281 Figure Configuration (top view) Definitions Functions PG-TO252-3, PG-TO263-3 Symbol Function Input block ground directly with ceramic capacitor Ground internally connected heat slug Output block ground with capacitor close terminals, respecting values given capacitance "Functional Range" Page Heat Slug internally connected GND; connect heatsink area Heat Slug Data Sheet Rev. 1.0, 2009-01-14 TLE42744 General Product Characteristics General Product Characteristics Absolute Maximum Ratings Absolute Maximum Ratings1) voltages with respect ground, (unless otherwise specified) Pos. Input 4.1.1 Output 4.1.2 4.1.3 4.1.4 4.1.5 4.1.6 Voltage Junction temperature Storage temperature Absorption Voltage Parameter Symbol Min. Limit Values Max. 1000 Human Body Model (HBM)2) Charge Device Model (CDM)3) pins Unit Test Condition Tstg VESD,HBM VESD,CDM -1000 Temperature Susceptibility subject production test, specified design susceptibility Human Body Model "HBM" according AEC-Q100-002 JESD22-A114 susceptibility Charged Device Model "CDM" according ESDA STM5.3.1 Note: Stresses above ones listed here cause permanent damage device. Exposure absolute maximum rating conditions extended periods affect device reliability. Note: Integrated protection functions designed prevent destruction under fault conditions described data sheet. Fault conditions considered "outside" normal operating range. Protection functions designed continuous repetitive operation. Pos. 4.2.1 4.2.2 4.2.3 4.2.4 Functional Range Parameter Input voltage Output Capacitor's Requirements Stability Junction temperature Symbol Limit Values Min. Max. TLE42744DV50, TLE42744GV50 Unit Remarks ESR(CQ) minimum output capacitance requirement applicable worst case capacitance tolerance relevant value Note: Within functional operating range, operates described circuit description. electrical characteristics specified within conditions given Electrical Characteristics table. Data Sheet Rev. 1.0, 2009-01-14 TLE42744 General Product Characteristics Thermal Resistance Note: This thermal data generated accordance with JEDEC JESD51 standards. more information, www.jedec.org. Pos. Parameter Symbol Min. TLE42744DV50 (PG-TO252-3) 4.3.1 4.3.2 4.3.3 4.3.4 4.3.5 TLE42744GV50 (PG-TO263-3) 4.3.6 4.3.7 4.3.8 4.3.9 4.3.10 Junction Case1) Junction Ambient1) Junction Case1) Junction Ambient1) Limit Values Typ. Max. measured heat slug Unit Conditions RthJC RthJA footprint only3) heatsink area3) heatsink area3) measured heat slug RthJC RthJA footprint only3) heatsink area3) heatsink area3) subject production test, specified design. Specified RthJA value according Jedec JESD51-2,-5,-7 natural convection 2s2p board; Product (Chip+Package) simulated 76.2 114.3 board with inner copper layers 70µm 35µm Cu). Where applicable thermal array under exposed contacted first inner copper layer. Specified RthJA value according Jedec JESD 51-3 natural convection 1s0p board; Product (Chip+Package) simulated 76.2 114.3 board with copper layer 70µm Cu). Data Sheet Rev. 1.0, 2009-01-14 TLE42744 Electrical Characteristics Electrical Characteristics Electrical Characteristics Voltage Regulator Electrical Characteristics =13.5 voltages with respect ground (unless otherwise specified) Pos. Parameter Symbol Limit Values Min. Output 5.1.1 Output Voltage Typ. Max. TLE42744DV50, TLE42744GV50 TLE42744DV50, TLE42744GV50 IQ<200 TLE42744DV50, TLE42744GV50 VQ1) TLE42744DV50, TLE42744GV50 Unit Measuring Condition 5.1.2 Output Voltage 5.1.3 Dropout Voltage 5.1.4 Load Regulation 5.1.5 5.1.6 5.1.7 5.1.8 5.1.9 5.1.10 Line Regulation Output Current Limitation Power Supply Ripple Rejection2) Temperature Output Voltage Drift Overtemperature Shutdown Threshold Overtemperature Shutdown Threshold Hysteresis Quiescent Current Current Consumption 1100 mV/K PSRR Tj,sd Tj,sdh increasing2) decreasing2) Current Consumption 5.1.11 5.1.12 5.1.13 Measured when output voltage dropped from nominal value obtained 13.5 subject production test, specified design Data Sheet Rev. 1.0, 2009-01-14 TLE42744 Electrical Characteristics Typical Performance Characteristics Voltage Regulator Current Consumption versus Output Current 01_IQ_IQ.VSD Current Consumption versus Output Current 02_IQ_IQLOW.VSD 13.5 13.5 [mA] [mA] [mA] Output Voltage Variation versus Junction Temperature 03_VQ_TJ.VSD [mA] Dropout Voltage versus Output Current 04_VDR_IQ.VSD 13.5 -0,1 -0,2 -0,3 -0,4 -0,5 [mV] [°C] Data Sheet [mA] Rev. 1.0, 2009-01-14 TLE42744 Electrical Characteristics Dropout Voltage versus Junction Temperature Maximum Output Current versus Input Voltage 05_VDR_TJ.VSD 06_IQMAX_VI.VSD [mV] IQ,max [mA] Q,nom [°C] Region Stability: Output Capacitor's ESR(CQ) versus Output Current 07_ESR_IQ.VSD Unstable Region ESR(C 13.5 Stable Region 0,01 [mA] Data Sheet Rev. 1.0, 2009-01-14 TLE42744 Package Outlines Package Outlines +0.15 -0.10 ±0.1 +0.05 -0.10 +0.08 -0.04 ±0.1 ±0.5 6.22 -0.2 ±0.15 0.51 MIN. 0.15 MAX. side 0.75 ±0.1 2.28 0.0.15 +0.08 -0.04 ±0.1 4.57 0.25 metal surfaces plated, except area cut. Figure PG-TO252-3 Data Sheet Rev. 1.0, 2009-01-14 TLE42744 Package Outlines ±0.2 0.0.3 1.27 ±0.1 ±0.3 0.05 (15) 9.25 ±0.2 7.55 0.0.15 0.75 ±0.1 1.05 2.54 5.08 0.25 ±0.5 ±0.3 ±0.1 MAX. Typical metal surfaces: plated, except area cut. Metal surface min. x=7.25, y=6.9 Figure PG-TO263-3 GPT09362 Green Product (RoHS compliant) meet world-wide customer requirements environmentally friendly products compliant with government regulations device available green product. Green products RoHS-Compliant (i.e Pb-free finish leads suitable Pb-free soldering according IPC/JEDEC J-STD-020). further information alternative packages, please visit website: Data Sheet Dimensions Rev. 1.0, 2009-01-14 TLE42744 Revision History Revision Revision History Date 2009-01-14 Changes Initial Version final Data Sheet Data Sheet Rev. 1.0, 2009-01-14 Edition 2009-01-14 Published Infineon Technologies 81726 Munich, Germany 2009 Infineon Technologies Rights Reserved. Legal Disclaimer information given this document shall event regarded guarantee conditions characteristics. With respect examples hints given herein, typical values stated herein and/or information regarding application device, Infineon Technologies hereby disclaims warranties liabilities kind, including without limitation, warranties non-infringement intellectual property rights third party. Information further information technology, delivery terms conditions prices, please contact nearest Infineon Technologies Office (www.infineon.com). Warnings technical requirements, components contain dangerous substances. information types question, please contact nearest Infineon Technologies Office. Infineon Technologies components used life-support devices systems only with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system affect safety effectiveness that device system. 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