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TLE42744 Dropout Linear Voltage Regulator Automotive Power


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Data Sheet, Rev. 1.0, January 2009
TLE42744
Dropout Linear Voltage Regulator
Automotive Power
Dropout Linear Voltage Regulator
TLE42744
Features
Overview
Very Current Consumption Output Voltage Output Current Very Dropout Voltage Output Current Limitation Reverse Polarity Protection Overtemperature Shutdown Wide Temperature Range From Green Product (RoHS compliant) Qualified
PG-TO252-3
Description TLE42744 monolithic integrated dropout voltage regulator load currents input voltage regulated VQ,nom with precision ±2%. device designed harsh environment automotive applications. Therefore protected against overload, short circuit overtemperature conditions PG-TO263-3 implemented output current limitation overtemperature shutdown circuit. TLE42744 also used other applications requiring stabilized voltage. very quiescent current TLE42744 dedicated applications permanently connected VBAT.
Type TLE42744DV50 TLE42744GV50
Package PG-TO252-3 PG-TO263-3
Marking 42744V5 42744V5
Data Sheet
Rev. 1.0, 2009-01-14
TLE42744
Block Diagram
Block Diagram
Temperature Sensor
Saturation Control Protection Circuit Control Amplifier Buffer
Bandgap Reference
AEB01959
Figure
Block Diagram
Data Sheet
Rev. 1.0, 2009-01-14
TLE42744
Configuration
Configuration
Assignment PG-TO252-3, PG-TO263-3
AEP02561
AEP02281
Figure
Configuration (top view)
Definitions Functions PG-TO252-3, PG-TO263-3
Symbol Function Input block ground directly with ceramic capacitor Ground internally connected heat slug Output block ground with capacitor close terminals, respecting values given capacitance "Functional Range" Page Heat Slug internally connected GND; connect heatsink area
Heat Slug
Data Sheet
Rev. 1.0, 2009-01-14
TLE42744
General Product Characteristics
General Product Characteristics
Absolute Maximum Ratings
Absolute Maximum Ratings1) voltages with respect ground, (unless otherwise specified) Pos. Input 4.1.1 Output 4.1.2 4.1.3 4.1.4 4.1.5 4.1.6 Voltage Junction temperature Storage temperature Absorption Voltage Parameter Symbol Min. Limit Values Max. 1000 Human Body Model (HBM)2) Charge Device Model (CDM)3) pins Unit Test Condition
Tstg VESD,HBM VESD,CDM
-1000
Temperature
Susceptibility
subject production test, specified design susceptibility Human Body Model "HBM" according AEC-Q100-002 JESD22-A114 susceptibility Charged Device Model "CDM" according ESDA STM5.3.1
Note: Stresses above ones listed here cause permanent damage device. Exposure absolute maximum rating conditions extended periods affect device reliability. Note: Integrated protection functions designed prevent destruction under fault conditions described data sheet. Fault conditions considered "outside" normal operating range. Protection functions designed continuous repetitive operation.
Pos. 4.2.1 4.2.2 4.2.3 4.2.4
Functional Range
Parameter Input voltage Output Capacitor's Requirements Stability Junction temperature Symbol Limit Values Min. Max. TLE42744DV50, TLE42744GV50
Unit
Remarks
ESR(CQ)
minimum output capacitance requirement applicable worst case capacitance tolerance relevant value
Note: Within functional operating range, operates described circuit description. electrical characteristics specified within conditions given Electrical Characteristics table.
Data Sheet
Rev. 1.0, 2009-01-14
TLE42744
General Product Characteristics
Thermal Resistance
Note: This thermal data generated accordance with JEDEC JESD51 standards. more information, www.jedec.org. Pos. Parameter Symbol Min. TLE42744DV50 (PG-TO252-3) 4.3.1 4.3.2 4.3.3 4.3.4 4.3.5 TLE42744GV50 (PG-TO263-3) 4.3.6 4.3.7 4.3.8 4.3.9 4.3.10 Junction Case1) Junction Ambient1) Junction Case1) Junction Ambient1) Limit Values Typ. Max. measured heat slug
Unit
Conditions
RthJC RthJA
footprint only3) heatsink area3) heatsink area3) measured heat slug
RthJC RthJA
footprint only3) heatsink area3) heatsink area3)
subject production test, specified design. Specified RthJA value according Jedec JESD51-2,-5,-7 natural convection 2s2p board; Product (Chip+Package) simulated 76.2 114.3 board with inner copper layers 70µm 35µm Cu). Where applicable thermal array under exposed contacted first inner copper layer. Specified RthJA value according Jedec JESD 51-3 natural convection 1s0p board; Product (Chip+Package) simulated 76.2 114.3 board with copper layer 70µm Cu).
Data Sheet
Rev. 1.0, 2009-01-14
TLE42744
Electrical Characteristics
Electrical Characteristics
Electrical Characteristics Voltage Regulator
Electrical Characteristics =13.5 voltages with respect ground (unless otherwise specified) Pos. Parameter Symbol Limit Values Min. Output 5.1.1 Output Voltage Typ. Max. TLE42744DV50, TLE42744GV50 TLE42744DV50, TLE42744GV50 IQ<200 TLE42744DV50, TLE42744GV50 VQ1) TLE42744DV50, TLE42744GV50
Unit
Measuring Condition
5.1.2
Output Voltage
5.1.3
Dropout Voltage
5.1.4
Load Regulation
5.1.5 5.1.6 5.1.7 5.1.8 5.1.9 5.1.10
Line Regulation Output Current Limitation Power Supply Ripple Rejection2) Temperature Output Voltage Drift Overtemperature Shutdown Threshold Overtemperature Shutdown Threshold Hysteresis Quiescent Current Current Consumption
1100
mV/K
PSRR
Tj,sd Tj,sdh
increasing2) decreasing2)
Current Consumption 5.1.11 5.1.12 5.1.13
Measured when output voltage dropped from nominal value obtained 13.5 subject production test, specified design
Data Sheet
Rev. 1.0, 2009-01-14
TLE42744
Electrical Characteristics
Typical Performance Characteristics Voltage Regulator
Current Consumption versus Output Current
01_IQ_IQ.VSD
Current Consumption versus Output Current
02_IQ_IQLOW.VSD
13.5
13.5
[mA]
[mA]
[mA]
Output Voltage Variation versus Junction Temperature
03_VQ_TJ.VSD
[mA]
Dropout Voltage versus Output Current
04_VDR_IQ.VSD
13.5
-0,1 -0,2 -0,3 -0,4 -0,5
[mV]
[°C]
Data Sheet
[mA]
Rev. 1.0, 2009-01-14
TLE42744
Electrical Characteristics
Dropout Voltage versus Junction Temperature
Maximum Output Current versus Input Voltage
05_VDR_TJ.VSD
06_IQMAX_VI.VSD
[mV]
IQ,max [mA]
Q,nom
[°C]
Region Stability: Output Capacitor's ESR(CQ) versus Output Current
07_ESR_IQ.VSD
Unstable Region
ESR(C
13.5 Stable Region
0,01
[mA]
Data Sheet
Rev. 1.0, 2009-01-14
TLE42744
Package Outlines
Package Outlines
+0.15 -0.10 ±0.1
+0.05 -0.10 +0.08 -0.04
±0.1
±0.5 6.22 -0.2
±0.15
0.51 MIN.
0.15 MAX. side
0.75 ±0.1 2.28
0.0.15 +0.08 -0.04 ±0.1
4.57
0.25
metal surfaces plated, except area cut.
Figure
PG-TO252-3
Data Sheet
Rev. 1.0, 2009-01-14
TLE42744
Package Outlines
±0.2 0.0.3 1.27 ±0.1
±0.3
0.05
(15)
9.25 ±0.2
7.55
0.0.15 0.75 ±0.1 1.05 2.54 5.08 0.25
±0.5
±0.3
±0.1
MAX.
Typical metal surfaces: plated, except area cut. Metal surface min. x=7.25, y=6.9
Figure PG-TO263-3
GPT09362
Green Product (RoHS compliant) meet world-wide customer requirements environmentally friendly products compliant with government regulations device available green product. Green products RoHS-Compliant (i.e Pb-free finish leads suitable Pb-free soldering according IPC/JEDEC J-STD-020).
further information alternative packages, please visit website: Data Sheet
Dimensions Rev. 1.0, 2009-01-14
TLE42744
Revision History
Revision
Revision History
Date 2009-01-14 Changes Initial Version final Data Sheet
Data Sheet
Rev. 1.0, 2009-01-14
Edition 2009-01-14 Published Infineon Technologies 81726 Munich, Germany 2009 Infineon Technologies Rights Reserved. Legal Disclaimer information given this document shall event regarded guarantee conditions characteristics. With respect examples hints given herein, typical values stated herein and/or information regarding application device, Infineon Technologies hereby disclaims warranties liabilities kind, including without limitation, warranties non-infringement intellectual property rights third party. Information further information technology, delivery terms conditions prices, please contact nearest Infineon Technologies Office (www.infineon.com). Warnings technical requirements, components contain dangerous substances. information types question, please contact nearest Infineon Technologies Office. Infineon Technologies components used life-support devices systems only with express written approval Infineon Technologies, failure such components reasonably expected cause failure that life-support device system affect safety effectiveness that device system. Life support devices systems intended implanted human body support and/or maintain sustain and/or protect human life. they fail, reasonable assume that health user other persons endangered.

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