HIGH DENSITY PLUS Description Page Overview Modula

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HIGH DENSITY PLUS
HIGH DENSITY PLUS
Description
Page
Overview
Modular High Density Socket Interconnection System
Series
Daughtercard Socket Connector Daughtercard Socket Module Daughtercard Accessories Ordering Information Daughtercard Hole Patterns
Series
Backpanel Module Backpanel Accessories
Power Distribution
Backpanel Accessories Guide Pins Right Angle HD+® Connector Backpanel Hole Patterns Polarization
Specifications
High Density Plus Specifications Operating Characteristics
Technical Information
Signal Integrity High Density Plus Family Compliant Contact Litton Electronic System Packaging Other Product Offerings
While information this publication believed accurate reliable, data presented subject change without notice. Winchester Electronics disclaims responsibility damages resulting from application incompleteness inaccuracies information presented. Consult factory specific information latest design specifications. following trademarks owned licensed Winchester Electronics: HIGH DENSITY PLUS®, C-Press®, HIGH DENSITY PLUS 1TM, HIGH DENSITY PLUS 2TM, 1TM, PLUS 1TM, PLUS 2Certified File LR34182 Recognized under Component Program Underwriters Laboratories Inc. File E31650
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Overview
Modular High Density Socket Interconnection System
Complete system design enhances product performance reduces time-to market Modular backplane daughterboard connectors offer unlimited design flexibility Integral daughterboard stiffener Optional +1and rows contacts provide additional grounding shielding without sacrificing signal contact density Higher interconnect density. rows contacts continuous 0.100" grid. greater contact density Industry keying polarization standard Integral power management high current, multi-voltage applications C-Press® most reliable compliant industry meets year life telecommunications standards options modular power distribution: External Bars Internal Heavy Copper Multilayer Technology Meets performance requirements MIL-C-28859 MIL-STD-2166 Contact Sequencing Options
Plus Contacts
Socket Connector Daughtercard Plus Contacts
Modules Backpanel
Evolution Revolution
Using higher speed higher power semiconductors, today's electronic systems combine many functions into totally integrated package. These systems must operate faster, more efficiently more cost-effective produce. Meeting these performance parameters demands that designers must: Minimize reflections impedance mismatch. Reduce crosstalk between adjacent signal contacts. Minimize inductance contacts used power ground. Integrate power distribution into backpanel design.
Modularity
HD+® combines modular design concept with density electro-mechanical performance vital VLSI designs. Both socket modules stackable providing virtually continuous .100 .100, (2.54 2.54) contact grid. modules available with both ends open continuous stacking, with wall with polarized ensure unique identity. HD+® incorporates product family off-theshelf back plane daughtercard connectors including: modules modules, including HD+1and HD+2contacts illustrated next page, address grounding power requirements, without increasing size connector envelope.
Don't Conform Create!
HIGH DENSITY PLUS® fully integrated interconnection system, specifically designed meet existing anticipated semiconductor technology needs.
Certified File
LR34182
Recognized under Component Program Underwriters Laboratories Inc. File E31650
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Overview
Modular High Density Socket Interconnection System
Aluminum Stiffener Locates Modules Mounting Hole Boss Contact Tail Alignment Guide Insulator Stiffener Insulation
Multilayer Backpanel
D+2Contacts
D+1Contacts Daughtercard
C-Press® Compliant Contact
Socket Connector
Module
Density
demonstrate density achievable with HIGH DENSITY PLUS®, good comparison made using Double Eurocard Format, standard Multibus designs. I/O's provided using 41612 connectors. Without addressing power, grounding impedance matching requirements, conventional row, high density connectors increase this number I/O's. With
addition HD+1and HD+2contacts, grounding impedance matching requirements addressed without sacrificing signal contact density.
Power Ground Capability
Today's designs often require ability install remove daughtercards while system operating. facilitate this, HIGH DENSITY PLUS® provides distinct levels contact sequencing ground, power signal.
Power Module Power Blades Backpanel Modules Connect Internal Copper Layers
External Bars Connect Source Termination Studs
Termination Stud
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Daughtercard Socket Connector
Daughtercard Modules
Socket modules pre-assembled into precisely located holes extruded aluminum stiffener. End-stackability offers same flexibility daughtercard assembly backpanel modules. Both available versions, with each offering positions mate with corresponding modules. HD+1and HD+2contacts socket module located bottom surfaces insulator. These wide conductors mate with Plus cantilever contacts positioned backpanel modules. extended socket module wipe option available refer sequence mating chart page
insure proper alignment, HIGH DENSITY PLUS® system offers daughtercard module mating backpanel guide pin.
Polarization Modules
HIGH DENSITY PLUS® offers polarization modules unique identity. Stainless steel polarizing keys bushings used modules conform MIL-C-55302. configurations octagonal provide sixty-four polarization options when modules used daughtercard. When polarization modules used, guide must also used.
Power Ground Modules
HIGH DENSITY PLUS® connector system provides daughtercard modules that interconnect discrete backpanel power modules external busing system. Power modules contain contacts, each rated amperes. This power busing system designed distribute power ground across backpanel individual daughtercards.
Guide Modules
connectors become longer, mechanics alignment, insertion forces, length become more important.
Power Module part number page Polarizing Module part number page Stiffener provides cost method eliminate daughterboard warpage
Socket Module part number page Guide Module part number page Spaces permitted required between modules. Mounting spacers required long spans. Consult factory. spacer part number page
Socket Module part number page Polarizing Module part number page
Catalog HS27500-X Shown
final socket connector assembly will assigned dash number factory
Winchester Electronics
socket modules accessories shown following pages afford wide degree design flexibility. example shown illustrates combine various modules stiffener produce complete connector assembly.
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
first datum location stiffener Pos. .700 (17.78)
Daughtercard Socket Connector
0.10 (2.5) thru clearance 2-32 stiffener mounting screw part 113069 .150 (3.81) contact D+2Contact
Pos. .950 (24.13)
Socket Contact Insulator Pos./Row .049 Max. (1.24) 1.400 Ref. (35.56) D+1Contact
Tail Alignment Guide
Pos./Row 1.900 Ref. (48.26) .100 Typ. (2.54) Designation
.200 (5.08) .300 (7.62)
(11.43) .026 (0.66) Ref.
.465 (11.81) .565 (14.35)
.390 (9.91) .490 (12.45)
.025 (0.64) Typ.
.100 (2.54) Typ.
.069 (1.75) Daughtercard Mounting Surface .306 (7.77) (10.9) D+2Contact D+1Contact .100 (2.54) Typ. (Refer code order chart page
Attributes High Density Plus System
Complete system design enhances product performance reduces time-to-market Press meets 40-year life telecommunications standards Modular backplane daughterboard connectors offer unlimited design flexibility Integral daughterboard stiffener Higher interconnect density. contacts continuous 0.100" grid. greater contact density Industry keying/polarization standard
Integral power management high current, multi-voltage applications Press most reliable compliant industry options modular power distribution: External Bars Internal heavy Copper Multilayer Technology Meets performance requirements MIL-C-28859 MIL-STD-2166 Contact Sequencing Options
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
ORDERING INFORMATION
Note: following information used help user select individual modules. However, HD+® socket connectors supplied assembled from individual socket modules. Consult factory final assembly part number
Daughtercard Socket Module
Step Series Code: High Density Socket
Step Step Connector Style: Insulator HD+® without Style: HD+1and HD+2Stackcontacts able HD+1contacts HD+2with both +1and HD+2contacts HD+2configuration with HD+1contacts omitted next page
Step
Step
Number Rows: next page
Insulator Positions Row: positions positions next page
Step Selective Plating HD+2Contacts: Without HD+1and HD+2ground contacts selective plating chart below sockets with +1and +2ground contacts selective plating chart below
Step Contact Type Tail Length: When using connector style code (without ground contacts) contact type code only contact type chart below
Step
Selective Plating Socket Contact (Signal) selective plating chart below
Selective Plating Chart Step
Code Mating Area Solder Tail .000030 min. .000100 min. Gold Lead .000050 min. .000100 min. Gold Lead Gold Flash over .000100 min. .000025 min. Lead Palladium Nickel Gold Flash over .000100 min. .000040 min. Lead Palladium Nickel Note: Contact underplate .000050 minimum Nickel
Contact Type Chart Step
P.C.B. Thickness Code .062 (1.57) .093 (2.36) .062 (1.57) .093 (2.36) Socket Contact Description Standard Wipe Extended Wipe Standard Wipe Standard Wipe Extended Wipe Standard Wipe HD+1& +2.015 Contact (0.38) .010 Description (0.25) Standard Wipe Standard Wipe Standard Wipe Extended Wipe Extended Wipe Extended Wipe .150 (3.81) .125 (3.18) .150 (3.81) .125 (3.18)
Extended Wipe option produces .025 (0.64 ref.) increase wipe over standard socket assembly.
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
COMPONENTS
Code
Daughtercard Socket Modules
Socket Connector Style Step Socket Modules Shown) Code Code Code
D+1Contact
D+1Contact
D+2Contact
D+2Contact
D+1
D+2
D+3
Number Rows Step Code Code
Module
Module
Typical Socket Connector Profile Step
(24.6) Ref. 1.07 (27.2) Ref. 1.07 Ref. (27.2)
1.17 (29.7) Ref.
(11.4)
(11.4)
(14.0)
(14.0)
D+1Contact
D+1Contact
D+2Contact
D+1Contact
D+1Contact
D+2Contact
D+®, D+1
D+2
D+®, D+1
D+2
Typical Final Socket Connector Assembled P.C. Board
Part Number
113069
.312 7.92 .375 9.53 .031 0.79 .094 2.38
.093 2.36 .166 4.22
2-32
113069 Ref.
(Nominal P.C. Board Thickness)
type self-tapping thread stiffener mounting screw. Cross recessed head. Material: Stainless steel
mounting screw typically supplied each module mounting spacer. When using multiple combinations power, polarizing guide modules, each designated mounting
hole position need drilled P.C. Board, providing distance between mounting holes greater than inches.
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Daughtercard Accessories
Polarizing
Polarizing part number 113036 either supplied loose, installed assembled with module. code order chart
.125 3.18
±.003 ±.0.08
Reference dimension press with polarizing module Material: Stainless steel Insertion Tool: 107-43247
Polarizing Module
0.10 (2.5) thru clearance 2-32 stiffener mounting screw part number 113069
Polarizing Module Assembly
Shaded area represents polarizing key. shown position
.265 (6.73)
Part number 113038 shown. Code letter indicates position flat. Code Order Chart guide receptacle module required applications using polarizing module.
.294 (7.47)
113038
Step Polarizing Module Part Number
Step
Step
Module Style
Polarizing Style Omit polarizing assembled
Code
Description D+2TM, D+®, D+1TM, Code
Polarization Style Clocking Clocking Code Position Position 1.04 (26.4) (21.3) (23.9) (23.9) .490 (12.45) .390 (9.91) .490 (12.45) .390 (9.91)
D+®, D+1TM, D+2TM,
Part Number 113038 113038 113038 113038
Description D+2TM, D+®, D+1TM, D+®, D+1TM, D+2TM,
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Daughtercard Accessories
Guide Receptacle Module
0.10 (2.5) thru clearance 2-32 stiffener mounting screw part number 113069 Part Number 113038 113038 113038 .265 (6.73) .294 (7.47) Dia. 0.175 ±.003 (4.45 ±0.08) thru mates with guide part number 113152 refer backpanel accessories more information. 113038 113172 Description D+2TM, D+®, D+1TM, D+®, D+1TM, D+2TM, D+®, D+1TM, 1.04 (26.4) (21.3) (23.9) (23.9) (23.9) .490 (12.45) .390 (9.91) .490 (12.45) .390 (9.91) .490 (12.45)
Special heavy duty version with aluminum insert plus screw lockwasher attachment stiffener.
Dia. 0.235 (5.97) Countersink
Mounting Spacer
(7.6) (4.3) Clearance 2-32 stiffener mounting screw part number 113069 (5.8)
Part number 113000 Consult factory stiffeners containing unsupported spans
(2.0)
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Daughtercard Accessories
Power Module
Power Module
Recommended P.C. Board Hole Patterns
Recommended P.C. Board Hole Patterns
Ordering Information
Ordering Information
Step Series: High Density
Step
Step
Step
Step
Connector Type: Power module (socket)
.970 24.64
Module Type:
Contact Tail Length:
Power Contact Selective Plating:
Step Series: High Density
Step Step Module Connector Type: Type: Power module (socket) Code Quantity
Step
Step
Contact Tail Length:
Power Contact Selective Plating:
Code Description Power Module
.450 11.43
Code Quantity
.150 3.81 .125 3.18
Code
Mating Area Gold flash over PalladiumNickel Microinches min. gold
Solder Tail
.150 3.81 .125 3.18
Code
Mating Area Gold flash over PalladiumNickel Microinches min. gold
Solder Tail
Power Module 1.070 27.18 Power Module Power Module
Tinlead
Tinlead
.570 1.170 14.48 29.72
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Daughtercard Hole Patterns
Socket Module Positions D+15 Position Equal Spaces .100 1.400 (2.54) (35.56) Position Equal Spaces .100 1.900 (2.54) (48.26) .100 (2.54) .150 (3.81) .100 Typ. (2.54)
Dia. 0.098 (2.49) Dia. 0.040 (1.02) Min. Finished Hole
Accessory Hole Patterns D+®, D+1.150 (3.81) Min.
.700 (17.78) .950 Pos. (24.13) Pos. .100 (2.54) Typ. .150 (3.81)
Dia.
0.098 (2.49)
Dia. .040 .003 Finished (1.02 0.08) Hole Dia. .060 Artwork (1.52) Ref.
.200 (5.08) .300 (7.62)
adjacent socket module
.200 (5.08)
.100 Typ. (2.54)
.200 (5.08) .300 (7.62)
.200 (5.08)
.200 (5.08)
Power Module D+1Position Equal Spaces .100 1.400 (2.54) (35.56) Position Equal Spaces .100 1.900 (2.54) (48.26)
D+2.150 (3.81) Min. .100 (2.54) .250 (6.35) .100 (2.54) Typ.
Dia. 0.098 (2.49) Dia. 0.040 (1.02) Min. Finished Hole
Pos. .700 (17.78) .950 Pos. (24.13) .100 (2.54) Typ. .150 (3.81)
Dia. 0.098 (2.49)
Dia. .040 .003 Finished (1.02 0.08) Hole .060 Artwork Dia. (1.52) Ref.
.300 (7.62)
adjacent socket module
.200 (5.08)
1
.100 (2.54)
.100 Typ. (2.54)
.300 (7.62) .400 (10.16)
.200 (5.08)
D+2Position Equal Spaces .100 1.400 (2.54) (35.56) Position Equal Spaces .100 1.900 (2.54) (48.26)
Guide Receptacle/ Polarizing Module
.200 (5.08) Min. .150 HD+®, HD+1= (3.81) HD+®, HD+2= .250 (6.35)
Dia. 0.098 (2.49)
Pos. .700 (17.78) Pos. .950 (24.13) .100 (2.54) Typ. .150 (3.81)
Dia. 0.098 (2.49)
Dia. .040 .003 Finished (1.02 0.08) Hole Dia. .060 Artwork (1.52) Ref.
2
adjacent socket module
.200 (5.08) .300 (7.62)
.300 (7.62) .500 (12.70)
.200 (5.08)
.100 (2.54)
.100 (2.54) Typ.
Delete hole patterns
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Backpanel Module
plug-up capability standard socket connectors. Plus rows contacts modules located within side walls insulator. They employ preloaded cantilever spring design similar those found cardedge connectors. They provide pathways power inductance ground connection (shielding).
Power Distribution Parameters External Busing Backpanel Modules
connector modules end-stackable .100 inch spacing available versions. Each either contact positions row. insulators available with both ends open continuous stacking, with wall positioned ends stack longitudinal guidance; and, with polarization. There several types HD+® contacts available. "Standard" "Extended" allow selected ground connections make contact first break last. When daughtercards engaged disengaged with backpanel pins "live" system, this "first make/last break" ground connection prevents transient currents from passing into fixed voltage traces daughtercard. contact tail variations include stub tail longer tail suitable levels solderless wire wrapping. These long tails also provide rear
Wall Stackable
External busing systems mounted bottom surfaces backpanel typically used high power applications. Aluminum, copper, brass bars create busing structure also serve backpanel stiffeners. Consult factory further details. Reduces complexity multilayer boards Economical high power applications Provides backpanel rigidity, eliminates warpage
Internal Distribution
Internal power distribution utilizes inner layers traces backpanel. typically used power applications. Economical power applications Minimizes consumption backpanel real estate, copper HD+1and HD+2contacts
Polarized
.049 (1.24) Max. (13.5) (16.0) .100 (2.54) Typ.
Pins/Row 1.400 Ref. (35.56) Pins/Row 1.900 Ref. (48.26)
Insulator
.200 (5.08) .300 (7.62) .500 (12.70) Typ. (4.3) HD+1Contact HD+2Contact Contact
(12.2) Board Surface HD+2
.100 (2.54) Typ.
.025 (0.64) ref. typ.
HD+1
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
ORDERING INFORMATION
Backpanel Modules
Step
Step
Step
Step
Series Code: High Density
Connector Type:
Connector Style: without +1and HD+2contacts with HD+1contacts with +1and HD+2contacts with HD+2contacts HD+1contacts below
Step Insulator Number Style: Rows: Open ends left wall walls left polarized ends polarized right wall =One right polarized below
Step
Step
Step
Step
Step
Positions Row: positions positions
Connector Style Step Code Code
1and 2Contact Type Tail Length: Without HD+1and HD+2contacts C-Press® stub tails C-Press® solderless wrap C-Press® stub tails C-Press® solderless wrap solder stub tails solder stub tails C-Press® stub tails next page
Selective Plating HD+1and HD+2Contacts: Without HD+1and HD+2contacts selective plating chart next page
Contact Type Tail Length: contact type tail length chart page
Selective Plating Contact: selective plating chart next page
Code
Contact spring mating area
HD+1
HD+2
HD+1
.500 Typ. (12.70)
Insulator Style Step
.049 Max. (1.24) Typ. .141 Typ. (3.58)
.100 Typ. (2.54)
.100 Typ. (2.54) .150 Typ. (3.81)
.200 Typ. (5.08)
.200 (5.08)
Code
Code
Code .200 Typ. (5.08) .049 Max. (1.24)
Code
.141 (3.58)
.049 Max. (1.24) Typ.
.200 (5.08)
.141 (3.58) Open side C-Press® faces side wall indicated determine left right orientation. This orientation should maintained during board assembly
Code
Code
Code
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Backpanel Modules
Number Rows Step Code Code
Module
D+1and D+2Contact Clusters Step Code Code Code Code
.194 (4.93)
.690 (17.53)
.194 (4.93)
.690 (17.53)
Code
Code
Code
.128 (3.25) Ref.
.128 (3.25) Ref.
.194 (4.92) Ref.
Selective Plating Chart Step
Description
Code
Mating Area .000030 (0.00076) Gold flash .000040 (.00101) .000050 (0.00127) .000030 (0.00076) .000050 (0.00127) .000030 (0.00076) min. gold over min. PdNi min. gold min. gold min. gold min. gold
Solderless Wrap Plating Area
C-Press® ground contact with stub tails
.000015 (0.00038)
min. tin-lead
C-Press® ground contact with solderless wrap tails
.000100 (0.00254)
min. tin-lead
gold flash Mating area: .000030 min. gold (0.00076) .000015 (0.00038) min. tin-lead
C-Press pins with rear plug-up tails C-Press® ground contact with stub tails C-Press® pins with rear plug-up tails
Ground contact with solder stub tails
.000030 (0.00076) min. gold Gold flash over .000025 min. PdNi (0.00064) Gold flash over .000025 min. PdNi (0.00064) .000030 (0.00076) min. gold Gold flash over .000025 min. PdNi (0.00064) .000050 (0.00127) min. gold
Mating area: Gold flash over .000025 min. PdNi (0.00064)
.000100 (0.00254)
min. tin-lead solder stub tails only
Note: Contact underplate .000050 min. nickel overall
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HIGH DENSITY PLUS
Series
Backpanel Modules
Standard Backpanel Application Step Midplane Application Step Codes Codes
connector code order chart
Codes Codes
Codes Codes ref. first make ref. standard
P.C. board surface
Primary side
ref. first make
ref. standard ±10% thickness
±10% backplane
ref.
Stub Tails Solderless wrap rear plug-up
Secondary side
ref. first make
standard
Midplane shroud insulator only (order separately)
ref.
Rear plug-up pins
Contact Type Tail Length Step
Type Code Standard C-Press® stub Solder stub tail First Make C-Press® stub Solder stub tail C-Press solderless wrap rear plug-up C-Press® stub C-Press solderless wrap rear plug-up .230 (5.84) .240 (6.10) .220 (5.59) .220 (5.59) .240 (6.10) C-Press® stub .220 (5.59) Description Standard Backpanel Midplane Application
.194 (4.93) .690 (17.53) .576 (14.63) .493 (12.52) .523 (13.28) .194 (4.93) .325 (8.25) .128 (3.25) .194 (4.93) .690 (17.53) .523 (13.28) .553 (14.05) .616 (15.65) .325 (8.26) .128 (3.25)
.220 (5.59) .230 (5.84)
.186 (4.72) .093 (2.36) .125 (3.18) .093 (2.36) .125 (3.18) .186 (4.72)
.260 (6.60)
.260 (6.60)
Note: Consult factory selective loading first make pins
Winchester Electronics
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HIGH DENSITY PLUS
Series
ORDERING INFORMATION
Backpanel Modules
C-Press® Replacement Contacts
113018
Step1 C-Press® contact part number
Step
Step
Step
Contact Type Length: thru contact type tail length chart page
Selective Plating Contact: selective plating chart page
Replacement designation
C-Press® Replacement Ground Contacts
113013
Step1
Step
Step
Step
C-Press® contact part number
Tail Length: Solderless wrap Stub tail
Selective Plating Ground Contact: selective plating chart page
Ground Contact Type: C-Press® tails Three C-Press® tails Five C-Press® tails
Solder Tail Replacement Contacts
113138
Step1
Step
Step
Step
Solder tail contact part number
Contact Type Length: contact type tail length chart page
Selective Plating Contact: selective plating chart page
Replacement designation
Solder Tail Replacement Ground Contacts
113137
Step1 Solder tail contact part number
Step
Tail Length: Stub tail
Step Selective Plating Ground Contact: selective plating chart page
Step
Ground Contact Type: Three solder tails Five solder tails
Midplane Shroud Part Numbers Letter Codes Refer Step
Code Positions Positions 113028-12 113028-11 Code 113028-18 113028-17 Code 113028-20 113028-19 Code 113028-14 113028-13 Code 113028-16 113028-15
Winchester Electronics
HIGH DENSITY PLUS
Series
Backpanel Accessories
Power Distribution
Dual Power Blade Module Internal Power Distribution
C-Press® power blade contacts (9.9) (5.1)
.170 (4.3)
Stiffener Guide
equals space .100 Ref. (2.54)
113084
Step1
Step
Step
C-Press power blade module part number Part Number Board Hole Pattern
Contact Code:
Selective Plating:
.200 (5.1)
Code Description
Contacts per) C-Press® C-Press
Code
Mating Area Gold flash over .000028 (0.00071) Min. Palladium Nickel Min. Gold .000050 (0.00127)
C-Press Area Stub Tail
.220 (5.59)
.202 .202 (13.2) (5.13) (5.13)
.320 .300 .202 .202 (8.13) (7.62) (15.7) (5.13) (5.13) .320 .300 .262 .262 (8.13) (7.62) (15.7) (6.65) (6.65) .320 .300 .202 .262 (8.13) (7.62) (15.7) (5.13) (6.65)
C-Press® C-Press®
.000020 Min. (0.00051) Tin-lead
Power Blade Shroud
Protects exposed power blade contact while maintaining plugability four daughtercard socket power module.
Part Number
.170 (4.32) .118 (3.00)
Power Blade Type BUSS P.C.B. Mount
Used With Blade Catalog Number
113071-4,-5,
113173-4 113173-3
113084-2-
.295 (7.49)
.425 (10.80)
Winchester Electronics
Part Number 113173-1 Shown
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Backpanel Accessories
Power Distribution
Power Blade Contacts Used With Aluminum
Part Number 113071-9 113071-8 113071-7 113071-5 113071-4 113071-1 Board Type Hole Hole Pattern Pattern
.035 (0.89) equal spaces .100 .200 Typ. (2.54) (5.08) .035 (0.89) equal spaces .100 .300 Typ. (2.54) (7.62) .025 (0.63) Typ. .322 (8.18) Typ. .300 (7.62) Ref. .210 .337 (5.33) (8.56) Typ. Typ.
.270 (6.85) Typ.
.025 (0.63) Typ.
.370 (9.40) Typ.
.495 (12.57) Typ.
Type
Type
Type
.200 (5.08) Ref.
.300 (7.62) Ref.
.300 (7.62) Ref.
Type
Type
Type
Material: Phosphor Bronze Alloy C52100 QQ-B-750, composition
Finish: .000030 Min. gold (0.00076) over .000075 Min. nickel (0.00191)
Recommended Hole Patterns Power Blades
Description polarized wall Open ends
.200 (5.08)
.450 (11.43) .250 (6.35) .150 (3.81)
.200 (5.08)
.200 (5.08)
.200 (5.08)
.300 (7.62)
Pattern
Pattern
Pattern
.200 (5.08)
.200 (5.08)
equal spaces .100 .200 (2.54) (5.08)
Pattern
equal spaces .100 .300 (2.54) (7.62)
adjacent connector
Pattern
Winchester Electronics
Note: Power blade contact holes shown minimum spacing required modules stackable
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Backpanel Accessories Guide Pins
Guide Pins Midplane
.160 (4.06) .160 (4.06) .218 (5.54) 1.000 (25.40) .335 (8.51) .218 (5.54) .070 (1.78)
Guide Pins Standard
Dia.
.166 ±.002 (4.22 ±0.05) Dia. .115 ±.003 2-56 UNC-2B (2.92 ±0.08) Thread .290 (7.37) min. deep
Dia. .166 ±.002 (4.22 ±0.05)
.045 (1.14) Dia. .115 (2.92 ±0.08)
2-56 UNC-2A Thread
.242 (6.15)
Part Number 113152-1 Shown Part Number 113152-2 113152-1 Dimension .810 (20.57) 1.000 (25.40)
Part Number 113151-1
Material:
Stainless steel. Order separately under part number 113151-1.
Material:
Stainless steel. Order separately under part number 113152-1. Guide option requires corresponding guide receptacle daughterboard connector assembly page part number identification. guide also required applications that specify polarization.
Screw Part Number 114025-1 114025-1
.375 (9.53) .250 (6.35)
.191 .315 (4.85) (8.00) .084 .190 (2.13) (4.83)
Standard Guide Pins Assembly
Midplane Guide Pins Assembly
.125 (3.17) min. .315 (8.00) max.
Ref.
Part number 114021 External lockwasher Material: Stainless Steel
Guide part number 113152-1
#2-56 UNC-2A thread cross recessed machine screw (see chart below length part number) Material: Stainless Steel
Guide part number 113152-1
Guide part number 113151-1
(nominal P.C. Board thickness)
Part Number 113165-2 113165-1
Dim. .248 (6.23) .188 (4.78)
Dim. (4.8) (2.8)
Press-Fit Guide Pins
Dia. .240 (6.10) .115 Dia. .126 Dia. (3.20) (2.92) Straight Knurl Dia. .166 (4.22) .040 (1.02) Dia. .166 (4.22)
(20.6)
Dia. .085 (2.16) Straight Knurl
(7.6)
1.00 (25.4)
Part number 113165-1 shown. Diameter .118 ±.002 non-plated thru P.C.B. hole (required).
Part number 113163-1 shown. midplane applications with part number 113165. Recommended backpanels .125 .315 nominal thick.
Note: page HD/25 recommended mounting hole patterns
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Right Angle HD+® Connector
Winchester Electronics offers right angle male HD+® connector connecting backpanel backpanel, motherboard motherboard extension boards. This HD+® right angle male connector mates without HD+® right angle female connectors power modules that carry Amps contact Amps module. your Customer Service Coordinator drawing #28500
Typical Connector Assembly Profile
Header Power Module
Guide
ORDERING INFORMATION
Step Series Code: High Density
Step Connector Type: Right Angle
Step Connector Style: HD+® without ground contacts
Step Insulator Style: Open ends
Step
Step
Step
Step
Step
Step
Number Rows: rows
Positions Row: positions
Ground Contact Type Tail Length: Without ground contact
Selective Plating Ground Contact: Without ground contact
Contact Type Tail Length: Contact Type Tail Length chart below
Selective Plating Contact: selective plating chart below
Contact Type Tail Length Chart
Type Standard Make Code Solder Stub Tail First Make .260 6.60 Description .220 5.59 .150 3.81 .125 3.18 .150 3.81 .125 3.18
Selective Plating Chart
Code Description Mating Area .000030 0.00076 Gold Solder Tail Area .000100 0.00254 TinLead
Contacts
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
HEADER
Right Angle HD+® Connector
Recommended P.C. Board Hole Pattern
GUIDE
Recommended P.C. Board Hole Pattern
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
POWER MODULE
Right Angle HD+® Connector
Winchester Electronics understands needs customers more more power their systems. satisfy these needs, offer power contact HD+® connector system that takes additional real estate. Each power module consists contacts that carry Amps each give Amps module!
Part Number HRP420302
Shown
Recommended P.C. Board Hole Pattern (component side shown)
ORDERING INFORMATION
Step
Step
Step
Series Code: High Density
Connector Type: Right Angle, Power Module
Step Module Type: Blade Height: Code Description Row, HD+201
Step Tail Length: Code .125 .150
Step
VLOW/VLOW (.187/4.75) VLOW/LOW (.187/4.75) (.227/5.76) VLOW/HIGH (.287/7.29) LOW/VLOW (.187/4.75) LOW/LOW (.227/5.76) (.227/5.76) LOW/HIGH (.287/7.29) HIGH/VLOW (.187/4.75) HIGH/LOW (.287/7.29) (.227/5.76) HIGH/HIGH (.287/7.29)
Selective Plating Contact: selective plating chart below
Selective Plating Chart
Code Description Mating Area .000050 0.00127 Gold Solder Tail Area .000100 0.00254 TinLead
Blade Contacts
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
MOUNTING SCREWS
Right Angle HD+® Connector
Typical Final Assembly Connector Shown Assembled P.C. Board
Mounting screw part number 113069-1 shown final connector assembly
MOUNTING SPACER
Consult Factory Stiffeners Containing Unsupported Spans
Part Number 113000 Shown
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Backpanel Hole Patterns
Module Positions Code
Position Equal Spaces .100 1.400 (2.54) (35.56) .100 (2.54) Typ. Position Equal Spaces .100 1.900 (2.54) (48.26)
.200 (5.08) .300 (7.62)
D+1& D+2Contact Code
.100 Typ. (2.54)
D+1& D+2Contact Code
Position Equal Spaces .100 1.400 (2.54) (35.56) Position Equal Spaces .100 1.900 (2.54) (48.26)
D+1
.300 (7.62) .400 (10.16)
.200 Typ. (5.08)
.300 (7.62) .400 (10.16)
D+1.100 (2.54) Typ. .500 (12.70) Typ. Position Equal Spaces .100 1.400 (2.54) (35.56) Position Equal Spaces .100 1.900 (2.54) (48.26) .100 (2.54) Typ.
.400 (10.16) .500 (12.70)
.200 (5.08) Typ.
.500 (12.70) Typ.
Position Equal Spaces .100 1.400 (2.54) (35.56)
Position Equal Spaces .100 1.900 (2.54) (48.26)
D+1
.400 (10.16) .500 (12.70)
+1
D+2.100 (2.54) Typ. .100 (2.54) Typ. Position Position Equal Spaces Equal Spaces .100 1.400 .100 1.900 (2.54) (35.56) (2.54) (48.26)
HD+2
D+2
.100 (2.54) Typ.
.100 (2.54) Typ.
Delete hole patterns
Right Angle
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Series
Backpanel Hole Patterns Polarization
Recommended Mounting Hole Patterns Guide holes shown minimum spacing required guide modules stackable.
.118 ±.002 (3.00 ±0.05) NPTH (preferred) typ. .120 ±.003 (3.05 ±0.08) typ. datum .200 (5.08) .047 (1.19) .118 ±.002 (3.00 ±0.05) NPTH (preferred) typ. .120 ±.003 (3.05 ±0.08) typ. datum .200 (5.08) .047 (1.19)
Open Ends
.100 (2.54)
Open Ends
.150 (3.81)
.300 (7.62) .141 (3.58)
.300 (7.62) .141 (3.58)
Wall
.100 (2.54)
Wall
.150 (3.81)
.500 (12.70) .346 (8.79)
.500 (12.70) .346 (8.79)
Polarized
.100 (2.54)
Polarized
.150 (3.81)
Note: Refer Litton Electronic System Packaging Backpanel Design Guide accesory configurations shown.
Polarization Bushing
D+1
.187 (4.75) Thru hole
D+2
.160 (4.06)
Part Marking
Part Number 113037-2
Code Shown
Note: Orientation with respect designation mating connectors. Material: Sintered stainless steel. Order separately under part number 113037-2. Bushing press fits into connector with installation tool part number 107-43240. Part number 107-43241
Polarization Style Code Clocking Position Code Clocking Position
Removal Tool:
Consult factory order bushings preassembled into connector.
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
High Density Plus Specifications Operating Characteristics
SPECIFICATIONS
MATERIALS FINISHES
following materials finishes apply High Density Plus series daughtercard backpanel connector modules.
Insulators: Thermoplastic polyester, glass filled, color black, rated V-O.
BACKPANEL CONTACTS
Signal Contacts: Material: Finish: Copper alloy Selective Plating Chart page
HD+1& HD+2Contacts: Material: Copper alloy Finish: Selective Plating Chart page
Dual Power Blade Contacts: Material: Copper alloy Finish: Selective Plating Chart page
DAUGHTERCARD CONTACTS
Signal Contacts: Materials: Finish: HD+1& Material: Finish: Power Module Contacts: Material: Finish: Daughtercard Stiffener: HD+2Contacts: Copper alloy Selective Plating Chart page Copper alloy Selective Plating Chart page
Copper alloy Selective Plating Code Chart page Extruded aluminum alloy 6061-T6 QQ-200/8. Clear anodize finish MIL-A-8625.
Stiffener Mounting Screws: Polarizing Bushings: Polarizing Guide Pins: Guide Screws: Guide Pins:
CRES Type 302, passivated Sintered metal CRES Type CRES Type 303, passivated CRES Type 303, passivated CRES Type 203, passivated
HD+® ACCESSORY TOOLING Repair Tools
DESCRIPTION Polarization (Socket Connector) Polarization Removal Tool Polarization Insertion Tool Polarization Bushing (Pin Header) Polarization Bushing Removal Tool Polarization Busing Insertion Tool Dual Power Blade Module Insertion Tool CATALOG NUMBER
107-43248 107-43247 107-43241 107-43240 107-43313 107-43312
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
High Density Plus Specifications Operating Characteristics
SPECIFICATIONS
OPERATING CHARACTERISTICS
Signal Contact Resistance: C-Press® Contact Plated Through Hole Resistance: HD+1Contact Resistance: milliohms maximum initial milliohms (max) milliohms maximum milliohms maximum milliohms maximum minimum minimum minimum
HD+2Contact Resistance: Power Blade Contact Resistance: Signal Contact Normal Force: Power Contact Normal Force: HD+1& HD+2Contact Normal Force:
Individual Signal Contact Engagement Force: average Individual Signal Contact Separation Force: Contact Life (Durability): minimum cycles, with microinches plating mating contacts, cycles, with microinches plating mating contacts minimum in.-oz minimum 5000 megohms minimum 1000 Vrms Maximum Maximum Maximum +105
HOLE SIZE REQUIREMENTS
C-Press® Signal Contact Backpanel Retention: C-Press Signal Contact torque: Insulation Resistance: Voltage Rating Level Hz): Signal Contact Current Rating: HD+1& HD+2Contact Current Rating: Power Contact Current Rating: Temperature Range:
Printed Circuit Board Dielectric Material ±.003 .040 Finished Diameter +.0015 -.0010 .0453 Diameter Hole
Copper Thickness .001-.003
Solder Thickness .0001-.0008
Standard Diameter P.T.H. Hole drilled .0453 +.0015, -.001 diameter. Plating thickness must .001 .003 copper .0001 .0008 solder. Final hole dimension must gauged .040 ±.003 diameter. Winchester drawing number 27331
HD+® HEADER TOOLING Repair Tools
DESCRIPTION Contact Repair Single Contact Pullout Tool Single Contact Tool Handle Single Contact Seating Tool Single Contact Tool Ground Contact Repair Removal Tool Insertion Arbor Press Tool CATALOG NUMBER DESCRIPTION Shroud Insulator Repair Removal Tool Removal Tool Removal Tool Removal Tool Seating Tool Seating Tool Seating Tool Seating Tool CATALOG NUMBER
107-43238 107-42500 107-43230 107-42031 107-43239 107-43232
107-43234 107-43235 107-43236 107-43237 107-43244 107-43246 107-43243 107-43245
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Signal Integrity High Density Plus Family
been determined that HIGH DENSITY PLUS® connector family, together with proper choice grounding pattern, suitable inclusion system designs where risetime equal less than Crosstalk characteristics HIGH DENSITY PLUS® connectors, especially HD+2TM, predictable suitable hi-performance system design.
Crosstalk
addition signal reflections, another source noise must considered crosstalk. Crosstalk caused electromagnetic coupling "quiet" signal contact nearby "active" signal contact. There types crosstalk concerned with; forward crosstalk backward crosstalk. Crosstalk reduced increasing number ground contacts because electromagnetic fields created signal ground contacts will cancel each other's effects.
Signal Reflection HIGH DENSITY PLUS® Family Reduces Simultaneous Switching Noise
Group Group Group
Crosstalk Measurements
Percent Reflected Voltage
Reflected Area
Percent
-1.5 -2.5
Foward XTalk Risetime 700ps interface Backward XTalk
D+1
D+2
HIGH DENSITY PLUS® offers advantage additional rows contacts that used inductance grounding power distribution.
grounding scheme utilizing only total contacts selected create worst case condition demonstrate "Plus" rows contacts improve signal integrity that environment. shows rows experiencing signal reflections from 18%. Group with HD+1signal reflections reduced duration decreased. Group combines HD+1and HD+2row contacts provide exceptional shielding.
Group
nanosecs
HIGH DENSITY PLUS® Sequence Mating
Contact
Guide Insulators Advanced Ground Contact Advanced Power Contact Standard Ground Contact Advanced Socket (.260") Signal Contacts Standard Power Contact (.240") Signal Advanced Signal Socket Contacts Advanced (.260") Signal Standard Signal Socket Contacts Standard (.220") Signal Advanced Signal Socket Contacts (.240") Signal Standard Signal Socket Contacts Standard (.220") Signal Standard Signal Socket Contacts
Electrical Overtravel*
.510 (12.95) .310 (7.87) .256 (6.50) .223 (5.66) .212 (5.38) .198 (5.03) .155 (3.94) .152 (3.86) .135 (3.43) .130 (3.30) .115 (2.92) .110 (2.79) .090 (2.29) .420 (10.67) .220 (5.59) .166 (4.22) .133 (3.38) .122 (3.10) .108 (2.74) .065 (1.65) .062 (1.57) .045 (1.143) .040 (1.02) .025 (.64) .020 (.51)
Effective Wipe***
.190 (4.83) .179 (4.54) .165 (4.19) .123 (3.12) .120 (3.05) .102 (2.59) .100 (2.54) .085 (2.16) .080 (2.03) .060 (1.52)
Worst case peak backward crosstalk 5.6% observed between adjacent pins row. Forward crosstalk also largest this pair pins. Peak backward forward crosstalk between adjacent pins 4.2% 2.2% respectively. presence HD+® rows clearly reduces both forward backward crosstalk, even adjacent pins. Crosstalk most favorably affected presence D+1and D+2rows. effects rows clearly most important connector where assists risetime response, reduces risetime loss improves crosstalk performance nearly 18%. most demanding applications, D+2connector provides significant improvements system performance.
Electrical Overtravel total distance socket connector travel after initial contact been made. Engagement non-electrical. Effective Wipe defined total distance socket connector travel after full contact engagement been made. standard signal standard signal socket contacts
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Compliant Contact
C-Press® "True" Compliant Press-Fit Connectors
Winchester Electronics offers leading edge compliant press-fit pins connectors. both design performance, C-Press® contact premium compliant pin.
Horizontal Cross Sections
Macro-photo cut-away view actual, unretouched, compliant contact section. maximum minimum diameter, plated through-hole contact pressure distributed evenly along inside circumference plated through-hole. section ensures tight connection without damaging hole warping board.
advantage C-Press® contact lies unique shaped compliant section. Unlike four point press-fit systems, crescent-shaped, tapered beam conforms naturally within board shape plated through-hole. expands contracts make contact around circumference plated through-hole from .037" .043" diameter, exerting equal normal force onto entire surface hole, while forming tight extremely reliable electrical connection.
True Compliant
Because compliant section C-Press® contact neither warps board distorts hole, excellent choice multilayered Multiwire® boards. major concern with "press-fit" contacts amount axial radial deformation imparted plated through-hole result contact insertion. Because C-Press® contact offers "True Compliant Fit," concern deformation damage plated through-holes inner layers printed circuit board eliminated. Electronic designers longer have subject their expensive printed circuit boards soldering forcing square into round hole. Worries about delamination from soldering damage inserting square pegs disappear, board warpage significantly reduced.
Multiwire Registered Trademark Kollmorgen Corp.
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Compliant Contact
Board Without Solder
Now, with C-Press® contact, insert round into round hole. This innovative engineering achievement (Patent #4017143) ensures spring action absorb potentially destructive energy while providing excellent electrical characteristics. C-Press® contacts meet exceed performance specifications called MIL-STE-2166 ANSI/IPC-D-422. C-Press® contacts have been approved being used high volume major manufacturers computer, medical telecommunications equipment. Because C-Press® contacts approved used 40-year life equipment, they clearly offer both dependability performance. C-Press® system provides with additional benefits such rear plug-up, freedom mount components both sides board without costly masking hand soldering operations. Further benefits that save time money ability remove replace contacts through insulator, well remove replace insulator without disturbing contacts. C-Press® contacts exhibit insertion forces lbs. max. pin) high retention forces lbs. min. pin), even after multiple replacements. damaged traces need incorporate revisions existing connection system makes necessary alter interconnects circuit board level, Winchester Electronics "Isolation Contact" answer. This contact installed into existing required position effectively "Insulates" contact from circuitry that location. Desired circuit alteration then completed means wire wrapping from point-to-point.
Tooling Engineering Support
Winchester Electronics will work with support your Backpanel Supplier your choice. Many familiar with products tooling. Connector insertion equipment available in-house, turn operation. From simple arbor press micro processor controlled hydraulic press with programmable axis, Winchester Electronics assembly equipment your needs. generations semiconductor logic impose higher demands production technology, C-Press® true compliant help promote smooth transition into future. C-Press® pre-assembled connectors will provide access solutions which would otherwise unattainable with more primitive compliant solid designs. plated through requirement C-Press® contact easily achievable production printed circuit manufacturers. C-Press® hole (see diagram) same called MIL-STD-2166.
HOLE SIZE REQUIREMENTS
Printed Circuit Board Dielectric Material ±.003 .040 Finished Diameter +.0015 -.0010 .0453 Diameter Hole
Copper Thickness .001-.003
Solder Thickness .0001-.0008
Standard Diameter P.T.H. Hole drilled .0453 +.0015, -.001 diameter. Plating thickness must .001 .003 copper .0001 .0008 solder. Final hole dimension must gauged .040 ±.003 diameter. Winchester drawing number 27331
Design Flexibility
design flexibility across board, C-Press® contact gives everything need. through pages this catalog will find: Pre-assembled Edgecard Connectors, variety Signal Pins, D-Subminiatures, MIL-C-83503 Headers, C-Tel®, Power Terminals, Strip Headers, Connectors, more. With such broad line connectors, solder press-fit technologies longer need mixed your backplane, thereby reducing assembly costs production time. Over years, billions C-Press® contacts have been successfully installed communications, computer medical equipment manufacturers, well backpanel suppliers worldwide.
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Litton Electronic System Packaging HIGH DENSITY PLUS
E.S.P. your global one-stop source Plus Systems
Litton Electronic System Packaging your early involvement technical marketing partner that facilitates resources Advanced Circuitry, Winchester Electronics, Inter-Pak Electronics Interconnection Products-Scotland. coordinates total design, manufacture, assembly test your sub-system electronic packaging solutions.
Winchester Electronics
Winchester Electronics provided more than four decades innovative leadership connector technology. C-Press® contact offers industry standard compliant press-fit connector technology. specified most discriminating computer telecommunications applications requiring long life minimum hole distortion characteristics.
HIGH DENSITY PLUS® Connectors C-Press® Compliant Connectors Cable Assemblies
Edgecard Rack Panel L-Series ISO-9002 Registered
Advanced Circuitry
Advanced Circuitry manufactures high density controlled impedance multilayer daughtercards bare board backpanels.
High Performance Substrates Large Panel Capability: Thickness: .400" Heat Sink Copper Copper Inner Layers, Approved Internal Reliability layers. standard production ISO-9002 Registered
Inter-Pak Electronics
Inter-Pak Electronics benchmark supplier automated press-fit backpanel assembly advanced electrical test.
Computer Controlled Automated Assembly Advanced Electrical System Test Signal Analysis Level Custom Card Cage Chassis Integration Solder Technology Center (SMT Thru-Hole) ISO-9002 Registered
Interconnection Products Division (IPD)
major supplier backplane interconnection European marketplace.
Backplane Interconnection Systems Sub-System Integration Computer Aided Backplane Engineering (CABE) ISO-9002 Registered
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com
HIGH DENSITY PLUS
Other DENSITY PLUS HIGH Product Offerings
Press-fit "SMA" Coaxial Connector with C-Press® compliant technology perfect solderless connector MetCon-2Connector System
Winchester L-Series High Density piece connector system Printed Circuit Edgecard
41612 Connector System
MIL-C-55302 military interconnections USECO Terminals Hardware
HIGH DENSITY PLUS socket interconnection system
About
Winchester Electronics, member Litton Industries' Electronic Components Materials group, been high reliability supplier multipole electrical electronic connectors since 1941. Through years, Winchester developed Rack Panel, Cardedge Military connectors many diverse applications. Winchester's C-Press® compliant product made favored supplier telecommunications communications industries. have industry DIN, HD+®, IDC, L-Series other high density solder press-fit connectors. products installed backpanels daughtercards major systems suppliers. expand product offering, Winchester recently acquired Retconn, leading designer manufacturer coaxial connectors, contacts cable harnesses communication computer industries. company many "FIRSTS": First MIL-Grade Mono-Block Connector First Quick-Disconnect Connector First Socket Printed Circuit Connector First Environmental Rectangular Connector First Compliant Connector These "FIRSTS" were used numerous Military programs such Atlas, Titan, Minuteman, Polaris, Poseidon, Pershing Bulpup, plus F104, F105 B-52, well Singars Lantirn. These "Firsts" were also used initial backpanels made Western Electric their channel banks Bellpac (now Fastec) systems. Winchester's core capabilities include high-speed, fine pitch, progressive stamping; precision molding; flexible rapid response development engineering; high-volume assembly connectors cable assemblies, well contract manufacturing. Winchester several 9000 registered production facilities over world. Sales efforts global direct salesman, Litton Precision Product International (LPPI) sales offices, contracted manufacturer's representatives authorized distributors. member Electronic Systems Packaging (ESP); Litton's system focused technical sales marketing service. other member divisions Advanced Circuitry, InterPak Electronics Interconnection Products. capitalizes synergy divisions bring customers most reliable, cost-effective custom backpanels enhanced interconnect system packaging industry. Winchester Electronics committed remain World-Class supplier with products services that meet clearly defined customer requirements TIME, EVERY TIME.
Winchester Electronics
Barnes Industrial Road North, Wallingford, Connecticut 06492 Phone:(203)741-5400 Fax:(203)741-5500 www.winchesterelectronics.com

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