Small Signal Schottky Diodes Integrated protection ring against s
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BAS381
Small Signal Schottky Diodes
Integrated protection ring against static discharge capacitance leakage current forward voltage drop Very switching time Lead (Pb)-free component Component accordance RoHS 2002/95/EC WEEE 2002/96/EC
9612315
Applications
General purpose switching Schottky barrier diode HF-Detector Protection circuit Diode currents with supply voltage Small battery charger Power supplies converter notebooks
Mechanical Data
Case: MicroMELF Glass case Weight: approx. Cathode Band Color: Black Packaging Codes/Options: reel tape), k/box reel tape), 12.5 k/box
Parts Table
Part BAS381 BAS382 BAS383 Type differentiation Ordering code BAS381-TR3 BAS381-TR BAS382-TR3 BAS382-TR BAS383-TR3 BAS383-TR Remarks Tape Reel Tape Reel Tape Reel
Absolute Maximum Ratings
Tamb unless otherwise specified Parameter Reverse voltage Test condition Part BAS381 BAS382 BAS383 Peak forward surge current Repetitive peak forward current Forward continuous current Symbol IFSM IFRM Value Unit
Document Number 85503 Rev. 1.9, 07-Mar-06
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BAS381
Vishay Semiconductors Thermal Characteristics
Tamb unless otherwise specified Parameter Junction ambient Junction temperature Storage temperature range Test condition board Symbol RthJA Tstg Value Unit
Electrical Characteristics
Tamb unless otherwise specified Parameter Forward voltage Test condition Reverse current Diode capacitance VRmax Symbol Typ. 1000 Unit
Typical Characteristics
Tamb unless otherwise specified
1000
Reverse Power Dissipation (mW)
Forward Current
thJA
=150
Limit
Limit
0.01
15796
15794
Junction Temperature (°C)
Forward Voltage
Figure Max. Reverse Power Dissipation Junction Temperature
Figure Forward Current Forward Voltage
1000
Diode Capacitance (pF)
VRRM
Reverse Current (µA)
15795
15797
Junction Temperature (°C)
Reverse Voltage
Figure Reverse Current Junction Temperature
Figure Diode Capacitance Reverse Voltage
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Document Number 85503 Rev. 1.9, 07-Mar-06
BAS381
0.71
1.27
0.152
0.355
10329
Figure Board RthJA definition
Package Dimensions (Inches)
Cathode indification (0.039) surface plan
Glass case MicroMELF
(0.079) (0.071)
0.25 (0.010) 0.15 (0.006)
(0.047) (0.043)
0.098) Glass
Method
Reflow Soldering
(0.047) (0.055)
Wave Soldering
(0.031) (0.031) (0.094)
Document No.: 6.560-5007.01-4 Rev. 07.Feb.2005 9612072
(0.031)
(0.035) (0.039) (0.110)
Document Number 85503 Rev. 1.9, 07-Mar-06
surface plan (0.024)
(0.035)
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BAS381
Vishay Semiconductors Ozone Depleting Substances Policy Statement
policy Vishay Semiconductor GmbH Meet present future national international statutory requirements. Regularly continuously improve performance products, processes, distribution operating systems with respect their impact health safety employees public, well their impact environment. particular concern control eliminate releases those substances into atmosphere which known ozone depleting substances (ODSs). Montreal Protocol (1987) London Amendments (1990) intend severely restrict ODSs forbid their within next years. Various national international initiatives pressing earlier these substances. Vishay Semiconductor GmbH been able policy continuous improvements eliminate ODSs listed following documents. Annex list transitional substances Montreal Protocol London Amendments respectively Class ozone depleting substances Clean Amendments 1990 Environmental Protection Agency (EPA) Council Decision 88/540/EEC 91/690/EEC Annex (transitional substances) respectively. Vishay Semiconductor GmbH certify that semiconductors manufactured with ozone depleting substances contain such substances.
reserve right make changes improve technical design without further notice. Parameters vary different applications. operating parameters must validated each customer application customer. Should buyer Vishay Semiconductors products unintended unauthorized application, buyer shall indemnify Vishay Semiconductors against claims, costs, damages, expenses, arising directly indirectly, claim personal damage, injury death associated with such unintended unauthorized use. Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
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Document Number 85503 Rev. 1.9, 07-Mar-06
Legal Disclaimer Notice
Vishay
Disclaimer
product specifications data subject change without notice. Vishay Intertechnology, Inc., affiliates, agents, employees, persons acting their behalf (collectively, "Vishay"), disclaim liability errors, inaccuracies incompleteness contained herein other disclosure relating product. Vishay disclaims liability arising application product described herein information provided herein maximum extent permitted law. product specifications expand otherwise modify Vishay's terms conditions purchase, including limited warranty expressed therein, which apply these products. license, express implied, estoppel otherwise, intellectual property rights granted this document conduct Vishay. products shown herein designed medical, life-saving, life-sustaining applications unless otherwise expressly indicated. Customers using selling Vishay products expressly indicated such applications entirely their risk agree fully indemnify Vishay damages arising resulting from such sale. Please contact authorized Vishay personnel obtain written terms conditions regarding products designed such applications. Product names markings noted herein trademarks their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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