N-Channel 30-V (D-S) MOSFET RDS(on) 0.0037 0.0048 (Typ.) FEA

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N-Channel 30-V (D-S) MOSFET RDS(on) 0.0037 0.0048 (Typ.) FEA

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Si7856ADP
N-Channel 30-V (D-S) MOSFET
RDS(on) 0.0037 0.0048 (Typ.)
FEATURES
Halogen-free available Available TrenchFET® Power MOSFET RoHS* Optimized "Low Side" Synchronous COMPLIANT Rectifier Operation Thermal Resistance PowerPAK Package with 1.07 Profile Tested
PowerPAK SO-8
APPLICATIONS
6.15
5.15
DC/DC Converters Synchronous Rectifiers
Bottom View Ordering Information: Si7856ADP-T1 Si7856ADP-T1-E3 (Lead (Pb)-free) Si7856ADP-T1-GE3 (Lead (Pb)-free Halogen-free) N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS unless otherwise noted
Parameter Drain-Source Voltage Gate-Source Voltage Continuous Drain Current °C)a Pulsed Drain Current Pulse Width) Continuous Source Current (Diode Conduction)a Maximum Power Dissipationa Operating Junction Storage Temperature Range Soldering Recommendations (Peak Temperature)b, Symbol Tstg Steady State Unit
THERMAL RESISTANCE RATINGS
Parameter Maximum Junction-to-Ambient
Symbol Steady State Steady State RthJA RthJC
Maximum Junction-to-Case (Drain)
Typical
Maximum
Unit °C/W
Notes: Surface Mounted board. Solder Profile PowerPAK SO-8 leadless package. lead terminal exposed copper (not plated) result singulation process manufacturing. solder fillet exposed copper cannot guaranteed required ensure adequate bottom side solder interconnection. Rework Conditions: manual soldering with soldering iron recommended leadless components. containing terminations RoHS compliant, exemptions apply.
Document Number: 73157 S-80438-Rev. 03-Mar-08
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Si7856ADP
SPECIFICATIONS unless otherwise noted
Parameter Static Gate Threshold Voltage Gate-Body Leakage Zero Gate Voltage Drain Current On-State Drain Currenta Drain-Source On-State Resistancea Forward Transconductancea Diode Forward Voltage Dynamicb Total Gate Charge Gate-Source Charge Gate-Drain Charge Gate Resistance Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Source-Drain Reverse Recovery Time td(on) td(off) di/dt A/µs VGEN 13.5 11.5
Symbol VGS(th) IGSS IDSS ID(on) RDS(on)
Test Conditions VGS,
Min.
Typ.
Max.
Unit
0.0029 0.0036 0.0037 0.0048
Notes: Pulse test; pulse width duty cycle Guaranteed design, subject production testing.
Stresses beyond those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only, functional operation device these other conditions beyond those indicated operational sections specifications implied. Exposure absolute maximum rating conditions extended periods affect device reliability.
TYPICAL CHARACTERISTICS unless otherwise noted
thru
Drain Current
Drain Current
Drain-to-Source Voltage
Gate-to-Source Voltage
Output Characteristics
Transfer Characteristics
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Document Number: 73157 S-80438-Rev. 03-Mar-08
Si7856ADP
TYPICAL CHARACTERISTICS
0.0075
unless otherwise noted
8000
DS(on) On-Resistance
0.0060 Capacitance (pF)
6400
Ciss
0.0045
4800
0.0030
3200
0.0015
1600 Crss
Coss
0.0000
Drain Current
Drain-to-Source Voltage
On-Resistance Drain Current
DS(on) On-Resistance (Normalized)
Capacitance
Gate-to-Source Voltage
Total Gate Charge (nC)
Junction Temperature (°C)
Gate Charge
0.025
On-Resistance Junction Temperature
DS(on) On-Resistance
0.020 0.015
Source Current
0.010
0.005
0.000
Source-to-Drain Voltage
Gate-to-Source Voltage
Source-Drain Diode Forward Voltage
On-Resistance Gate-to-Source Voltage
Document Number: 73157 S-80438-Rev. 03-Mar-08
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Si7856ADP
TYPICAL CHARACTERISTICS unless otherwise noted
Power 0.001 GS(th) Variance
0.01
Time
Temperature (°C)
Threshold Voltage
Limited RDS(on)* Drain Current
Single Pulse Power
Single Pulse
0.01
Drain-to-Source Voltage minimum which DS(on) specified
Safe Operating Area Junction-to-Case
Normalized Effective Transient Thermal Impedance Duty Cycle
Notes:
0.05
Duty Cycle, Unit Base thJA °C/W
0.02 Single Pulse 0.01
PDMZthJA(t) Surface Mounted
Square Wave Pulse Duration
Normalized Thermal Transient Impedance, Junction-to-Ambient
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Document Number: 73157 S-80438-Rev. 03-Mar-08
Si7856ADP
TYPICAL CHARACTERISTICS unless otherwise noted
Normalized Effective Transient Thermal Impedance Duty Cycle
Single Pulse 0.05 0.02
0.01 Square Wave Pulse Duration
Normalized Thermal Transient Impedance, Junction-to-Case
Vishay Siliconix maintains worldwide manufacturing capability. Products manufactured several qualified locations. Reliability data Silicon Technology Package Reliability represent composite qualified locations. related documents such package/tape drawings, part marking, reliability data,
Document Number: 73157 S-80438-Rev. 03-Mar-08
www.vishay.com
Legal Disclaimer Notice
Vishay
Disclaimer
product specifications data subject change without notice. Vishay Intertechnology, Inc., affiliates, agents, employees, persons acting their behalf (collectively, "Vishay"), disclaim liability errors, inaccuracies incompleteness contained herein other disclosure relating product. Vishay disclaims liability arising application product described herein information provided herein maximum extent permitted law. product specifications expand otherwise modify Vishay's terms conditions purchase, including limited warranty expressed therein, which apply these products. license, express implied, estoppel otherwise, intellectual property rights granted this document conduct Vishay. products shown herein designed medical, life-saving, life-sustaining applications unless otherwise expressly indicated. Customers using selling Vishay products expressly indicated such applications entirely their risk agree fully indemnify Vishay damages arising resulting from such sale. Please contact authorized Vishay personnel obtain written terms conditions regarding products designed such applications. Product names markings noted herein trademarks their respective owners.
Document Number: 91000 Revision: 18-Jul-08
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N-Channel 30-V (D-S) MOSFET RDS(on) 0.0037 0.0048 (Typ.) FEA

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