Stress Solderability Temp Cycle Sample Size Device Hr./Cyc 10,000 Cond
|
|
|
Top Searches for this datasheet
ENVIRONMENTAL PACKAGE TESTING DATA FLAT PACK (14,
Stress Solderability Temp Cycle Sample Size Device Hr./Cyc 10,000 Condition M2003 -65_C-150_C Total Fails Fail Percentage 0.00 0.00
Document Number: 72550 31-Jan-05
www.vishay.com
Other recent searches
TS2509 - TS2509 TS2509 Datasheet
TPCP8303 - TPCP8303 TPCP8303 Datasheet
STPS660CB - STPS660CB STPS660CB Datasheet
SKY77187 - SKY77187 SKY77187 Datasheet
PEDL22340DIGEST-07 - PEDL22340DIGEST-07 PEDL22340DIGEST-07 Datasheet
MBR20150CTP - MBR20150CTP MBR20150CTP Datasheet
FAN7554 - FAN7554 FAN7554 Datasheet
E1965 - E1965 E1965 Datasheet
A67L83181 - A67L83181 A67L83181 Datasheet
A67L73361 - A67L73361 A67L73361 Datasheet
2SD1546 - 2SD1546 2SD1546 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
