Stress Solderability Temp Cycle Sample Size 2,300 Device Hr./Cyc 3,360
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ENVIRONMENTAL PACKAGE TESTING DATA METAL
Stress Solderability Temp Cycle Sample Size 2,300 Device Hr./Cyc 3,360 662,500 Condition M2003 -65_C-150_C Total Fails Fail Percentage 0.00 0.00
Document Number: 72454 30-Jan-05
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