Stress Solderability Temp Cycle Sample Size Device Hr./Cyc 130,000 Con
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ENVIRONMENTAL PACKAGE TESTING DATA CerDIP/SIDEBRAZE
Stress Solderability Temp Cycle Sample Size Device Hr./Cyc 130,000 Condition M2003 -65_C-150_C Total Fails Fail Percentage 0.00 0.00
Document Number: 72452 30-Jan-05
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