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power TRILINTON Integrated high voltage active clamping zener Cla
Top Searches for this datasheetBU900TP power TRILINTON Integrated high voltage active clamping zener Clamping energy capability 100% tested Very high current gain Applications Engine ignition control Switching regulators Motor control Light ballast Figure SOT-82 Description BU900TP planar, monolithic, high voltage power TRILINTONwith built-in active Zener clamping circuit. This device been specifically designed unclamped, inductive applications such ignition systems, switching regulators, wherever high voltage high robustness required. Internal schematic diagram Table Device summary Marking BU900TP Package SOT-82 Packaging Tube Part number BU900TP November 2008 www.st.com Electrical ratings BU900TP Electrical ratings Table Symbol VCES VEBO Ptot Tstg Absolute maximum rating Parameter Collector-emitter voltage (VBE Emitter-base voltage Collector current Collector peak current 5ms) Base current Total dissipation 25°C Storage temperature Max. operating junction temperature Value Unit Table Symbol Thermal data Parameter Value 2.27 Unit °C/W Rthj-case Thermal resistance junction-case BU900TP Electrical characteristics Electrical characteristics (Tcase 25°C unless otherwise specified) Table Symbol IEBO ICES Electrical characteristics Parameter Emitter cut-off current Collector cut-off current (VBE Collector-emitter breakdown voltage (VBE Collector-emitter saturation voltage Base-emitter saturation voltage current gain Secondary breakdown energy Test Conditions Min. Typ. Max. Unit V(BR)CES VCE(sat) VBE(sat) Es/b 7000 Pulsed duration duty cycle 1.5% Electrical characteristics BU900TP Electrical characteristics (curves) Figure current gain Figure Collector-emitter saturation voltage Figure Collector-emitter saturation voltage Figure Base-emitter saturation voltage BU900TP Package mechanical data Package mechanical data order meet environmental requirements, offers these devices ECOPACK® packages. These packages have lead-free second level interconnect. category second level interconnect marked package inner label, compliance with JEDEC Standard JESD97. maximum ratings related soldering conditions also marked inner label. ECOPACK trademark. ECOPACK specifications available www.st.com Package mechanical data BU900TP SOT-82 mechanical data Dim. Min. 2.07 1.27 2.40 0.70 0.49 10.50 7.40 2.04 4.07 15.40 3.80 1.30 Typ. Max. 2.70 0.90 0.75 10.80 7.80 2.54 5.08 0016115_F BU900TP Revision history Revision history Table Date 02-Aug-2007 19-Nov-2008 Document revision history Revision First release. Document status changed from preliminary datasheet. Changes BU900TP Please Read Carefully: Information this document provided solely connection with products. STMicroelectronics subsidiaries ("ST") reserve right make changes, corrections, modifications improvements, this document, products services described herein time, without notice. products sold pursuant ST's terms conditions sale. 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Information this document supersedes replaces information previously supplied. logo registered trademark STMicroelectronics. other names property their respective owners. 2008 STMicroelectronics rights reserved STMicroelectronics group companies Australia Belgium Brazil Canada China Czech Republic Finland France Germany Hong Kong India Israel Italy Japan Malaysia Malta Morocco Singapore Spain Sweden Switzerland United Kingdom United States America www.st.com Other recent searchesSP9600 - SP9600 SP9600 Datasheet RMPA2451-58 - RMPA2451-58 RMPA2451-58 Datasheet MIC22950 - MIC22950 MIC22950 Datasheet L5980 - L5980 L5980 Datasheet GURX5D - GURX5D GURX5D Datasheet FSD210 - FSD210 FSD210 Datasheet FSD200 - FSD200 FSD200 Datasheet BM0810-1X1T-06 - BM0810-1X1T-06 BM0810-1X1T-06 Datasheet AM108-603 - AM108-603 AM108-603 Datasheet
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