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High breakdown voltage VCEO Complementary 2STA1695 Typical Fully chara


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2STC4468
High breakdown voltage VCEO Complementary 2STA1695 Typical Fully characterized
Application
Audio power amplifier
TO-3P
Description
device transistor manufactured using BiT-LA (Bipolar transistor linear amplifier) technology. resulting transistor shows good gain linearity behaviour. Recommended high fidelity audio frequency amplifier output stage. Figure Internal schematic diagram
Table
Device summary
Marking 2STC4468 Package TO-3P Packaging Tube
Order code 2STC4468
November 2008
www.st.com
Electrical ratings
2STC4468
Electrical ratings
Table
Symbol VCBO VCEO VEBO Ptot Tstg
Absolute maximum rating
Parameter Collector-base voltage Collector-emitter voltage Emitter-base voltage Collector current Collector peak current Total dissipation Storage temperature Max. operating junction temperature Value Unit
Table
Symbol thj-case
Thermal data
Parameter Thermal resistance junction-case _max Value 1.25 Unit °C/W
2STC4468
Electrical characteristics
Electrical characteristics
(Tcase unless otherwise specified) Table
Symbol ICBO IEBO V(BR)CEO(1) V(BR)CBO V(BR)EBO(1) VCE(sat)(1) CCBO
Electrical characteristics
Parameter Collector cut-off current Emitter cut-off current Test conditions Min. Typ. Max. Unit
Collector-emitter breakdown voltage Collector-base breakdown voltage Emitter-base breakdown voltage Collector-emitter saturation voltage Base-emitter voltage current gain Transition frequency Collector-base capacitance Resistive Load
tstg
Turn-on time Storage time Fall time
0.22
-IB2
Pulse duration duty cycle
Electrical characteristics
2STC4468
Electrical characteristics (curves)
Figure Safe operating area Figure Output characteristics
Figure
current gain
Figure
Collector-emitter saturation voltage
Figure
Base-emitter voltage
Figure
Base-emitter voltage
2STC4468
Electrical characteristics
Test circuit
Figure Resistive load switching test circuit
Fast electronic switch Non-inductive resistor
Package mechanical data
2STC4468
Package mechanical data
order meet environmental requirements, offers these devices ECOPACK® packages. These packages have Lead-free second level interconnect category second level interconnect marked package inner label, compliance with JEDEC Standard JESD97. maximum ratings related soldering conditions also marked inner label. ECOPACK trademark. ECOPACK specifications available www.st.com
2STC4468
Package mechanical data
TO-3P Mechanical data
DIM. MIN. 1.45 1.20 0.80 1.80 2.80 0.55 19.70 15.40 13.60 9.60 5.45 3.50 18.40 3.80 1.50 1.40 MAX. 1.65 1.60 1.20 2.20 3.20 0.75 20.10 15.80
0.60 19.90 13.90
5.15 19.50 18.20 3.10
5.75 20.50 18.60 3.30
Revision history
2STC4468
Revision history
Table
Date 21-May-2007 07-Nov-2008
Document revision history
Revision Initial release. Document status promoted from preliminary data datasheet Changes
2STC4468
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