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4-Channel ultra power GMR-TMR preamplifier applications Feature s


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L6440
4-Channel ultra power GMR-TMR preamplifier applications
Feature summary
Flip Chip package 4-channel configuration Dual Power Supplies +3V, +20% -10% -2.1V, Operating Temperature Range -25°C +85°C Supports xGMR heads from Ohms perpendicular write heads Data Rate 600Mb/s Sleep mode power consumption 200µW Sleep-to-read recovery time 500ns Read mode power consumption 60mW (RMR=250Ohm, Ibias =400µA, NF<2dB) Read Bandwidth (-3dB): 50kHz 450MHz Read Gain selectable from 20dB 38dB Write mode power consumption 600Mb/s measured with single head 100% Write mode duty cycle, 127b PRBS, 40mA, 100mA (0-pk), 500ps (PW50), with Heater Write voltage launched differential Accurate Flying Height Control using voltage power output diodes head protection Differential Current Voltage Bias Voltage Sense architecture Bi-directional 16-bit serial interface 2.5V 3.3V CMOS compatible
Flip Chip (Bumped die) This part specially designed have minimum dissipation modes operation (Sleep <200mW, Read <60mW, Write <200mW) very fast Sleep Read recovery time (S2R <500ns). designed with 4-terminal Giant Magneto Resistance Tunnel Magneto Resistance read Perpendicular write heads. read mode, device consists fully differential amplifier, offering: current voltage bias, voltage-sense input, programmable input impedance, wide-range read gain, low-noise high-bandwidth. write mode, includes fast current switching differential write drivers, which support data rates Mb/s, overshoot amplitude duration programmability. modes operations Height Control circuit available. This circuit delivers accurate programmable voltage power resistive element near write head match write current induced heating subsequent expansion protrusion pole which effect media spacing.
Description
L6440 BICMOS Silicon Germanium monolithic integrated circuit differential preamplifier Ultra Power Hard Disk Drive applications.
part further comprehensive extensive analog/digital measurement scheme read, write, heater heads temperature, extensive fault detection reporting scheme, thermal asperity detection correction, write degauss function.
Order code
Part number L6440 Package Flip Chip (Bumped die) Operating temp. range -25°C +85°C
July 2006
www.st.com
further information contact your local STMicroelectronics sales office.
Revision history
L6440
Revision history
Table
Date 12-Jul-2006
Document revision history
Revision Initial release. Changes
L6440
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