| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
SST37VF512 SST37VF512 0402.7V-Read 512Kb (x8) flash memories
Top Searches for this datasheetKbit Many-Time Programmable Flash SST37VF512 SST37VF512 0402.7V-Read 512Kb (x8) flash memories Data Sheet FEATURES: Organized 128K 256K 512K 2.7-3.6V Read Operation Superior Reliability Endurance: least 1000 Cycles Greater than years Data Retention Power Consumption: Active Current: (typical) Standby Current: (typical) Fast Read Access Time: Latched Address Data Fast Byte-Program Operation: Byte-Program Time: (typical) Chip Program Time: seconds (typical) SST37VF512 Electrical Erase Using Programmer Does require source Chip-Erase Time: (typical) CMOS Compatibility JEDEC Standard Byte-wide Flash EEPROM Pinouts Packages Available 32-lead PLCC 32-lead TSOP (8mm 14mm) 32-pin PDIP Non-Pb (lead-free) packages available PRODUCT DESCRIPTION SST37VF512 device 128K 256K 512K CMOS, Many-Time Programmable (MTP), cost flash, manufactured with SST's proprietary, high performance CMOS SuperFlash technology. split-gate cell design thick-oxide tunneling injector attain better reliability manufacturability compared with alternate approaches. SST37VF512 electrically erased programmed least 1000 times using external programmer, e.g., change contents devices inventory. SST37VF512 erased prior programming. These devices conform JEDEC standard pinouts byte-wide flash memories. Featuring high performance Byte-Program, SST37VF512 provides typical Byte-Program time Designed, manufactured, tested wide spectrum applications, this device offered with endurance least 1000 cycles. Data retention rated greater than years. SST37VF512 suited applications that require infrequent writes power nonvolatile storage. This device will improve flexibility, efficiency, performance while matching cost nonvolatile applications that currently UV-EPROMs, OTPs, mask ROMs. meet surface mount conventional through hole requirements, SST37VF512 offered 32-lead PLCC, 32-lead TSOP 32-pin PDIP packages. Figures assignments. ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Device Operation SST37VF512 device nonvolatile memory solutions that used instead standard flash devices in-system programmability required. functionally (Read) compatible with industry standard flash products.The device supports electrical Erase operation external programmer. Read Read operation SST37VF512 controlled OE#. Both have system obtain data from outputs. Once address stable, address access time equal delay from output (TCE). Data available output after delay from falling edge OE#, assuming been addresses have been stable least TCE-TOE. When high, chip deselected standby current only (typical) consumed. output control used gate data from output pins. data high impedance state when either VIH. Refer Figure timing diagram. Byte-Program Operation SST37VF512 programmed using external programmer. programming mode activated asserting 11.4-12V pin. logo SuperFlash registered trademarks Silicon Storage Technology, Inc. trademark Silicon Storage Technology, Inc. These specifications subject change without notice. Kbit Many-Time Programmable Flash SST37VF512 Data Sheet device programmed using single pulse (WE# low) byte. Using programming algorithm, Byte-Program process continues byte-by-byte until entire chip been programmed. Refer Figure flowchart Figure timing diagram. Product Identification Mode Product Identification mode identifies device SST37VF512 manufacturer SST. This mode accessed hardware method. activate this mode, programming equipment must force (11.412V) address identifier bytes then sequenced from device outputs toggling address line details, Table hardware operation. TABLE Product Identification Address Manufacturer's Device SST37VF512 0001H T1.2 1151(03) Chip-Erase Operation only change data from electrical erase that changes every device "1". SST37VF512 uses electrical Chip-Erase operation. entire chip erased (WE# low). order activate erase mode, 11.4-12V applied pins while low. other address data pins "don't care". falling edge will start Chip-Erase operation. Once chip been erased, bytes must verified FFH. Refer Figure flowchart Figure timing diagram. Data 0000H Design Considerations SST37VF512 should have ceramic high frequency, inductance capacitor connected between GND. This capacitor should placed close package terminals possible. must remain stable entire duration Erase operation. must remain stable entire duration Program operation. X-Decoder SuperFlash Memory Memory Address Address Buffer Y-Decoder Control Logic Buffers 1151 B1.1 FIGURE Functional Block Diagram ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet 32-lead PLCC View 1151 32-plcc P02a EOL.3 FIGURE Assignments 32-lead PLCC Standard Pinout View 1151 32-tsop P01.0 FIGURE Assignments 32-lead TSOP (8mm 14mm) ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet 32-pin PDIP View 1151 32-pdip P02b.1 FIGURE Assignments 32-pin PDIP TABLE Description Symbol AMS1-A0 DQ7-DQ0 Name Address Inputs Data Input/output Chip Enable Write Enable Output Enable Power Supply Ground Connection Unconnected pins. T2.1 1151(03) Functions provide memory addresses. output data during Read cycles receive input data during Program cycles. outputs tri-state when high. activate device when low. program erase (WE# pulse during Program Erase) gate data output buffers during Read operation when provide 3.0V supply (2.7-3.6V) Most significant address SST37VF512 TABLE Operation Modes Selection Mode Read Output Disable Standby Chip-Erase Byte-Program Program/Erase Inhibit Product Identification DOUT High High High High High DOUT Manufacturer's (BFH) Device Address AMS2 A1=VIL, A0=VIL AMS2 A1=VIL, A0=VIH T3.2 1151(03) Device SST37VF512 Most significant address SST37VF512 Note: case 11.4-12V ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet Absolute Maximum Stress Ratings (Applied conditions greater than those listed under "Absolute Maximum Stress Ratings" cause permanent damage device. This stress rating only functional operation device these conditions conditions greater than those defined operational sections this data sheet implied. Exposure absolute maximum stress rating conditions affect device reliability.) Temperature Under Bias -55°C +125°C Storage Temperature -65°C +150°C Voltage Ground Potential -0.5V VDD+0.5V Transient Voltage (<20 Ground Potential -2.0V VDD+2.0V Voltage Ground Potential -0.5V 13.2V Package Power Dissipation Capability 25°C) 1.0W Through Hole Lead Soldering Temperature Seconds) 300°C Surface Mount Solder Reflow Temperature: "with-Pb" units1: 240°C seconds "non-Pb" units: 260°C seconds Output Short Circuit Current2 Certain "with-Pb" package types capable 260°C seconds; please consult factory latest information. Outputs shorted more than second. more than output shorted time. OPERATING RANGE Range Commercial Ambient Temp +70°C 2.7-3.6V CONDITIONS TEST Input Rise/Fall Time Output Load Figures TABLE Read Mode Operating Characteristics VDD=2.7-3.6V +70°C (Commercial)) Limits Symbol Parameter Read Current VIHC Standby Current Input Leakage Current Output Leakage Current Input Voltage Input High Voltage Input High Voltage (CMOS) Output Voltage Output High Voltage Supervoltage Current VDD-0.3 VDD-0.3 Units Test Conditions Address input=VILT/VIHT, f=1/TRC VDD=VDD CE#=VIL, OE#=VIHT, I/Os open CE#=VIHC, VDD=VDD VIN=GND VDD, VDD=VDD VOUT=GND VDD, VDD=VDD VDD=VDD VDD=VDD VDD=VDD IOL=100 VDD=VDD IOH=-100 VDD=VDD CE#=OE#=VIL, A9=VH T4.6 1151(03) ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet TABLE Program/Erase Operating Characteristics VDD=2.7-3.6V 25°C±5°C) Limits Symbol Parameter IHA9 IHOE# Erase Program Current Input Leakage Current Output Leakage Current Supervoltage Supervoltage Current Supervoltage Current 11.4 Units OE#=VH Max, A9=VH Max, VDD=VDD Max, CE#=VIL, OE#=11.4-12V, VDD=VDD Max, WE#=VIL T5.2 1151(03) Test Conditions CE#=VIL, OE#=VH, VDD=VDD Max, WE#=VIL VIN=GND VDD, VDD=VDD VOUT=GND VDD, VDD=VDD TABLE Recommended System Power-up Timings Symbol TPU-READ1 TPU-WRITE Parameter Power-up Read Operation Power-up Write Operation Minimum Units T6.1 1151(03) This parameter measured only initial qualification after design process change that could affect this parameter. TABLE Capacitance 25°C, Mhz, other pins open) Parameter CI/O Description Capacitance Input Capacitance Test Condition VI/O Maximum T7.0 1151(03) CIN1 This parameter measured only initial qualification after design process change that could affect this parameter. TABLE Reliability Characteristics Symbol NEND1 Parameter Endurance Data Retention Latch Minimum Specification 10,000 Units Cycles Years Test Method JEDEC Standard A117 JEDEC Standard A103 JEDEC Standard T8.3 1151(03) ILTH1 This parameter measured only initial qualification after design process change that could affect this parameter. ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet CHARACTERISTICS TABLE Read Cycle Timing Parameters 2.7-3.6V +70°C (Commercial)) SST37VF512-70 Symbol TCLZ1 TOLZ1 TCHZ1 TOHZ1 TOH1 Parameter Read Cycle Time Chip Enable Access Time Address Access Time Output Enable Access Time Active Output Active Output High High-Z Output High High-Z Output Output Hold from Address Change Units T9.3 1151(03) This parameter measured only initial qualification after design process change that could affect this parameter. TABLE Program/Erase Cycle Timing Parameters 2.7-3.6V 25°C±5°C) Symbol TCES TCEH TPRT TVPS TVPH TART TA9S TA9H Parameter Byte-Program Time Setup Time Hold Time Address Setup Time Address Hold Time Data Setup Time Data Hold Time Rise Time Program Erase Setup Time Program Erase Hold Time Program Erase Program Pulse Width Erase Pulse Width OE#/A9 Recovery Time Erase Rise Time during Erase Setup Time during Erase Hold Time during Erase Units T10.1 1151(03) ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet ADDRESS TOLZ TOHZ TCHZ HIGH-Z DATA VALID 1151 F03.0 DQ7-0 HIGH-Z TCLZ DATA VALID FIGURE Read Cycle Timing Diagram ADDRESS (EXCEPT TCEH DQ7-0 TART TA9H TCES 1151 F04.0 TVPS TVPH TPRT TA9S FIGURE Chip-Erase Timing Diagram ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet ADDRESS ADDRESS VALID TCEH DQ7-0 HIGH-Z DATA VALID TVPS TPRT TVPH TCES 1151 F05.0 FIGURE Byte-Program Timing Diagram ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet VIHT INPUT REFERENCE POINTS OUTPUT VILT 1151 F06.1 test inputs driven VIHT (0.9 VDD) logic VILT (0.1 VDD) logic "0". Measurement reference points inputs outputs (0.5 (0.5 VDD). Input rise fall times (10% 90%) Note: VINPUT Test VOUTPUT Test VIHT VINPUT HIGH Test VILT VINPUT Test FIGURE Input/Output Reference Waveforms TESTER 1151 F07.1 FIGURE Test Load Example ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet Start Erase 100ms pulse (WE# VIL) OE#/A9 Wait Recovery Time Read Device Compare bytes Device Passed Device Failed 1151 F08.0 FIGURE Chip-Erase Algorithm ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet Start Erase* Address First Location; Load Data Program pulse (WE# VIL) Increment Address Last Address? Wait Read Device Compare bytes original data Device Passed Device Failed 1151 F09.2 *See Figure FIGURE Byte-Program Algorithm ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet PRODUCT ORDERING INFORMATION XXXX Environmental Attribute non-Pb Package Modifier pins leads Package Type PLCC PDIP TSOP (type 14mm) Operating Temperature Commercial +70°C Minimum Endurance 1,000 cycles Read Access Speed Device Density Kbit Voltage 2.7-3.6V Product Series Many-Time Programmable Flash Flash memories with flash pinout Environmental suffix denotes non-Pb solder. non-Pb solder devices "RoHS Compliant". Valid combinations SST37VF512 SST37VF512-70-3C-NH SST37VF512-70-3C-NHE SST37VF512-70-3C-WH SST37VF512-70-3C-WHE SST37VF512-70-3C-PH Note: Valid combinations those products mass production will mass production. Consult your sales representative confirm availability valid combinations determine availability combinations. ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet PACKAGING DIAGRAMS VIEW Optional Identifier .048 .042 .495 .485 .453 .447 SIDE VIEW .112 .106 .020 MAX. .029 .023 .040 .030 BOTTOM VIEW .042 .048 .595 .553 .585 .547 .032 .026 .021 .013 .400 .530 .490 .050 .015 Min. .050 .095 .075 .140 .125 .032 .026 Note: Complies with JEDEC publication MS-016 dimensions, although some dimensions more stringent. linear dimensions inches (max/min). Dimensions include mold flash. Maximum allowable mold flash .008 inches. Coplanarity: mils. 32-plcc-NH-3 FIGURE 32-lead Plastic Lead Chip Carrier (PLCC) Package Code: ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet Identifier 1.05 0.95 0.50 8.10 7.90 0.27 0.17 12.50 12.30 DETAIL 1.20 max. 0.70 0.50 14.20 13.80 0.15 0.05 0.70 0.50 Note: Complies with JEDEC publication MO-142 dimensions, although some dimensions more stringent. linear dimensions millimeters (max/min). Coplanarity: Maximum allowable mold flash 0.15 package ends, 0.25 between leads. 32-tsop-WH-7 FIGURE 32-lead Thin Small Outline Package (TSOP) 14mm Package Code: ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet Identifier .075 .065 Base Plane Seating Plane 1.655 1.645 PLCS. .200 .170 .625 .600 .550 .530 .050 .015 .100 .150 .120 .012 .008 .600 .080 .070 .065 .045 .022 .016 Note: Complies with JEDEC publication MO-015 dimensions, although some dimensions more stringent. linear dimensions inches (max/min). Dimensions include mold flash. Maximum allowable mold flash .010 inches. 32-pdip-PH-3 FIGURE 32-pin Plastic Dual In-line Pins (PDIP) Package Code: ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Kbit Many-Time Programmable Flash SST37VF512 Data Sheet TABLE Revision History Number Description Date April 2008 Initial release data sheet SST37VF512 valid combinations Recommended replacement SST37VF010 Silicon Storage Technology, Inc. 1171 Sonora Court Sunnyvale, 94086 Telephone 408-735-9110 408-735-9036 www.SuperFlash.com www.sst.com ©2008 Silicon Storage Technology, Inc. S71151(03)-00-EOL 4/08 Other recent searchesVSP1021 - VSP1021 VSP1021 Datasheet SN7486 - SN7486 SN7486 Datasheet SN74LS86A - SN74LS86A SN74LS86A Datasheet SN74S86 - SN74S86 SN74S86 Datasheet SN5486 - SN5486 SN5486 Datasheet SN54LS86A - SN54LS86A SN54LS86A Datasheet SN54S86 - SN54S86 SN54S86 Datasheet SB01W05S - SB01W05S SB01W05S Datasheet NX5504 - NX5504 NX5504 Datasheet NLAS4599 - NLAS4599 NLAS4599 Datasheet MC100EP451 - MC100EP451 MC100EP451 Datasheet IPx60R280C6 - IPx60R280C6 IPx60R280C6 Datasheet AG101 - AG101 AG101 Datasheet
Privacy Policy | Disclaimer |