Am29F010B Known Good Cover Sheet This product been retired recomm

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

Am29F010B Known Good Cover Sheet This product been retired recomm

Datasheet Thumbnail

Top Searches for this datasheet

Am29F010B Known Good
Am29F010B Known Good Cover Sheet
This product been retired recommended designs. Please contact your Spansion representative alternates. Availability this document retained reference historical purposes only.
following document contains information Spansion memory products.
Continuity Specifications
There change this data sheet result offering device Spansion product. changes that have been made result normal data sheet improvement noted document revision summary.
More Information
Please contact your local sales office additional information about Spansion memory solutions.
Publication Number 23479
Revision
Amendment
Issue Date March 2009
Shee
(Retire
duct)
This page left intentionally blank.
Am29F010B Known Good
23479_A3 March 2009
SUPPLEMENT
Am29F010B Known Good
Megabit (128 8-Bit) CMOS Volt-only, Uniform Sector Flash Memory-Die Revision
This product been retired recommended designs. Please contact your Spansion representative alternates. Availability this document retained reference historical purposes only.
DISTINCTIVE CHARACTERISTICS
Single power supply operation read, erase, program operations Simplifies system-level power requirements Manufactured 0.32 process technology Compatible with Am29F010 Am29F010A device High performance maximum access time power consumption typical active read current typical program/erase current typical standby current Flexible sector architecture Eight uniform sectors combination sectors erased Supports full chip erase Sector protection Hardware-based feature that disables/re-enables program erase operations combination sectors Sector protection/unprotection implemented using standard PROM programming equipment Embedded Algorithms Embedded Erase algorithm automatically pre-programs erases chip combination designated sector Embedded Program algorithm automatically programs verifies data specified address Erase Suspend/Resume Supports reading data from sector being erased Minimum 1,000,000 program/erase cycles guaranteed 20-year data retention 125°C Reliable operation life system Compatible with JEDEC standards Pinout software compatible with single-power-supply flash Superior inadvertent write protection Data# Polling Toggle Bits Provides software method detecting program erase cycle completion Tested datasheet specifications temperature Quality reliability levels equivalent standard packaged components
Publication# 22939 Rev: Amendment/3 Issue Date: March 2009
GENERAL DESCRIPTION
Am29F010B Known Good (KGD) form Mbit, Volt-only Flash memory. defines standard product form, tested functionality speed. products have same reliability quality products packaged form. Am29F010B Mbit, Volt-only Flash memory organized 131,072 bytes. Am29F010B offered 32-pin PDIP, PLCC TSOP packages. byte-wide data appears DQ0-DQ7. device designed programmed in-system with standard system Volt supply. 12.0 volt required program erase operations. device also programmed erased standard EPROM programmers. This device manufactured using AMD's 0.32 process technology, offers features benefits Am29F010 Am29F010A. standard device offers access times allowing high-speed microprocessors operate without wait states. eliminate contention device separate chip enable (CE#), write enable (WE#) output enable (OE#) controls. device requires only single volt power supply both read write functions. Internally generated regulated voltages provided program erase operations. device entirely command compatible with JEDEC single-power-supply Flash standard. Commands written command register using standard microprocessor write timings. Register contents serve input internal state machine that controls erase programming circuitry. Write cycles also internally latch addresses data needed programming erase operations. Reading data device similar reading from other Flash EPROM devices. Device programming occurs executing program command sequence. This invokes Embedded Program algorithm-an internal algorithm that automatically times program pulse widths verifies proper cell margin. Device erasure occurs executing erase command sequence. This invokes Embedded Erase algorithm-an internal algorithm that automatically preprograms array already programmed) before executing erase operation. During erase, device automatically times erase pulse widths verifies proper cell margin. host system detect whether program erase operation complete reading (Data# Polling) (toggle) status bits. After program erase cycle been completed, device ready read array data accept another command. sector erase architecture allows memory sectors erased reprogrammed without affecting data contents other sectors. device erased when shipped from factory. hardware data protection measures include detector automatically inhibits write operations during power transitions. hardware sector protection feature disables both program erase operations combination sectors memory, implemented using standard EPROM programmers. system place device into standby mode. Power consumption greatly reduced this mode. AMD's Flash technology combines years Flash memory manufacturing experience produce effectiveness. device electrically erases bits within sector simultaneously Fowler-Nordheim tunneling. bytes programmed byte time using EPROM programming mechanism electron injection.
Electrical Specifications
Refer Am29F010B data sheet, publication number 22336, full electrical specifications Am29F010B form.
Am29F010B Known Good
PRODUCT SELECTOR GUIDE
Family Part Number Speed Option (VCC 10%) Access Time, tACC (ns) Access, (ns) Access, (ns) Am29F010B -120
PHOTOGRAPH
LOCATIONS
logo location
Am29F010B Known Good
DESCRIPTION
Center (mils) Signal 0.00 -6.78 -12.20 -18.03 -23.46 -29.29 -34.72 -41.75 -41.14 -41.30 -35.88 -30.04 -23.81 -17.89 -12.06 -6.40 -0.59 5.25 11.16 17.00 22.92 29.09 35.02 34.68 35.45 29.27 23.34 17.92 12.08 6.66 0.00 0.00 0.00 0.00 0.00 0.00 0.00 -5.01 -116.93 -134.13 -134.13 -134.13 -133.31 -133.31 -133.31 -133.31 -133.31 -133.31 -133.31 -133.31 -133.31 -134.37 -134.13 -116.93 -5.01 -0.25 0.00 0.00 0.00 0.00 0.00 -0.17 -0.31 -0.46 -0.60 -0.74 -0.88 -1.06 -1.04 -1.05 -0.91 -0.76 -0.60 -0.45 -0.31 -0.16 -0.01 0.13 0.28 0.43 0.58 0.74 0.89 0.88 0.90 0.74 0.59 0.46 0.31 0.17 0.00 0.00 0.00 0.00 0.00 0.00 0.00 -0.13 -2.97 -3.41 -3.41 -3.41 -3.39 -3.39 -3.39 -3.39 -3.39 -3.39 -3.39 -3.39 -3.39 -3.41 -3.41 -2.97 -0.13 -0.01 0.00 0.00 0.00 0.00 Center (millimeters)
Note: coordinates above relative center used operate wire bonding equipment.
Am29F010B Known Good
ORDERING INFORMATION Standard Products
products available several packages operating ranges. order number (Valid Combination) formed combination following: Am29F010B
REVISION This number refers specific manufacturing process product technology reflected this document. entered revision field standard product nomenclature. TEMPERATURE RANGE Commercial (0°C +70°C) Industrial (-40°C +85°C) Extended (-55°C +125°C) PACKAGE TYPE MINIMUM ORDER QUANTITY Waffle Pack tray stack Gel-Pak® Tray tray stack Surftape(Tape Reel) 2500 7-inch reel Gel-Pak® Wafer Tray (sawn wafer frame) Call sales office minimum order quantity SPEED OPTION Product Selector Guide Valid Combinations DEVICE NUMBER/DESCRIPTION Am29F010B Known Good Megabit (128 8-Bit) CMOS Flash Memory-Die Revision Volt-only Program Erase
Valid Combinations AM29F010B-90 AM29F010B-120
Valid Combinations Valid Combinations list configurations planned supported volume this device. Consult local sales office confirm availability specific valid combinations check newly released combinations.
Am29F010B Known Good
PACKAGING INFORMATION Surftape Packaging
Direction Feed
logo location
Orientation relative leading edge tape reel
Gel-Pak Waffle Pack Packaging
Orientation relative left corner Gel-Pak Waffle Pack cavity plate
logo location
Am29F010B Known Good
PRODUCT TEST FLOW
Figure provides overview AMD's Known Good test flow. more detailed information, refer Am29F010B product qualification database supplement KGD. implements quality assurance procedures throughout product test flow. addition, off-line quality monitoring program (QMP) further guarantees quality standards Known Good products. These procedures also allow produce products without requiring implementing burn-in.
Wafer Sort
Parameters Functionality Programmability Erasability
Bake hours 250°C
Data Retention
Wafer Sort
Parameters Functionality Programmability Erasability
Wafer Sort High Temperature
Parameters Functionality Programmability Erasability Speed
Packaging Shipment
Incoming Inspection Wafer Separation 100% Visual Inspection Pack
Shipment
Figure
Product Test Flow
Am29F010B Known Good
PHYSICAL SPECIFICATIONS
dimensions mils mils 2.28 4.04 Thickness. mils ~500 Bond Size 4.69 mils 4.69 mils 115.9 115.9 Area Free Passivation .13.96 mils2 9,025 Pads Bond Metalization Al/Cu Backside metal, grounded (optional) Passivation SiN/SOG/SiN
MANUFACTURING INFORMATION
Manufacturing FASL Wafer Sort Test Sunnyvale, .and Penang, Malaysia Manufacturing 98A01 Preparation Shipment Penang, Malaysia Fabrication Process CS39S Revision
SPECIAL HANDLING INSTRUCTIONS
Processing expose products ultraviolet light process them temperatures greater than 250°C. Failure adhere these handling instructions will result irreparable damage devices. best yield, recommends assembly Class clean room with relative humidity. Storage Store maximum temperature 30°C nitrogenpurged cabinet vacuum-sealed bag. Observe standard handling procedures.
OPERATING CONDITIONS
(Supply Voltage) Junction Temperature Under Bias (max) 130°C Read-only (max) 140°C Operating Temperature Commercial +70°C Industrial -40°C +85°C Extended -55°C +125°C
Am29F010B Known Good
TERMS CONDITIONS SALE NON-VOLATILE MEMORY
transactions relating unpackaged under this agreement shall subject AMD's standard terms conditions sale, revisions thereof, which revisions reserves right make time from time time. event conflict between provisions AMD's standard terms conditions sale this agreement, terms this agreement shall controlling. warrants unpackaged manufacture ("Known Good Die" "Die") against defective materials workmanship period year from date shipment. This warranty does extend beyond first purchaser said Die. Buyer assumes full responsibility ensure compliance with appropriate handling, assembly processing Known Good (including limited proper preparation, attach, wire bonding related assembly test activities), compliance with guidelines forth AMD's specifications Known Good Die, assumes responsibility environmental effects Known Good activity Buyer third party that damages improper use, abuse, negligence, improper installation, accident, loss, damage transit, unauthorized repair alteration person entity other than ("Warranty Exclusions"). liability under this warranty limited, AMD's option, solely repair Die, send replacement Die, make appropriate credit adjustment refund amount exceed original purchase price actually paid returned AMD, provided that: promptly notified Buyer writing during applicable warranty period defect nonconformity Known Good Die; Buyer obtains authorization from return defective Die; defective returned Buyer accordance with AMD's shipping instructions forth below; Buyer shows AMD's satisfaction that such alleged defect nonconformity actually exists caused abovereferenced Warranty Exclusions. Buyer shall ship such defective AMD's carrier, collect. Risk loss will transfer when defective provided AMD's carrier. Buyer fails adhere these warranty returns guidelines, Buyer shall assume risk loss shall freight AMD's specified location. aforementioned provisions extend original warranty period Known Good that either been repaired replaced AMD.
WITHOUT LIMITING FOREGOING, EXCEPT EXTENT THAT EXPRESSLY WARRANTS BUYER SEPARATE AGREEMENT SIGNED AMD, MAKES WARRANTY WITH RESPECT DIE'S PROCESSING DATE DATA, SHALL HAVE LIABILITY DAMAGES KIND, UNDER EQUITY, LAW, OTHER THEORY, FAILURE SUCH KNOWN GOOD PROCESS PARTICULAR DATA CONTAINING DATES, INCLUDING DATES AFTER YEAR 2000, WHETHER RECEIVED NOTICE POSSIBILITY SUCH DAMAGES. THIS WARRANTY EXPRESSED LIEU OTHER WARRANTIES, EXPRESSED IMPLIED, INCLUDING IMPLIED WARRANTY FITNESS PARTICULAR PURPOSE, IMPLIED WARRANTY MERCHANTABILITY OTHER OBLIGATIONS LIABILITIES AMD's PART, NEITHER ASSUMES AUTHORIZES OTHER PERSON ASSUME OTHER LIABILITIES. FOREGOING CONSTITUTES BUYER'S SOLE EXCLUSIVE REMEDY FURNISHING DEFECTIVE CONFORMING KNOWN GOOD SHALL EVENT LIABLE INCREASED MANUFACTURING COSTS, DOWNTIME COSTS, DAMAGES RELATING BUYER'S PROCUREMENT SUBSTITUTE (i.e., "COST COVER"), LOSS PROFITS, REVENUES GOODWILL, LOSS DAMAGE ASSOCIATED EQUIPMENT, OTHER INDIRECT, INCIDENTAL, SPECIAL CONSEQUENTIAL DAMAGES REASON FACT THAT SUCH KNOWN GOOD SHALL HAVE BEEN DETERMINED DEFECTIVE CONFORMING. Buyer agrees that will make warranty representations customers which exceed those given Buyer unless until Buyer shall agree indemnify writing claims which exceed AMD's warranty. Known Good designed authorized components life support appliances, devices systems where malfunction reasonably expected result personal injury. Buyer's Known Good life support applications Buyer's risk Buyer agrees fully indemnify damages resulting such sale.
Am29F010B Known Good
REVISION SUMMARY Revision (August 2000)
Physical Specifications Deleted from bond metalization specification.
Revision (March 2009)
Global Added obsolescence information.
Revision (June 2001)
Added Penang, Malaysia, test facility (ACN 2016).
Colophon products described this document designed, developed manufactured contemplated general use, including without limitation, ordinary industrial use, general office use, personal use, household use, designed, developed manufactured contemplated that includes fatal risks dangers that, unless extremely high safety secured, could have serious effect public, could lead directly death, personal injury, severe physical damage other loss (i.e., nuclear reaction control nuclear facility, aircraft flight control, traffic control, mass transport control, medical life support system, missile launch control weapon system), where chance failure intolerable (i.e., submersible repeater artificial satellite). Please note that Spansion will liable and/or third party claims damages arising connection with above-mentioned uses products. semiconductor devices have inherent chance failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. products described this document represent goods technologies subject certain restrictions export under Foreign Exchange Foreign Trade Japan, Export Administration Regulations applicable laws other country, prior authorization respective government entity will required export those products. Trademarks Notice contents this document subject change without notice. This document contain information Spansion product under development Spansion. Spansion reserves right change discontinue work product without notice. information this document provided without warranty guarantee kind accuracy, completeness, operability, fitness particular purpose, merchantability, non-infringement third-party rights, other warranty, express, implied, statutory. Spansion assumes liability damages kind arising information this document. Copyright 2000-2005 Advanced Micro Devices, Inc. rights reserved. AMD, logo, combinations thereof registered trademarks Advanced Micro Devices, Inc. Product names used this publication identification purposes only trademarks their respective companies. Copyright 2006-2009 Spansion Inc. rights reserved. Spansion®, Spansion Logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM, ORNAND2TM, HD-SIMTM, EcoRAMand combinations thereof, trademarks Spansion other countries. Other names used informational purposes only trademarks their respective owners.
Am29F010B Known Good

Am29F010B Known Good Cover Sheet This product been retired recomm

Top Searches for this datasheet

Other recent searches