Megabit 8-Bit) CMOS Volt-only, Sector Erase Flash Memory-Die Revi
|
|
|
Top Searches for this datasheet
Am29F016D Known Good
Megabit 8-Bit)
CMOS Volt-only, Sector Erase Flash Memory-Die Revision
Supplement (Retired Product)
Am29F016D Known Good Cover Sheet
This product been retired recommended designs. Please contact your Spansion representative alternates. Availability this document retained reference historical purposes only.
following document contains information Spansion memory products.
Continuity Specifications
There change this data sheet result offering device Spansion product. changes that have been made result normal data sheet improvement noted document revision summary.
More Information
Please contact your local sales office additional information about Spansion memory solutions.
Publication Number 26244
Revision
Amendment
Issue Date March 2009
This page left intentionally blank.
Am29F016D Known Good
26244_A4 March 2009
SUPPLEMENT
Am29F016D Known Good
Megabit 8-Bit) CMOS Volt-only, Sector Erase Flash Memory-Die Revision
This product been retired recommended designs. Please contact your Spansion representative alternates. Availability this document retained reference historical purposes only.
DISTINCTIVE CHARACTERISTICS
10%, single power supply operation Minimizes system level power requirements Manufactured 0.23 process technology High performance access time power consumption typical active read current typical program/erase current typical standby current (standard access time active mode) Flexible sector architecture uniform sectors Kbytes each combination sectors erased. Supports full chip erase Group sector protection: hardware method locking sector groups prevent program erase operations within that sector group Temporary Sector Group Unprotect allows code changes previously locked sectors Embedded Algorithms Embedded Erase algorithm automatically preprograms erases entire chip combination designated sectors Embedded Program algorithm automatically writes verifies bytes specified addresses Minimum million erase cycles guaranteed Compatible with JEDEC standards Pinout software compatible with single-power-supply Flash standard Superior inadvertent write protection Data# Polling toggle bits Provides software method detecting program erase cycle completion Ready/Busy output (RY/BY#) Provides hardware method detecting program erase cycle completion Erase Suspend/Resume Suspends sector erase operation read data from, program data non-erasing sector, then resumes erase operation Hardware reset (RESET#) Resets internal state machine read mode Tested datasheet specifications temperature Quality reliability levels equivalent standard packaged components 20-year data retention 125°C
Publication# 26244 Rev: Amendment: Issue Date: March 2009
GENERAL DESCRIPTION
Am29F016D Known Good (KGD) form Mbit, volt-only Flash memory. defines standard product form, tested functionality speed. products have same reliability quality products packaged form. sector erase architecture allows memory sectors erased reprogrammed without affecting data contents other sectors. sector typically erased verified within second. device erased when shipped from factory. hardware sector group protection feature disables both program erase operations combination eight sector groups memory. sector group consists four adjacent sectors. Erase Suspend feature enables system erase hold period time read data from, program data sector that being erased. True background erase thus achieved. device requires only single volt power supply both read write functions. Internally generated regulated voltages provided program erase operations. detector automatically inhibits write operations during power transitions. host system detect whether program erase cycle complete using RY/BY# pin, (Data# Polling) (toggle) status bits. After program erase cycle been completed, device automatically returns read mode. hardware RESET# terminates operation progress. internal state machine reset read mode. RESET# tied system reset circuitry. Therefore, system reset occurs during either Embedded Program Embedded Erase algorithm, device automatically reset read mode. This enables system's microprocessor read boot-up firmware from Flash memory. AMD's Flash technology combines years Flash memory manufacturing experience produce effectiveness. device electrically erases bits within sector simultaneously Fowler-Nordheim tunneling. bytes programmed byte time using EPROM programming mechanism electron injection.
Am29F016D Features
Am29F016D Mbit, volt-only Flash memory organized 2,097,152 bytes bits each. Mbytes data divided into sectors Kbytes each flexible erase capability. bits data appear DQ0-DQ7. Am29F016D manufactured using AMD's 0.32 process technology. This device designed programmed in-system with standard system volt supply. 12.0 volt required program erase operations. device also programmed standard EPROM programmers. standard device offers access time allowing high-speed microprocessors operate without wait states. eliminate contention, device separate chip enable (CE#), write enable (WE#), output enable (OE#) controls. device entirely command compatible with JEDEC single-power-supply Flash standard. Commands written command register using standard microprocessor write timings. Register contents serve input internal state machine that controls erase programming circuitry. Write cycles also internally latch addresses data needed programming erase operations. Reading data device similar reading from 12.0 volt Flash EPROM devices. device programmed executing program command sequence. This invokes Embedded Program algorithm-an internal algorithm that automatically times program pulse widths verifies proper cell margin. device erased executing erase command sequence. This invokes Embedded Erase algorithm-an internal algorithm that automatically preprograms array already programmed) before executing erase operation. During erase, device automatically times erase pulse widths verifies proper cell margin.
Electrical Specifications
Refer Am29F016D data sheet, publication number 21444, full electrical specifications Am29F016D form.
PRODUCT SELECTOR GUIDE
Family Part Number Speed Option (VCC 10%) Access Time, tACC (ns) Access, (ns) Access, (ns) Am29F016D -120
March 2009 26244A4
Am29F016D Known Good
PHOTOGRAPH
LOCATIONS
logo location
Am29F016D Known Good
26244A4 March 2009
DESCRIPTION (RELATIVE CENTER)
Signal RESET# RY/BY# Center (mils) 31.30 90.86 -32.75 94.54 -42.74 90.77 -48.89 90.77 -55.27 90.77 -61.10 90.77 -67.48 90.77 -73.63 90.77 -80.01 90.77 -86.16 90.77 -85.72 -90.77 -79.88 -90.77 -74.42 -90.77 -68.59 -90.77 -58.60 -95.09 -47.60 -95.09 -34.33 -95.09 -23.34 -95.09 -14.38 -94.83 -8.96 -94.83 -3.54 -95.03 16.33 -95.09 27.32 -95.09 40.59 -95.09 51.59 -95.09 62.06 -90.77 72.14 -90.77 79.49 -90.77 85.87 -90.77 82.54 90.77 76.71 90.77 71.25 90.77 65.41 90.77 59.95 90.77 54.12 90.77 48.66 90.77 42.82 90.77 37.36 90.77 Center (millimeters) 0.80 2.31 -0.83 2.40 -1.09 2.31 -1.24 2.31 -1.40 2.31 -1.55 2.31 -1.71 2.31 -1.87 2.31 -2.03 2.31 -2.19 2.31 -2.18 -2.31 -2.03 -2.31 -1.89 -2.31 -1.74 -2.31 -1.49 -2.42 -1.21 -2.42 -0.87 -2.42 -0.59 -2.42 -0.37 -2.41 -0.23 -2.41 -0.09 -2.41 0.41 -2.42 0.69 -2.42 1.03 -2.42 1.31 -2.42 1.58 -2.31 1.83 -2.31 2.02 -2.31 2.18 -2.31 2.10 2.31 1.95 2.31 1.81 2.31 1.66 2.31 1.52 2.31 1.37 2.31 1.24 2.31 1.09 2.31 0.95 2.31
Note: coordinates above relative center used operate wire bonding equipment.
March 2009 26244A4
Am29F016D Known Good
DESCRIPTION (RELATIVE VCC)
Signal RESET# RY/BY# Center (mils) 0.00 -64.05 -74.04 -80.19 -86.57 -92.41 -98.79 -104.94 -111.32 -117.47 -117.02 -111.19 -105.73 -99.89 -89.90 -78.91 -65.64 -54.64 -45.69 -40.26 -34.84 -14.98 -3.98 9.29 20.28 30.75 40.84 48.19 54.57 51.24 45.41 39.94 34.11 28.65 22.81 17.35 11.52 6.06 0.00 3.68 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -181.63 -181.63 -181.63 -181.63 -185.96 -185.96 -185.96 -185.96 -185.69 -185.69 -185.89 -185.96 -185.96 -185.96 -185.96 -181.63 -181.63 -181.63 -181.63 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 -0.09 Center (millimeters) 0.00 0.00 -1.63 0.09 -1.88 0.00 -2.04 0.00 -2.20 0.00 -2.35 0.00 -2.51 0.00 -2.67 0.00 -2.83 0.00 -2.98 0.00 -2.97 -4.61 -2.82 -4.61 -2.69 -4.61 -2.54 -4.61 -2.28 -4.72 -2.00 -4.72 -1.67 -4.72 -1.39 -4.72 -1.16 -4.72 -1.02 -4.72 -0.88 -4.72 -0.38 -4.72 -0.10 -4.72 0.24 -4.72 0.52 -4.72 0.78 -4.61 1.04 -4.61 1.22 -4.61 1.39 -4.61 1.30 0.00 1.15 0.00 1.01 0.00 0.87 0.00 0.73 0.00 0.58 0.00 0.44 0.00 0.29 0.00 0.15 0.00
Note: coordinates above relative center used operate wire bonding equipment.
Am29F016D Known Good
26244A4 March 2009
ORDERING INFORMATION Standard Products
standard products available several packages operating ranges. order number (Valid Combination) formed combination following: Am29F016D -120
REVISION This number refers specific manufacturing process product technology reflected this document. entered revision field standard product nomenclature. TEMPERATURE RANGE Commercial (0°C +70°C) Industrial (-40°C +85°C) PACKAGE TYPE MINIMUM ORDER QUANTITY Waffle Pack thickness, tray stack Waffle Pack thickness, tray stack Surftape(Tape Reel) thickness, 2500 7-inch reel Surftape(Tape Reel) thickness, 2500 7-inch reel Wafer Jar, thickness Wafer Jar, thickness SPEED OPTION Product Selector Guide Valid Combinations DEVICE NUMBER/DESCRIPTION Am29F016D Known Good Megabit 8-Bit) CMOS Flash Memory-Die Revision Volt-only Program Erase
Valid Combinations
Valid Combinations list configurations planned supported volume this device. Consult local sales office confirm availability specific valid combinations check newly released combinations.
Valid Combinations
AM29F016D-120
March 2009 26244A4
Am29F016D Known Good
PACKAGING INFORMATION Surftape Packaging
Direction Feed
Orientation relative leading edge tape reel
logo location
Waffle Pack Packaging
Orientation relative left corner Waffle Pack cavity plate
logo location
Am29F016D Known Good
26244A4 March 2009
PRODUCT TEST FLOW
Figure provides overview AMD's Known Good test flow. more detailed information, refer Am29F016D product qualification database supplement KGD. implements quality assurance procedures throughout product test flow. addition, off-line quality monitoring program (QMP) further guarantees quality standards Known Good products. These procedures also allow produce products without requiring implementing burn-in.
Wafer Sort
Parameters Functionality Programmability Erasability
Bake hours 250°C
Data Retention
Wafer Sort
Parameters Functionality Programmability Erasability
Wafer Sort High Temperature
Parameters Functionality Programmability Erasability Speed
Packaging Shipment
Incoming Inspection Wafer Separation 100% Visual Inspection Pack
Shipment
Figure
Product Test Flow
March 2009 26244A4
Am29F016D Known Good
PHYSICAL SPECIFICATIONS
Dimensions, 186.61 mils 208.66 mils 4.74 5.30 Thickness. mils mils Bond Size 3.52 mils 3.52 mils 89.3 89.3 Area Free Passivation .15.52 mils2 10,000 Pads Bond Metalization Al/Cu/Si Backside metal, grounded (optional) Passivation Nitride/SOG/Nitride
MANUFACTURING INFORMATION
Manufacturing FASL Wafer Sort Test Sunnyvale, .and Penang, Malaysia Manufacturing 98J32AK Preparation Shipment Penang, Malaysia Fabrication Process CS49HS Revision
SPECIAL HANDLING INSTRUCTIONS
Processing expose products ultraviolet light process them temperatures greater than 250°C. Failure adhere these handling instructions will result irreparable damage devices. best yield, recommends assembly Class clean room with relative humidity. Storage Store maximum temperature 30°C nitrogenpurged cabinet vacuum-sealed bag. Observe standard handling procedures.
OPERATING CONDITIONS
(Supply Voltage) Junction Temperature Under Bias (max) 130°C Operating Temperature Commercial +70°C Industrial -40°C +85°C
Am29F016D Known Good
26244A4 March 2009
TERMS CONDITIONS SALE NON-VOLATILE MEMORY
transactions relating unpackaged under this agreement shall subject AMD's standard terms conditions sale, revisions thereof, which revisions reserves right make time from time time. event conflict between provisions AMD's standard terms conditions sale this agreement, terms this agreement shall controlling. warrants unpackaged manufacture ("Known Good Die" "Die") against defective materials workmanship period year from date shipment. This warranty does extend beyond first purchaser said Die. Buyer assumes full responsibility ensure compliance with appropriate handling, assembly processing Known Good (including limited proper preparation, attach, wire bonding related assembly test activities), compliance with guidelines forth AMD's specifications Known Good Die, assumes responsibility environmental effects Known Good activity Buyer third party that damages improper use, abuse, negligence, improper installation, accident, loss, damage transit, unauthorized repair alteration person entity other than ("Warranty Exclusions"). liability under this warranty limited, AMD's option, solely repair Die, send replacement Die, make appropriate credit adjustment refund amount exceed original purchase price actually paid returned AMD, provided that: promptly notified Buyer writing during applicable warranty period defect nonconformity Known Good Die; Buyer obtains authorization from return defective Die; defective returned Buyer accordance with AMD's shipping instructions forth below; Buyer shows AMD's satisfaction that such alleged defect nonconformity actually exists caused abovereferenced Warranty Exclusions. Buyer shall ship such defective AMD's carrier, collect. Risk loss will transfer when defective provided AMD's carrier. Buyer fails adhere these warranty returns guidelines, Buyer shall assume risk loss shall freight AMD's specified location. aforementioned provisions extend original warranty period Known Good that either been repaired replaced AMD. WITHOUT LIMITING FOREGOING, EXCEPT EXTENT THAT EXPRESSLY WARRANTS BUYER SEPARATE AGREEMENT SIGNED AMD, MAKES WARRANTY WITH RESPECT DIE'S PROCESSING DATE
DATA, SHALL HAVE LIABILITY DAMAGES KIND, UNDER EQUITY, LAW, OTHER THEORY, FAILURE SUCH KNOWN GOOD PROCESS PARTICULAR DATA CONTAINING DATES, INCLUDING DATES AFTER YEAR 2000, WHETHER RECEIVED NOTICE POSSIBILITY SUCH DAMAGES. THIS WARRANTY EXPRESSED LIEU OTHER WARRANTIES, EXPRESSED IMPLIED, INCLUDING IMPLIED WARRANTY FITNESS PARTICULAR PURPOSE, IMPLIED WARRANTY MERCHANTABILITY OTHER OBLIGATIONS LIABILITIES AMD's PART, NEITHER ASSUMES AUTHORIZES OTHER PERSON ASSUME OTHER LIABILITIES. FOREGOING CONSTITUTES BUYER'S SOLE EXCLUSIVE REMEDY FURNISHING DEFECTIVE CONFORMING KNOWN GOOD SHALL EVENT LIABLE INCREASED MANUFACTURING COSTS, DOWNTIME COSTS, DAMAGES RELATING BUYER'S PROCUREMENT SUBSTITUTE (i.e., "COST COVER"), LOSS PROFITS, REVENUES GOODWILL, LOSS DAMAGE ASSOCIATED EQUIPMENT, OTHER INDIRECT, INCIDENTAL, SPECIAL CONSEQUENTIAL DAMAGES REASON FACT THAT SUCH KNOWN GOOD SHALL HAVE BEEN DETERMINED DEFECTIVE CONFORMING. Buyer agrees that will make warranty representations customers which exceed those given Buyer unless until Buyer shall agree indemnify writing claims which exceed AMD's warranty. Known Good designed authorized components life support appliances, devices systems where malfunction reasonably expected result personal injury. Buyer's Known Good life support applications Buyer's risk Buyer agrees fully indemnify damages resulting such sale.
March 2009 26244A4
Am29F016D Known Good
REVISION SUMMARY Revision (April 2002)
Initial release. Physical Specifications Added dimensions.
Revision (June 2002)
Ordering Information Deleted wafer tray from packaging type options. Manufacturing Information Corrected manufacturing Added Sunnyvale, wafer sort test locations.
Revision (July 2007)
Ordering Information Moved Valid Combination text table
Revision (March 2009)
Global Added obsolescence information.
Revision (May 2007)
Ordering Information Deleted tray from ordering options. Added options wafer options.
Colophon products described this document designed, developed manufactured contemplated general use, including without limitation, ordinary industrial use, general office use, personal use, household use, designed, developed manufactured contemplated that includes fatal risks dangers that, unless extremely high safety secured, could have serious effect public, could lead directly death, personal injury, severe physical damage other loss (i.e., nuclear reaction control nuclear facility, aircraft flight control, traffic control, mass transport control, medical life support system, missile launch control weapon system), where chance failure intolerable (i.e., submersible repeater artificial satellite). Please note that Spansion will liable and/or third party claims damages arising connection with above-mentioned uses products. semiconductor devices have inherent chance failure. must protect against injury, damage loss from such failures incorporating safety design measures into your facility equipment such redundancy, fire protection, prevention over-current levels other abnormal operating conditions. products described this document represent goods technologies subject certain restrictions export under Foreign Exchange Foreign Trade Japan, Export Administration Regulations applicable laws other country, prior authorization respective government entity will required export those products. Trademarks Notice contents this document subject change without notice. This document contain information Spansion product under development Spansion. Spansion reserves right change discontinue work product without notice. information this document provided without warranty guarantee kind accuracy, completeness, operability, fitness particular purpose, merchantability, non-infringement third-party rights, other warranty, express, implied, statutory. Spansion assumes liability damages kind arising information this document. Copyright 2002-2005 Advanced Micro Devices, Inc. rights reserved. AMD, logo, combinations thereof registered trademarks Advanced Micro Devices, Inc. Product names used this publication identification purposes only trademarks their respective companies. Copyright 2006-2009 Spansion Inc. rights reserved. Spansion®, Spansion Logo, MirrorBit®, MirrorBit® EclipseTM, ORNANDTM, ORNAND2TM, HD-SIMTM, EcoRAMand combinations thereof, trademarks Spansion other countries. Other names used informational purposes only trademarks their respective owners.
Am29F016D Known Good
26244A4 March 2009
Other recent searches
ZXGD3101T8 - ZXGD3101T8 ZXGD3101T8 Datasheet
TLP363J - TLP363J TLP363J Datasheet
SB5312-H - SB5312-H SB5312-H Datasheet
MTP9435Q8 - MTP9435Q8 MTP9435Q8 Datasheet
DS50PCI401EVK - DS50PCI401EVK DS50PCI401EVK Datasheet
1981380000 - 1981380000 1981380000 Datasheet
Privacy Policy | Disclaimer
© 2012 Datasheet Archive
