Date Title 10038 February 2006 Status Type Final Produc

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Date Title 10038 February 2006 Status Type Final Produc

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Date Title
10038 February 2006
Status Type
Final Product Change
Planned Product Change: STK14D88 256K nvSRAM change design revision from Customers hereby notified number planned changes STK14D88 256K nvSRAM. Detail changes given page this PCN. These changes planned take effect early 2006. These changes have already been referenced Simtek PCN10021 [Aug PCN10029 [Nov 05]. Availability product planned follows: Fully screened characterized samples week March 2006 Pre-Qual production limited quantities week April 2006 Production quantities will available ship upon completion full qualification, planned week April 2006, subject prior receipt customer order within agreed upon lead times.
Detail
Background Reason Change Issue Addresed
These changes being made improve overall field performance product increase 25ns distribution meet customer demand, improve performance packages. changes will made current datasheet specifications. revision product will marked topside package. This revision change reflects direct alignment with Simtek nvSRAM process design.
Product[s] Affected
STK14D88 256K nvSRAM SOIC SSOP package types.
Additional Information Respond
further information please contact Simtek Applications Engineering appseng@simtek.com. Requests samples evaluation should made through normal Simtek sales channels.
Samples Available From Target Product Availability Date Confirmed Availability Date/Datecode
March 2006 Early April 2006
Brian Stephens
Date:
Additional Information [continued from Page
10038
February 2006
Customers hereby notified number planned changes STK14D88 256K nvSRAM. These changes planned take effect early 2006. These changes have already been referenced Simtek PCN10021 [Aug PCN10029 [Nov 05]. Changes product: Improve startup circuitry allow faster power ramp rates; Implement more robust power-up recall soft recall algorithm; Optimize SONOS process steps improve process yield; Implement number SRAM timing changes allow more 25ns distribution. Changes Package Materials Simtek been evaluating Sumitomo G600 "Green" mold compound Ablestik 8290 epoxy attach paste more suitable material 260C JEDEC-020C peak reflow temperature requirement these packages. This material will replace original Nitto MP8000-AN mold compound Ablestik 84-1 LMISR4 Simtek products with Sn/Pb Matte termination plating. Full characterization associated reliability testing samples with moisture reflow preconditioning will completed time qualification release, qualification data reports will available from Simtek. Preliminary results indicate rating MSL3 260C peak reflow temperature both package types. package types affected are: Package "N", SOIC, gull wing Package "R", SSOP, gull wing Customers whose internal qualification procedures allow consider this direct Form/Fit/Function replacement previous revision this product.
Datasheet Changes
changes will made currently published datasheet available Simtek website www.simtek.com.

Date Title 10038 February 2006 Status Type Final Produc

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