Compact, high performance power notebook desktop graphics cards server

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Compact, high performance power notebook desktop graphics cards server

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LFPAK MOSFETs computing applications
Compact, high performance power notebook desktop graphics cards servers
Part ever expanding portfolio that combines innovative packaging TrenchMOS technologies NXP's latest MOSFETs offer excellent power performance compact, thermally enhanced LFPAK package. Ideal applications, these high-efficiency devices deliver improved power density thermal performance along with on-resistance.
features compatible footprint enables replacement standard devices Very thermal resistance, equivalent DPAK profile compact size optimises space Conventional surface mount leads allow optical inspection solder joints inductance benefits DPAK performance size package Increased efficiency Enables higher power densities Faster switching Improved thermal performance means cooler running applications applications Notebook Desktop Motherboard High efficiency system power supplies Graphic card DC-DC converters innovative SOT669 LFPAK (Loss Free PAcKage) enables superior level on-resistance thermal performance extremely compact housing. When combined with NXP's advanced TrenchMOS technology, this innovative packaging solution delivers compact power many applications previously limited large discrete power packages. NXP's SOT669 LFPAK offers outstanding thermal performance from compact footprint SO8. allows heat dissipated more easily, maintaining lowest possible operating temperatures. Furthermore, LFPAK extremely profile thick thinner than SO8. innovative internal construction enables inductance considerably lower than comparable packages. traditional power package main thermal pathway vertically down through mounting into PCB. However, LFPAK also dissipates significant amount power upwards through package, giving thermal resistance significantly lower than comparable with much larger packages such DPAK.
LFPAK (SOT669) applications applications such VRMs power supplies notebook desktop PCs, NXP's LFPAK delivers higher efficiencies component densities essential today's DC/DC converters. Typically these applications operate switching frequencies 200KHz 500KHz support input voltages with output currents phase. LFPAK offers market-leading performance high-side (control FET) position capable both gate drive voltage (VGS) operation. addition, significantly reduces board space requirements. This clearly highlighted high current applications where LFPAK reduce number required devices, thermal characteristics minimal switching losses. LFPAK been specially developed handle power demands today's high performance graphics cards. With ever-increasing power requirements from graphics processor unit memory, either auxiliary power connector from `silver box' used, power rail Express interface. LFPAK used both configurations been proven more efficient typical currents supply voltages than rival SO8-housed devices with similar on-state resistance.
Part Number
PH2525L PH4025L PH5525L PH9025L PH2030AL PH2530L PH3330L PH4330L PH4830L PH8030L PH6030L PH6530AL PH9030L PH9930L
RDS(ON)
Vgs=4.5V 13.0 12.5 13.5
(nC)
17.8
Types black bold represent products Types represent products development
Single phase DC-DC converter
VdriveHS
BAT754C CBoot
Gate drive e.g. ISL6609
VdriveLS
GATE DRIVE
Vout
Cout
bra167
www.nxp.com
2008 B.V. rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights. Date release: April 2008 Document order number: 9397 16506 Printed Netherlands

Compact, high performance power notebook desktop graphics cards server

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