M3D088 PMBD6050 High-speed diode Product specification Super

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M3D088 PMBD6050 High-speed diode Product specification Super

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book, halfpage
M3D088
PMBD6050 High-speed diode
Product specification Supersedes data 1999 2004
Philips Semiconductors
Product specification
High-speed diode
FEATURES Small plastic package High switching speed: max. Continuous reverse voltage: max. Repetitive peak reverse voltage: max. Repetitive peak forward current: max. APPLICATIONS High-speed switching thick thin-film circuits. DESCRIPTION PMBD6050 high-speed switching diode fabricated planar technology, encapsulated small SOT23 plastic package. MARKING
PMBD6050
PINNING anode connected cathode DESCRIPTION
handbook, halfpage
n.c.
MAM185
TYPE NUMBER PMBD6050 Note Made Hong Kong. Made Malaysia. Made China. ORDERING INFORMATION TYPE NUMBER PMBD6050
MARKING CODE(1)
Fig.1 Simplified outline (SOT23) symbol.
PACKAGE NAME DESCRIPTION plastic surface mounted package; leads VERSION SOT23
2004
Philips Semiconductors
Product specification
High-speed diode
LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 60134). SYMBOL VRRM IFRM IFSM PARAMETER repetitive peak reverse voltage continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current square wave; prior surge; Fig.4 t=1s Ptot Tstg Note Device mounted printed-circuit board. total power dissipation storage temperature junction temperature Tamb note note Fig.2 CONDITIONS MIN.
PMBD6050
MAX.
UNIT
+150
2004
Philips Semiconductors
Product specification
High-speed diode
ELECTRICAL CHARACTERISTICS unless otherwise specified. SYMBOL PARAMETER forward voltage Fig.3 reverse current Fig.5 diode capacitance reverse recovery time MHz; Fig.6 1.25 CONDITIONS MAX.
PMBD6050
UNIT
when switched from measured Fig.7 when switched from Fig.8 1.75
forward recovery voltage
THERMAL CHARACTERISTICS SYMBOL Rth(j-tp) Rth(j-a) Note Device mounted printed-circuit board. PARAMETER thermal resistance from junction tie-point thermal resistance from junction ambient note CONDITIONS VALUE UNIT
2004
Philips Semiconductors
Product specification
High-speed diode
GRAPHICAL DATA
PMBD6050
MSA562
(mA)
handbook, halfpage
MBG382
(mA)
Tamb (oC)
Device mounted printed-circuit board.
typical values. typical values. maximum values.
Fig.2
Maximum permissible continuous forward current function ambient temperature.
Fig.3
Forward current function forward voltage.
handbook, full pagewidth IFSM
MBG704
10-1 Based square wave currents. prior surge.
(µs)
Fig.4 Maximum permissible non-repetitive peak forward current function pulse duration.
2004
Philips Semiconductors
Product specification
High-speed diode
PMBD6050
handbook, halfpage (µA)
MBG379
handbook, halfpage
MBG446
(pF)
(oC)
maximum values. typical values. typical values.
MHz;
Fig.5
Reverse current function junction temperature.
Fig.6
Diode capacitance function reverse voltage; typical values.
handbook, full pagewidth
D.U.T. SAMPLING OSCILLOSCOPE
MGA881
input signal
output signal
Fig.7 Reverse recovery voltage test circuit waveforms.
2004
Philips Semiconductors
Product specification
High-speed diode
PMBD6050
D.U.T.
OSCILLOSCOPE
MGA882
input signal
output signal
Fig.8 Forward recovery voltage test circuit waveforms.
2004
Philips Semiconductors
Product specification
High-speed diode
PACKAGE OUTLINE
Plastic surface mounted package; leads
PMBD6050
SOT23
detail
scale
DIMENSIONS original dimensions) UNIT max. 0.48 0.38 0.15 0.09 0.95 0.45 0.15 0.55 0.45
OUTLINE VERSION SOT23
REFERENCES JEDEC TO-236AB EIAJ
EUROPEAN PROJECTION
ISSUE DATE 97-02-28 99-09-13
2004
Philips Semiconductors
Product specification
High-speed diode
DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
PMBD6050
This data sheet contains data from objective specification product development. Philips Semiconductors reserves right change specification manner without notice. This data sheet contains data from preliminary specification. Supplementary data will published later date. Philips Semiconductors reserves right change specification without notice, order improve design supply best possible product. This data sheet contains data from product specification. Philips Semiconductors reserves right make changes time order improve design, manufacturing supply. Relevant changes will communicated Customer Product/Process Change Notification (CPCN).
Preliminary data Qualification
Product data
Production
Notes Please consult most recently issued data sheet before initiating completing design. product status device(s) described this data sheet have changed since this data sheet published. latest information available Internet data sheets describing multiple type numbers, highest-level product status determines data sheet status. DEFINITIONS Short-form specification data short-form specification extracted from full data sheet with same type number title. detailed information relevant data sheet data handbook. Limiting values definition Limiting values given accordance with Absolute Maximum Rating System (IEC 60134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Applications that described herein these products illustrative purposes only. Philips Semiconductors make representation warranty that such applications will suitable specified without further testing modification. DISCLAIMERS Life support applications These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips Semiconductors customers using selling these products such applications their risk agree fully indemnify Philips Semiconductors damages resulting from such application. Right make changes Philips Semiconductors reserves right make changes products including circuits, standard cells, and/or software described contained herein order improve design and/or performance. When product full production (status `Production'), relevant changes will communicated Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes responsibility liability these products, conveys licence title under patent, copyright, mask work right these products, makes representations warranties that these products free from patent, copyright, mask work right infringement, unless otherwise specified.
2004
Philips Semiconductors worldwide company
Contact information additional information please visit Fax: 24825 sales offices addresses send e-mail
Koninklijke Philips Electronics N.V. 2004
SCA76
rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
R76/04/pp10
Date release: 2004
Document order number:
9397 12447

M3D088 PMBD6050 High-speed diode Product specification Super

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