Rev. January 2009 Product data sheet General description VCE

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Rev. January 2009 Product data sheet General description VCE

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PBLS4001D
Rev. January 2009 Product data sheet
General description
VCEsat Breakthrough Small Signal (BISS) transistor ResistorEquipped Transistor (RET) SOT457 (SC-74) small Surface-Mounted Device (SMD) plastic package.
Features
VCEsat (BISS) resistor-equipped transistor package threshold voltage compared MOSFET drive power required Space-saving solution Reduction component count
Applications
Supply line switches Battery charger switches High-side switches LEDs, drivers backlights Portable equipment
Quick reference data
Table Symbol VCEO RCEsat Quick reference data Parameter collector-emitter voltage collector current collector-emitter saturation resistance collector-emitter voltage output current bias resistor (input) bias resistor ratio -500 open base Conditions open base
Unit
TR1; VCEsat transistor
TR2; resistor-equipped transistor VCEO R2/R1
1.54
2.86
Device mounted ceramic Printed-Circuit Board (PCB), Al2O3, standard footprint. Pulse test: 0.02.
Semiconductors
PBLS4001D
Pinning information
Table Pinning Description emitter base output (collector) (emitter) input (base) collector
sym036
Simplified outline
Graphic symbol
Ordering information
Table Ordering information Package Name PBLS4001D SC-74 Description plastic surface-mounted package (TSOP6); leads Version SOT457 Type number
Marking
Table Marking codes Marking code Type number PBLS4001D
Limiting values
Table Limiting values accordance with Absolute Maximum Rating System (IEC 60134). Symbol VCBO VCEO VEBO Parameter collector-base voltage collector-emitter voltage emitter-base voltage collector current Conditions open emitter open base open collector
-0.7 -0.85 -0.3
Unit
TR1; VCEsat transistor
peak collector current base current peak base current
single pulse; single pulse;
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
Table Limiting values .continued accordance with Absolute Maximum Rating System (IEC 60134). Symbol Ptot Parameter total power dissipation Conditions Tamb
+150 +150
Unit
TR2; resistor-equipped transistor VCBO VCEO VEBO collector-base voltage collector-emitter voltage emitter-base voltage input voltage positive negative Ptot Ptot output current peak collector current total power dissipation total power dissipation single pulse; Tamb
open emitter open base open collector
device
Tamb Tstg
junction temperature ambient temperature storage temperature
Device mounted PCB, single-sided copper, tin-plated standard footprint. Device mounted PCB, single-sided copper, tin-plated, mounting collector cm2. Device mounted ceramic PCB, Al2O3, standard footprint.
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
Ptot
006aaa461
Tamb (°C)
Ceramic PCB, Al2O3, standard footprint PCB, mounting collector PCB, standard footprint
Power derating curves
Thermal characteristics
Table Symbol device Rth(j-a) thermal resistance from junction ambient free
Thermal characteristics Parameter Conditions Unit
TR1; VCEsat transistor Rth(j-sp)
thermal resistance from junction solder point
Device mounted PCB, single-sided copper, tin-plated standard footprint. Device mounted PCB, single-sided copper, tin-plated, mounting collector cm2. Device mounted ceramic PCB, Al2O3, standard footprint.
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
Zth(j-a) (K/W) 0.75 0.33 0.05 0.02 0.01
006aaa462
10-1 10-5
10-4
10-3
10-2
10-1
PCB, standard footprint
(PNP): Transient thermal impedance from junction ambient function pulse duration; typical values
006aaa463
Zth(j-a) (K/W) 0.75 0.33 0.05 0.02 0.01 10-5 10-4 10-3 10-2 10-1
PCB, mounting collector
(PNP): Transient thermal impedance from junction ambient function pulse duration; typical values
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
Zth(j-a) (K/W) 0.75 0.33 0.05 0.02 0.01 10-5
006aaa464
10-4
10-3
10-2
10-1
Ceramic PCB, Al2O3, standard footprint
(PNP): Transient thermal impedance from junction ambient function pulse duration; typical values
Characteristics
Table Characteristics Tamb unless otherwise specified. Symbol ICBO Parameter collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current current gain Conditions -100 -500 VCEsat collector-emitter saturation voltage -100 -500 -100 RCEsat VBEsat VBEon collector-emitter saturation resistance base-emitter saturation voltage base-emitter turn-on voltage -500
-120 -220
-0.1 -0.1 -0.1 -140 -170 -310 -1.1
Unit
TR1; VCEsat transistor
ICES IEBO
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
Table Characteristics .continued Tamb unless otherwise specified. Symbol Parameter transition frequency collector capacitance Conditions Unit
TR2; resistor-equipped transistor ICBO ICEO collector-base cut-off current collector-emitter cut-off current emitter-base cut-off current current gain collector-emitter saturation voltage 1.54 2.86
IEBO VCEsat VI(off) VI(on) R2/R1
off-state input voltage on-state input voltage bias resistor (input) bias resistor ratio collector capacitance
Pulse test: 0.02.
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
1200
006aaa465
-2.4 -1.6
006aaa469
(mA) -21.6 -19.2 -16.8 -14.4 -9.6 -7.2
-4.8 -0.8 -2.4
-10-1
-102
-103 -104 (mA)
Tamb Tamb Tamb
Tamb
(PNP): current gain function collector current; typical values
006aaa467
(PNP): Collector current function collector-emitter voltage; typical values
006aaa468
-1.0 -0.8
-1.3 VBEsat -0.9
-0.6
-0.5 -0.4
-0.2 -10-1
-102
-103 -104 (mA)
-0.1 -10-1
-102
-103 -104 (mA)
Tamb Tamb Tamb
IC/IB Tamb Tamb Tamb
(PNP): Base-emitter voltage function collector current; typical values
(PNP): Base-emitter saturation voltage function collector current; typical values
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
006aaa466
VCEsat
006aaa471
VCEsat
-10-1
-10-1
-10-2
-10-2 -10-1
-102
-103 -104 (mA)
-10-3 -10-1
-102
-103 -104 (mA)
IC/IB Tamb Tamb Tamb
Tamb IC/IB IC/IB IC/IB
(PNP): Collector-emitter saturation voltage function collector current; typical values
006aaa470
(PNP): Collector-emitter saturation voltage function collector current; typical values
RCEsat
RCEsat
006aaa472
10-1 -10-1
-102
-103 -104 (mA)
10-1 -10-1
-102
-103 -104 (mA)
IC/IB Tamb Tamb Tamb
Tamb IC/IB IC/IB IC/IB
(PNP): Collector-emitter saturation resistance function collector current; typical values
(PNP): Collector-emitter saturation resistance function collector current; typical values
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
006aaa015
006aaa014
VCEsat (mV)
10-1
(mA)
(mA)
Tamb Tamb Tamb
IC/IB Tamb Tamb Tamb
(NPN): current gain function collector current; typical values
(NPN): Collector-emitter saturation voltage function collector current; typical values
006aaa017
VI(on)
006aaa016
VI(off)
10-1 10-1
(mA)
10-1 10-2
10-1
(mA)
Tamb Tamb Tamb
Tamb Tamb Tamb
(NPN): On-state input voltage function collector current; typical values
(NPN): Off-state input voltage function collector current; typical values
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
Package outline
index
0.95 Dimensions
0.40 0.25 0.26 0.10 04-11-08
Package outline SOT457 (SC-74)
Packing information
Table Packing methods indicated -xxx last three digits 12NC ordering code.[1] Type number PBLS4001D Package SOT457 Description pitch, tape reel; pitch, tape reel;
further information availability packing methods, Section normal taping reverse taping
Packing quantity 3000 -115 -125 10000 -135 -165
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
Soldering
3.45 1.95
0.95 2.825 0.95
0.45 0.55
solder lands solder resist solder paste occupied area
Dimensions
sot457_fr
Reflow soldering footprint SOT457 (SC-74)
solder lands 1.475 5.05 1.475 Dimensions preferred transport direction during soldering 1.45 2.85
sot457_fw
0.45
solder resist occupied area
Wave soldering footprint SOT457 (SC-74)
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
Revision history
Table Revision history Release date 20090105 Data sheet status Product data sheet Change notice Supersedes PBLS4001D_2 Document PBLS4001D_3 Modifications:
format this data sheet been redesigned comply with identity guidelines Semiconductors. Legal texts have been adapted company name where appropriate. Figure amended Section "Legal information": updated Product data sheet Objective data sheet PBLS4001D_1
PBLS4001D_2 PBLS4001D_1
20050705 20041130
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
Legal information
12.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
Product status[3] Development Qualification Production
Definition This document contains data from objective specification product development. This document contains data from preliminary specification. This document contains product specification.
Please consult most recently issued document before initiating completing design. term `short data sheet' explained section "Definitions". product status device(s) described this document have changed since this document published differ case multiple devices. latest product status information available Internet http://www.nxp.com.
12.2 Definitions
Draft document draft version only. content still under internal review subject formal approval, which result modifications additions. Semiconductors does give representations warranties accuracy completeness information included herein shall have liability consequences such information. Short data sheet short data sheet extract from full data sheet with same product type number(s) title. short data sheet intended quick reference only should relied upon contain detailed full information. detailed full information relevant full data sheet, which available request local Semiconductors sales office. case inconsistency conflict with short data sheet, full data sheet shall prevail.
damage. Semiconductors accepts liability inclusion and/or Semiconductors products such equipment applications therefore such inclusion and/or customer's risk. Applications Applications that described herein these products illustrative purposes only. Semiconductors makes representation warranty that such applications will suitable specified without further testing modification. Limiting values Stress above more limiting values defined Absolute Maximum Ratings System 60134) cause permanent damage device. Limiting values stress ratings only operation device these other conditions above those given Characteristics sections this document implied. Exposure limiting values extended periods affect device reliability. Terms conditions sale Semiconductors products sold subject general terms conditions commercial sale, published including those pertaining warranty, intellectual property rights infringement limitation liability, unless explicitly otherwise agreed writing Semiconductors. case inconsistency conflict between information this document such terms conditions, latter will prevail. offer sell license Nothing this document interpreted construed offer sell products that open acceptance grant, conveyance implication license under copyrights, patents other industrial intellectual property rights. Quick reference data Quick reference data extract product data given Limiting values Characteristics sections this document, such complete, exhaustive legally binding.
12.3 Disclaimers
General Information this document believed accurate reliable. However, Semiconductors does give representations warranties, expressed implied, accuracy completeness such information shall have liability consequences such information. Right make changes Semiconductors reserves right make changes information published this document, including without limitation specifications product descriptions, time without notice. This document supersedes replaces information supplied prior publication hereof. Suitability Semiconductors products designed, authorized warranted suitable medical, military, aircraft, space life support equipment, applications where failure malfunction Semiconductors product reasonably expected result personal injury, death severe property environmental
12.4 Trademarks
Notice: referenced brands, product names, service names trademarks property their respective owners.
Contact information
more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com
PBLS4001D_3
B.V. 2009. rights reserved.
Product data sheet
Rev. January 2009
Semiconductors
PBLS4001D
Contents
12.1 12.2 12.3 12.4 Product profile General description. Features Applications Quick reference data. Pinning information Ordering information Marking Limiting values. Thermal characteristics. Characteristics Package outline Packing information. Soldering Revision history Legal information. Data sheet status Definitions Disclaimers Trademarks Contact information. Contents
Please aware that important notices concerning this document product(s) described herein, have been included section `Legal information'.
B.V. 2009.
rights reserved.
more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com Date release: January 2009 Document identifier: PBLS4001D_3

Rev. January 2009 Product data sheet General description VCE

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