Rev. June 2009 Objective data sheet General description LDMO
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BLA6G1011-200R
Rev. June 2009 Objective data sheet
General description
LDMOS power transistor avionics applications frequencies from 1030 1090 MHz.
Table Test information Typical performance Tcase class-AB production test circuit. Mode operation pulsed class-AB (MHz) 1030 1090 (dB) (ns) (ns)
CAUTION This device sensitive ElectroStatic Discharge (ESD). Therefore care should taken during transport handling.
Features
Typical pulsed performance frequencies 1030 1090 MHz, supply voltage Output power Power gain Efficiency Easy power control Integrated protection Enhanced ruggedness High efficiency Excellent thermal stability Designed broadband operation (1030 1090 MHz) Internally matched ease Compliant Directive 2002/95/EC, regarding restriction hazardous substances (RoHS)
Applications
Avionics transmitter applications 1030 1090 frequency range.
Semiconductors
BLA6G1011-200R
Pinning information
Table Pinning Description drain gate source
Simplified outline
Graphic symbol
sym112
Connected flange.
Ordering information
Table Ordering information Package Name Description BLA6G1011-200R flanged LDMOST ceramic package; mounting holes; leads Version SOT502A Type number
Limiting values
Table Limiting values accordance with Absolute Maximum Rating System (IEC 60134). Symbol Tstg Parameter drain-source voltage gate-source voltage drain current storage temperature junction temperature Conditions -0.5 +150 Unit
Thermal characteristics
Table Zth(j-c) Thermal characteristics Conditions Tcase Unit transient thermal impedance from junction case 0.085 Symbol Parameter
BLA6G1011-200R_1
B.V. 2009. rights reserved.
Objective data sheet
Rev. June 2009
Semiconductors
BLA6G1011-200R
Characteristics
Table characteristics unless otherwise specified. Symbol Parameter V(BR)DSS drain-source breakdown voltage VGS(th) VGSq IDSS IDSX IGSS RDS(on) gate-source threshold voltage gate-source quiescent voltage drain leakage current drain cut-off current gate leakage current forward transconductance drain-source on-state resistance feedback capacitance Conditions 1620 VGS(th) 3.75 9.45 VGS(th) 3.75 9.45 Unit
0.012 0.07
0.093
Table characteristics Mode operation: Pulsed Tcase unless otherwise specified; class-AB production test circuit. Symbol RLin Parameter output power power gain input return loss drain efficiency rise time fall time Conditions Unit
Ruggedness class-AB operation
BLA6G1011-200R enhanced rugged device capable withstanding load mismatch corresponding VSWR through phases under following conditions: 1030 1090 MHz.
BLA6G1011-200R_1
B.V. 2009. rights reserved.
Objective data sheet
Rev. June 2009
Semiconductors
BLA6G1011-200R
Application information
Impedance information
Table Typical impedance Typical values unless otherwise specified. 1030 1060 1090 0.57 j0.94 0.70 j1.13 0.80 j1.53 0.80 j0.68 0.84 j0.52 0.86 j0.35
drain gate
001aaf059
Definition transistor impedance
performance
001aak266
(dB)
001aak267
1030 1060 1090
1030 1060 1090
Output power function input power; typical values
Power gain function load power; typical values
BLA6G1011-200R_1
B.V. 2009. rights reserved.
Objective data sheet
Rev. June 2009
Semiconductors
BLA6G1011-200R
001aak268
RLin (dB)
001aak269
RLin
1020
1040
1060
1080 (MHz)
1100
1030 1060 1090
Drain efficiency function load power; typical values
Power gain, input return loss drain efficiency function frequency; typical values
Application circuit
001aak270
Table list components.
Component layout class-AB application circuit
BLA6G1011-200R_1
B.V. 2009. rights reserved.
Objective data sheet
Rev. June 2009
Semiconductors
BLA6G1011-200R
Table List components Figure Striplines Rodgers Duroid 6010 Printed-Circuit Board (PCB); 6.15 F/m; thickness 0.64 Component Description
Value
Remarks
multilayer ceramic chip capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor multilayer ceramic chip capacitor electrolytic capacitor resistor
1206
American Technical Ceramics type 100A capacitor same quality. American Technical Ceramics type 100B capacitor same quality.
BLA6G1011-200R_1
B.V. 2009. rights reserved.
Objective data sheet
Rev. June 2009
Semiconductors
BLA6G1011-200R
Package outline
Flanged LDMOST ceramic package; mounting holes; leads SOT502A
scale
DIMENSIONS (millimetre dimensions derived from original inch dimensions) UNIT inches 4.72 3.43 0.186 0.135 12.83 12.57 0.15 0.08 9.50 9.30 9.53 9.25 1.14 0.89 19.94 18.92 5.33 4.32 3.38 3.12 1.70 1.45 27.94 34.16 33.91 1.345 1.335 9.91 9.65 0.390 0.380 0.25 0.01 0.51 0.02
20.02 19.96 19.61 19.66 0.788 0.786 0.772 0.774
0.505 0.006 0.495 0.003
0.374 0.375 0.366 0.364
0.045 0.785 0.035 0.745
0.210 0.133 0.170 0.123
0.067 1.100 0.057
OUTLINE VERSION SOT502A
REFERENCES JEDEC JEITA
EUROPEAN PROJECTION
ISSUE DATE 99-12-28 03-01-10
Package outline SOT502A
B.V. 2009. rights reserved.
BLA6G1011-200R_1
Objective data sheet
Rev. June 2009
Semiconductors
BLA6G1011-200R
Abbreviations
Table Acronym LDMOS LDMOST VSWR Abbreviations Description Continuous Wave Laterally Diffused Metal-Oxide Semiconductor Laterally Diffused Metal-Oxide Semiconductor Transistor Radio Frequency Surface Mounted Device Voltage Standing-Wave Ratio
Revision history
Table Revision history Release date 20090617 Data sheet status Objective data sheet Change notice Supersedes Document BLA6G1011-200R_1
BLA6G1011-200R_1
B.V. 2009. rights reserved.
Objective data sheet
Rev. June 2009
Semiconductors
BLA6G1011-200R
Legal information
11.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
Product status[3] Development Qualification Production
Definition This document contains data from objective specification product development. This document contains data from preliminary specification. This document contains product specification.
Please consult most recently issued document before initiating completing design. term `short data sheet' explained section "Definitions". product status device(s) described this document have changed since this document published differ case multiple devices. latest product status information available Internet http://www.nxp.com.
11.2 Definitions
Draft document draft version only. content still under internal review subject formal approval, which result modifications additions. Semiconductors does give representations warranties accuracy completeness information included herein shall have liability consequences such information. Short data sheet short data sheet extract from full data sheet with same product type number(s) title. short data sheet intended quick reference only should relied upon contain detailed full information. detailed full information relevant full data sheet, which available request local Semiconductors sales office. case inconsistency conflict with short data sheet, full data sheet shall prevail.
damage. Semiconductors accepts liability inclusion and/or Semiconductors products such equipment applications therefore such inclusion and/or customer's risk. Applications Applications that described herein these products illustrative purposes only. Semiconductors makes representation warranty that such applications will suitable specified without further testing modification. Limiting values Stress above more limiting values defined Absolute Maximum Ratings System 60134) cause permanent damage device. Limiting values stress ratings only operation device these other conditions above those given Characteristics sections this document implied. Exposure limiting values extended periods affect device reliability. Terms conditions sale Semiconductors products sold subject general terms conditions commercial sale, published including those pertaining warranty, intellectual property rights infringement limitation liability, unless explicitly otherwise agreed writing Semiconductors. case inconsistency conflict between information this document such terms conditions, latter will prevail. offer sell license Nothing this document interpreted construed offer sell products that open acceptance grant, conveyance implication license under copyrights, patents other industrial intellectual property rights. Export control This document well item(s) described herein subject export control regulations. Export might require prior authorization from national authorities.
11.3 Disclaimers
General Information this document believed accurate reliable. However, Semiconductors does give representations warranties, expressed implied, accuracy completeness such information shall have liability consequences such information. Right make changes Semiconductors reserves right make changes information published this document, including without limitation specifications product descriptions, time without notice. This document supersedes replaces information supplied prior publication hereof. Suitability Semiconductors products designed, authorized warranted suitable medical, military, aircraft, space life support equipment, applications where failure malfunction Semiconductors product reasonably expected result personal injury, death severe property environmental
11.4 Trademarks
Notice: referenced brands, product names, service names trademarks property their respective owners.
Contact information
more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com
BLA6G1011-200R_1
B.V. 2009. rights reserved.
Objective data sheet
Rev. June 2009
Semiconductors
BLA6G1011-200R
Contents
11.1 11.2 11.3 11.4 Product profile General description. Features Applications Pinning information Ordering information Limiting values. Thermal characteristics. Characteristics Ruggedness class-AB operation. Application information. Impedance information performance Application circuit Package outline Abbreviations Revision history Legal information. Data sheet status Definitions Disclaimers Trademarks Contact information. Contents
Please aware that important notices concerning this document product(s) described herein, have been included section `Legal information'.
B.V. 2009.
rights reserved.
more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com Date release: June 2009 Document identifier: BLA6G1011-200R_1
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