BF824 medium frequency transistor Product specification Supersede

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BF824 medium frequency transistor Product specification Supersede

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BF824 medium frequency transistor
Product specification Supersedes data 1999 2004
Philips Semiconductors
Product specification
medium frequency transistor
FEATURES current (max. voltage (max. APPLICATIONS stages front-ends common base configuration. DESCRIPTION medium frequency transistor SOT23 plastic package.
BF824
PINNING base emitter collector DESCRIPTION
handbook, halfpage
MARKING TYPE NUMBER BF824 Note Made Hong Kong. Made Malaysia. Made China. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME BF824 DESCRIPTION plastic surface mounted package; leads MARKING CODE(1)
view
MAM256
Fig.1 Simplified outline (SOT23) symbol.
VERSION SOT23
2004
Philips Semiconductors
Product specification
medium frequency transistor
LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 60134). SYMBOL VCBO VCEO VEBO Ptot Tstg Tamb Note Transistor mounted printed-circuit board. THERMAL CHARACTERISTICS SYMBOL Rth(j-a) Note Transistor mounted printed-circuit board. CHARACTERISTICS unless otherwise specified. SYMBOL ICBO IEBO PARAMETER collector cut-off current emitter cut-off current current gain base-emitter voltage feedback capacitance transition frequency CONDITIONS MIN. TYP. PARAMETER thermal resistance from junction ambient CONDITIONS note VALUE PARAMETER collector-base voltage collector-emitter voltage emitter-base voltage collector current (DC) peak collector current total power dissipation storage temperature junction temperature operating ambient temperature Tamb note CONDITIONS open emitter open base open collector MIN. MAX. +150 +150
BF824
UNIT
UNIT
MAX. -100 -900
UNIT
2004
Philips Semiconductors
Product specification
medium frequency transistor
PACKAGE OUTLINE
Plastic surface mounted package; leads
BF824
SOT23
detail
scale
DIMENSIONS original dimensions) UNIT max. 0.48 0.38 0.15 0.09 0.95 0.45 0.15 0.55 0.45
OUTLINE VERSION SOT23
REFERENCES JEDEC TO-236AB EIAJ
EUROPEAN PROJECTION
ISSUE DATE 97-02-28 99-09-13
2004
Philips Semiconductors
Product specification
medium frequency transistor
DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development DEFINITION
BF824
This data sheet contains data from objective specification product development. Philips Semiconductors reserves right change specification manner without notice. This data sheet contains data from preliminary specification. Supplementary data will published later date. Philips Semiconductors reserves right change specification without notice, order improve design supply best possible product. This data sheet contains data from product specification. Philips Semiconductors reserves right make changes time order improve design, manufacturing supply. Relevant changes will communicated Customer Product/Process Change Notification (CPCN).
Preliminary data Qualification
Product data
Production
Notes Please consult most recently issued data sheet before initiating completing design. product status device(s) described this data sheet have changed since this data sheet published. latest information available Internet data sheets describing multiple type numbers, highest-level product status determines data sheet status. DEFINITIONS Short-form specification data short-form specification extracted from full data sheet with same type number title. detailed information relevant data sheet data handbook. Limiting values definition Limiting values given accordance with Absolute Maximum Rating System (IEC 60134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections specification implied. Exposure limiting values extended periods affect device reliability. Application information Applications that described herein these products illustrative purposes only. Philips Semiconductors make representation warranty that such applications will suitable specified without further testing modification. DISCLAIMERS Life support applications These products designed life support appliances, devices, systems where malfunction these products reasonably expected result personal injury. Philips Semiconductors customers using selling these products such applications their risk agree fully indemnify Philips Semiconductors damages resulting from such application. Right make changes Philips Semiconductors reserves right make changes products including circuits, standard cells, and/or software described contained herein order improve design and/or performance. When product full production (status `Production'), relevant changes will communicated Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes responsibility liability these products, conveys licence title under patent, copyright, mask work right these products, makes representations warranties that these products free from patent, copyright, mask work right infringement, unless otherwise specified.
2004
Philips Semiconductors worldwide company
Contact information additional information please visit Fax: 24825 sales offices addresses send e-mail
Koninklijke Philips Electronics N.V. 2004
SCA76
rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent- other industrial intellectual property rights.
Printed Netherlands
R75/04/pp6
Date release: 2004
Document order number:
9397 12415

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