Rev. February 2009 Product data sheet General description BB

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Rev. February 2009 Product data sheet General description BB

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BB181
Rev. February 2009 Product data sheet
General description
BB181 variable capacitance diode, fabricated planar technology encapsulated SOD523 (SC-79) ultra small plastic package.
Features
Excellent linearity Ultra small plastic package Cd(28V) Cd(0V5) Cd(28V) ratio
Applications
Electronic tuning satellite tuners Tunable coupling Voltage Controlled Oscillators (VCO)
Pinning information
Table Pinning Description cathode anode
Simplified outline
Graphic symbol
sym008
marking indicates cathode.
Ordering information
Table Ordering information Package Name BB181 SC-79 Description plastic surface mounted package; leads Version SOD523 Type number
Semiconductors
BB181
Marking
Table BB181 Marking codes Marking code Type number
Limiting values
Table Limiting values accordance with Absolute Maximum Rating System (IEC 60134). Symbol Parameter Tstg reverse voltage forward current storage temperature junction temperature Conditions Unit
+150 +150
Characteristics
Table Characteristics unless otherwise specified. Symbol Parameter reverse current Conditions Figure diode series resistance diode capacitance MHz; Figure Figure Cd(0V5)/Cd(28V) diode capacitance ratio (0.5 1.055 Unit
BB181_3
B.V. 2009. rights reserved.
Product data sheet
Rev. February 2009
Semiconductors
BB181
(pF)
mbe872
10-1
MHz;
Diode capacitance function reverse voltage; typical values
(nA)
mlc816
10-3
mlc815
(K-1)
10-4
(°C)
10-5 10-1
Reverse current function junction temperature; maximum values
Temperature coefficient diode capacitance function reverse voltage; typical values
BB181_3
B.V. 2009. rights reserved.
Product data sheet
Rev. February 2009
Semiconductors
BB181
Package outline
Plastic surface-mounted package; leads SOD523
scale
DIMENSIONS original dimensions) UNIT 0.65 0.58 0.34 0.26 0.17 0.11 1.25 1.15 0.85 0.75 1.65 1.55
Note marking indicates cathode. OUTLINE VERSION SOD523 REFERENCES JEDEC JEITA SC-79 EUROPEAN PROJECTION ISSUE DATE 02-12-13 06-03-16
Package outline SOD523 (SC-79)
Abbreviations
Table Acronym Abbreviations Description Surface Mounted Device Very High Frequency
Revision history
Table BB181_3 Modifications: BB181_N_2 BB181_1 Revision history Release date 20090216 Data sheet status Product data sheet Change notice Supersedes BB181_N_2 Document
format this data sheet been redesigned comply with presentation information standard semiconductors Product data sheet Product specification BB181_1
20080102 19981126
BB181_3
B.V. 2009. rights reserved.
Product data sheet
Rev. February 2009
Semiconductors
BB181
Legal information
10.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
Product status[3] Development Qualification Production
Definition This document contains data from objective specification product development. This document contains data from preliminary specification. This document contains product specification.
Please consult most recently issued document before initiating completing design. term `short data sheet' explained section "Definitions". product status device(s) described this document have changed since this document published differ case multiple devices. latest product status information available Internet http://www.nxp.com.
10.2 Definitions
Draft document draft version only. content still under internal review subject formal approval, which result modifications additions. Semiconductors does give representations warranties accuracy completeness information included herein shall have liability consequences such information. Short data sheet short data sheet extract from full data sheet with same product type number(s) title. short data sheet intended quick reference only should relied upon contain detailed full information. detailed full information relevant full data sheet, which available request local Semiconductors sales office. case inconsistency conflict with short data sheet, full data sheet shall prevail.
malfunction Semiconductors product reasonably expected result personal injury, death severe property environmental damage. Semiconductors accepts liability inclusion and/or Semiconductors products such equipment applications therefore such inclusion and/or customer's risk. Applications Applications that described herein these products illustrative purposes only. Semiconductors makes representation warranty that such applications will suitable specified without further testing modification. Limiting values Stress above more limiting values defined Absolute Maximum Ratings System 60134) cause permanent damage device. Limiting values stress ratings only operation device these other conditions above those given Characteristics sections this document implied. Exposure limiting values extended periods affect device reliability. Terms conditions sale Semiconductors products sold subject general terms conditions commercial sale, published including those pertaining warranty, intellectual property rights infringement limitation liability, unless explicitly otherwise agreed writing Semiconductors. case inconsistency conflict between information this document such terms conditions, latter will prevail. offer sell license Nothing this document interpreted construed offer sell products that open acceptance grant, conveyance implication license under copyrights, patents other industrial intellectual property rights.
10.3 Disclaimers
General Information this document believed accurate reliable. However, Semiconductors does give representations warranties, expressed implied, accuracy completeness such information shall have liability consequences such information. Right make changes Semiconductors reserves right make changes information published this document, including without limitation specifications product descriptions, time without notice. This document supersedes replaces information supplied prior publication hereof. Suitability Semiconductors products designed, authorized warranted suitable medical, military, aircraft, space life support equipment, applications where failure
10.4 Trademarks
Notice: referenced brands, product names, service names trademarks property their respective owners.
Contact information
more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com
BB181_3
B.V. 2009. rights reserved.
Product data sheet
Rev. February 2009
Semiconductors
BB181
Contents
10.1 10.2 10.3 10.4 Product profile General description. Features Applications Pinning information Ordering information Marking Limiting values. Characteristics Package outline Abbreviations Revision history Legal information. Data sheet status Definitions Disclaimers Trademarks Contact information. Contents
Please aware that important notices concerning this document product(s) described herein, have been included section `Legal information'.
B.V. 2009.
rights reserved.
more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com Date release: February 2009 Document identifier: BB181_3

Rev. February 2009 Product data sheet General description BB

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