Rev. October 2008 Product data sheet General description Sin

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Rev. October 2008 Product data sheet General description Sin

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BAS32L
Rev. October 2008 Product data sheet
General description
Single high-speed switching diode, fabricated planar technology, encapsulated small hermetically sealed glass SOD80C Surface-Mounted Device (SMD) package.
Features
High switching speed: Reverse voltage: Repetitive peak reverse voltage: VRRM Repetitive peak forward current: IFRM Small hermetically sealed glass package
Applications
High-speed switching Reverse polarity protection
Quick reference data
Table Symbol IFRM
Quick reference data Parameter forward current repetitive peak forward current reverse voltage forward voltage reverse recovery time
Conditions
1000
Unit
Device mounted Printed-Circuit Board (PCB), single-sided copper, tin-plated standard footprint. When switched from measured
Semiconductors
BAS32L
Pinning information
Table Pinning Description cathode anode
Simplified outline
Graphic symbol
006aab040
marking band indicates cathode.
Ordering information
Table Ordering information Package Name BAS32L Description hermetically sealed glass surface-mounted package; connectors Version SOD80C Type number
Marking
Table BAS32L
black: made Philippines brown: made China
Marking codes Marking code[1] marking band
Type number
Limiting values
Table Limiting values accordance with Absolute Maximum Rating System (IEC 60134). Symbol VRRM IFRM IFSM Parameter repetitive peak reverse voltage reverse voltage forward current repetitive peak forward current non-repetitive peak forward current square wave Ptot total power dissipation Tamb
Conditions
Unit
BAS32L_6
B.V. 2008. rights reserved.
Product data sheet
Rev. October 2008
Semiconductors
BAS32L
Table Limiting values .continued accordance with Absolute Maximum Rating System (IEC 60134). Symbol Tamb Tstg
Parameter junction temperature ambient temperature storage temperature
Conditions
+200 +200
Unit
Device mounted PCB, single-sided copper, tin-plated standard footprint. prior surge.
Thermal characteristics
Table Symbol Rth(j-a) Rth(j-sp)
Thermal characteristics Parameter thermal resistance from junction ambient thermal resistance from junction solder point Conditions free
Unit
Device mounted PCB, single-sided copper, tin-plated standard footprint.
Characteristics
Table Characteristics Tamb unless otherwise specified. Symbol Parameter forward voltage Conditions reverse current
1000
Unit
diode capacitance reverse recovery time forward recovery voltage
When switched from measured When switched from
BAS32L_6
B.V. 2008. rights reserved.
Product data sheet
Rev. October 2008
Semiconductors
BAS32L
(mA)
mbg451
(mA)
mbg464
Tamb (°C)
PCB, standard footprint
typical values typical values maximum values
Forward current function ambient temperature; derating curve
mbg704
Forward current function forward voltage
mgd006
IFSM
(µA)
10-1
10-1
(µs)
10-2 (°C)
Based square wave currents. prior surge
maximum values typical values typical values
Non-repetitive peak forward current function pulse duration; maximum values
Reverse current function junction temperature
BAS32L_6
B.V. 2008. rights reserved.
Product data sheet
Rev. October 2008
Semiconductors
BAS32L
(pF)
mgd004
MHz;
Diode capacitance function reverse voltage; typical values
Test information
D.U.T. SAMPLING OSCILLOSCOPE
mga881
input signal output signal
Input signal: Reverse pulse rise time reverse voltage pulse duration duty factor 0.05 Oscilloscope: Rise time 0.35
Reverse recovery time test circuit waveforms
D.U.T.
OSCILLOSCOPE input signal
output signal
mga882
Input signal: Forward pulse rise time forward current pulse duration duty factor 0.005
BAS32L_6
Forward recovery voltage test circuit waveforms
B.V. 2008. rights reserved.
Product data sheet
Rev. October 2008
Semiconductors
BAS32L
Package outline
1.60 1.45
Dimensions
06-03-16
Package outline SOD80C
Packing information
Table Packing methods indicated -xxx last three digits 12NC ordering code.[1] Type number BAS32L
Package SOD80C
Description pitch, tape reel
Packing quantity 2500 -115 10000 -135
further information availability packing methods, Section
BAS32L_6
B.V. 2008. rights reserved.
Product data sheet
Rev. October 2008
Semiconductors
BAS32L
Soldering
4.55 4.30 2.30 solder lands solder paste 2.25 1.70 1.60 solder resist occupied area Dimensions 0.90 (2x)
sod080c
Reflow soldering footprint SOD80C
6.30 4.90 2.70 1.90
solder lands solder resist
2.90 1.70
occupied area tracks
Dimensions
sod080c
Wave soldering footprint SOD80C
BAS32L_6
B.V. 2008. rights reserved.
Product data sheet
Rev. October 2008
Semiconductors
BAS32L
Revision history
Table BAS32L_6 Modifications: BAS32L_5 BAS32L_4 BAS32L_3 BAS32L_2 BAS32L_1 Revision history Release date 20081029 Data sheet status Product data sheet Change notice Supersedes BAS32L_5 Document
Figure amended Section "Legal information": updated Product data sheet Product data sheet Product specification Product specification Product specification BAS32L_4 BAS32L_3 BAS32L_2 BAS32L_1
20080103 20050322 20020123 19960910 19960423
BAS32L_6
B.V. 2008. rights reserved.
Product data sheet
Rev. October 2008
Semiconductors
BAS32L
Legal information
13.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
Product status[3] Development Qualification Production
Definition This document contains data from objective specification product development. This document contains data from preliminary specification. This document contains product specification.
Please consult most recently issued document before initiating completing design. term `short data sheet' explained section "Definitions". product status device(s) described this document have changed since this document published differ case multiple devices. latest product status information available Internet http://www.nxp.com.
13.2 Definitions
Draft document draft version only. content still under internal review subject formal approval, which result modifications additions. Semiconductors does give representations warranties accuracy completeness information included herein shall have liability consequences such information. Short data sheet short data sheet extract from full data sheet with same product type number(s) title. short data sheet intended quick reference only should relied upon contain detailed full information. detailed full information relevant full data sheet, which available request local Semiconductors sales office. case inconsistency conflict with short data sheet, full data sheet shall prevail.
damage. Semiconductors accepts liability inclusion and/or Semiconductors products such equipment applications therefore such inclusion and/or customer's risk. Applications Applications that described herein these products illustrative purposes only. Semiconductors makes representation warranty that such applications will suitable specified without further testing modification. Limiting values Stress above more limiting values defined Absolute Maximum Ratings System 60134) cause permanent damage device. Limiting values stress ratings only operation device these other conditions above those given Characteristics sections this document implied. Exposure limiting values extended periods affect device reliability. Terms conditions sale Semiconductors products sold subject general terms conditions commercial sale, published including those pertaining warranty, intellectual property rights infringement limitation liability, unless explicitly otherwise agreed writing Semiconductors. case inconsistency conflict between information this document such terms conditions, latter will prevail. offer sell license Nothing this document interpreted construed offer sell products that open acceptance grant, conveyance implication license under copyrights, patents other industrial intellectual property rights. Quick reference data Quick reference data extract product data given Limiting values Characteristics sections this document, such complete, exhaustive legally binding.
13.3 Disclaimers
General Information this document believed accurate reliable. However, Semiconductors does give representations warranties, expressed implied, accuracy completeness such information shall have liability consequences such information. Right make changes Semiconductors reserves right make changes information published this document, including without limitation specifications product descriptions, time without notice. This document supersedes replaces information supplied prior publication hereof. Suitability Semiconductors products designed, authorized warranted suitable medical, military, aircraft, space life support equipment, applications where failure malfunction Semiconductors product reasonably expected result personal injury, death severe property environmental
13.4 Trademarks
Notice: referenced brands, product names, service names trademarks property their respective owners.
Contact information
more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com
BAS32L_6
B.V. 2008. rights reserved.
Product data sheet
Rev. October 2008
Semiconductors
BAS32L
Contents
13.1 13.2 13.3 13.4 Product profile General description. Features Applications Quick reference data. Pinning information Ordering information Marking Limiting values. Thermal characteristics. Characteristics Test information Package outline Packing information. Soldering Revision history Legal information. Data sheet status Definitions Disclaimers Trademarks Contact information. Contents
Please aware that important notices concerning this document product(s) described herein, have been included section `Legal information'.
B.V. 2008.
rights reserved.
more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com Date release: October 2008 Document identifier: BAS32L_6

Rev. October 2008 Product data sheet General description Sin

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