Subminiature package. Z-Bend lead. Long life solid state reliability.

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Subminiature package. Z-Bend lead. Long life solid state reliability.

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Part Number: AM27SYCK09 Super Bright Yellow
Subminiature package. Z-Bend lead. Long life solid state reliability. package profile. Package :1000pcs reel. Moisture sensitivity level level RoHS compliant.
Description
Super Bright Yellow device made with AlGaInP GaAs substrate) light emitting diode chip.
Package Dimensions
Notes: dimensions millimeters (inches). Tolerance ±0.25(0.01") unless otherwise noted. Lead spacing measured where leads emerge from package. Specifications subject change without notice. device single mounting surface. device must mounted according specifications.
SPEC DSAD1335 APPROVED: WYNEC
CHECKED: Allen
DATE: APR/17/2009 DRAWN: Ting.Li
PAGE: ERP: 1202000418
Selection Guide
Part Dice Lens Type (mcd) 20mA Min. AM27SYCK09 Super Bright Yellow (AlGaInP) WATER CLEAR Typ. 1800 Viewing Angle 21/2
Notes: angle from optical centerline where luminous intensity optical centerline value. Luminous intensity/ luminous Flux: +/-15%.
Electrical Optical Characteristics TA=25°C
Symbol peak Parameter Peak Wavelength Dominant Wavelength Spectral Line Half-width Capacitance Forward Voltage Reverse Current Device Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Super Bright Yellow Typ. Max. Units Test Conditions IF=20mA IF=20mA IF=20mA VF=0V;f=1MHz IF=20mA VR=5V
Notes: 1.Wavelength: +/-1nm. Forward Voltage: +/-0.1V.
Absolute Maximum Ratings TA=25°C
Parameter Power dissipation Forward Current Peak Forward Current Reverse Voltage Electrostatic Discharge Threshold (HBM) Operating Temperature Storage Temperature
Note: 1/10 Duty Cycle, 0.1ms Pulse Width.
Super Bright Yellow 3000 -40°C +85°C -40°C +85°C
Units
SPEC DSAD1335 APPROVED: WYNEC
CHECKED: Allen
DATE: APR/17/2009 DRAWN: Ting.Li
PAGE: ERP: 1202000418
Super Bright Yellow
AM27SYCK09
SPEC DSAD1335 APPROVED: WYNEC
CHECKED: Allen
DATE: APR/17/2009 DRAWN: Ting.Li
PAGE: ERP: 1202000418
AM27SYCK09
Reflow soldering recommended soldering profile shown below. Other soldering methods recommended they might cause damage product.
Recommended Soldering Pattern (Units Tolerance: 0.1)
Tape Dimensions (Units
SPEC DSAD1335 APPROVED: WYNEC
CHECKED: Allen
DATE: APR/17/2009 DRAWN: Ting.Li
PAGE: ERP: 1202000418
PACKING LABEL SPECIFICATIONS
AM27SYCK09
SPEC DSAD1335 APPROVED: WYNEC
CHECKED: Allen
DATE: APR/17/2009 DRAWN: Ting.Li
PAGE: ERP: 1202000418

Subminiature package. Z-Bend lead. Long life solid state reliability.

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