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N-channel dual gate MOS-FETs Rev. November 2007 Product data shee
Top Searches for this datasheetBF904; BF904R N-channel dual gate MOS-FETs Rev. November 2007 Product data sheet Dear customer, from October 1st, 2006 Philips Semiconductors trade name Semiconductors, which will used future data sheets together with contact details. data sheets where previous Philips references remain, please links shown below. http://www.nxp.com http://www.nxp.com (Internet) salesaddresses@nxp.com (email) copyright notice bottom each page elsewhere document, depending version) Koninklijke Philips Electronics N.V. (year). rights reserved replaced with: B.V. (year). rights reserved. have questions related data sheet, please contact nearest sales office e-mail phone (details salesaddresses@nxp.com). Thank your cooperation understanding, Semiconductors Semiconductors Product specification N-channel dual gate MOS-FETs FEATURES Specially designed supply voltage Short channel transistor with high transfer admittance input capacitance ratio noise gain controlled amplifier Superior cross-modulation performance during AGC. APPLICATIONS applications with supply voltage such television tuners professional communications equipment. DESCRIPTION Enhancement type field-effect transistor plastic microminiature SOT143B SOT143R package. transistor consists amplifier MOS-FET with source BF904; BF904R substrate interconnected internal bias circuit ensure good cross-modulation performance during AGC. CAUTION This product supplied anti-static packing prevent damage caused electrostatic discharge during transport handling. further information, refer Philips specs.: SNW-EQ-608, SNW-FQ-302A SNW-FQ-302B. PINNING SYMBOL source drain gate gate DESCRIPTION handbook, halfpage handbook, halfpage view view MAM124 MAM125 BF904 marking code: %MC. BF904R marking code: %MD. Fig.1 Simplified outline (SOT143B) symbol. Fig.2 Simplified outline (SOT143R) symbol. QUICK REFERENCE DATA SYMBOL Ptot Cig1-s drain current total power dissipation operating junction temperature forward transfer admittance input capacitance gate reverse transfer capacitance noise figure PARAMETER drain-source voltage CONDITIONS MIN. TYP. MAX. UNIT Rev. November 2007 Semiconductors Product specification N-channel dual gate MOS-FETs LIMITING VALUES accordance with Absolute Maximum Rating System (IEC 134). SYMBOL Ptot PARAMETER drain-source voltage drain current gate current gate current total power dissipation BF904 BF904R Tstg Note Device mounted printed-circuit board. storage temperature operating junction temperature Fig.3 Tamb note Tamb note CONDITIONS MIN. BF904; BF904R MAX. +150 UNIT handbook, halfpage MRA770 (mW) BF904 BF904R Tamb Fig.3 Power derating curves. Rev. November 2007 Semiconductors Product specification N-channel dual gate MOS-FETs THERMAL CHARACTERISTICS SYMBOL BF904 BF904R thermal resistance from junction soldering point BF904 BF904R Notes Device mounted printed-circuit board. temperature soldering point source lead. STATIC CHARACTERISTICS unless otherwise specified. SYMBOL V(BR)G1-SS V(BR)G2-SS V(F)S-G1 V(F)S-G2 VG1-S(th) VG2-S(th) IDSX IG1-SS IG2-SS Note connects gate Fig.20. PARAMETER gate 1-source breakdown voltage gate 2-source breakdown voltage forward source-gate voltage forward source-gate voltage gate 1-source threshold voltage gate 2-source threshold voltage drain-source current gate cut-off current gate cut-off current CONDITIONS VG2-S IG1-S VG1-S IG2-S VG2-S IS-G1 VG1-S IS-G2 VG2-S VG1-S VG2-S note VG2-S VG1-S VG1-S VG2-S note PARAMETER thermal resistance from junction ambient CONDITIONS note BF904; BF904R VALUE UNIT MIN. MAX. UNIT DYNAMIC CHARACTERISTICS Common source; Tamb VG2-S unless otherwise specified. SYMBOL Cig1-s Cig2-s PARAMETER forward transfer admittance input capacitance gate input capacitance gate drain-source capacitance noise figure MHz; BSopt MHz; GSopt; BSopt CONDITIONS pulsed; MIN. TYP. MAX. UNIT reverse transfer capacitance Rev. November 2007 Semiconductors Product specification N-channel dual gate MOS-FETs BF904; BF904R (mS) MLD268 MRA769 handbook, halfpage gain reduction (dB) VAGC MHz. Fig.4 Transfer admittance function junction temperature; typical values. Fig.5 Typical gain reduction function voltage. handbook, halfpage MRA771 MLD270 (mA) Vunw gain reduction (dB) MHz. funw MHz; Tamb Fig.6 Unwanted voltage cross-modulation function gain reduction; typical values; Fig.20. Fig.7 Transfer characteristics; typical values. Rev. November 2007 Semiconductors Product specification N-channel dual gate MOS-FETs BF904; BF904R MLD269 MLD271 handbook, halfpage (mA) handbook, halfpage (µA) VG2-S Fig.9 Fig.8 Output characteristics; typical values. Gate current function gate voltage; typical values. MLD272 MLD273 handbook, halfpage handbook, halfpage (mS) (mA) (mA) (µA) VG2-S Fig.10 Forward transfer admittance function drain current; typical values. Fig.11 Drain current function gate current; typical values. Rev. November 2007 Semiconductors Product specification N-channel dual gate MOS-FETs BF904; BF904R MLD275 MLD274 handbook, halfpage handbook, halfpage (mA) (mA) VG2-S (connected VGG); VG2-S connected VGG; Fig.12 Drain current function gate supply voltage VGG); typical values; Fig.20. Fig.13 Drain current function gate VGG) drain supply voltage; typical values; Fig.20. MLD276 handbook, halfpage (mA) handbook, halfpage MLB945 (µA) (connected VGG). (connected VGG). Fig.14 Drain current function gate voltage; typical values; Fig.20. Fig.15 Gate current function gate voltage; typical values; Fig.20. Rev. November 2007 Semiconductors Product specification N-channel dual gate MOS-FETs BF904; BF904R handbook, halfpage (mS) MLD277 (µS) MLD278 (deg) (MHz) (MHz) Tamb Tamb Fig.16 Input admittance function frequency; typical values. Fig.17 Reverse transfer admittance phase function frequency; typical values. MLD279 MLD280 handbook, halfpage (mS) (deg) (mS) (MHz) (MHz) Tamb Tamb Fig.18 Forward transfer admittance phase function frequency; typical values. Fig.19 Output admittance function frequency; typical values. Rev. November 2007 Semiconductors Product specification N-channel dual gate MOS-FETs BF904; BF904R VAGC MLD171 Fig.20 Cross-modulation test set-up. Rev. November 2007 Semiconductors Product specification N-channel dual gate MOS-FETs Table (MHz) 1000 1200 1400 1600 1800 2000 2200 2400 2600 2800 3000 Table Scattering parameters: VG2-S MAGNITUDE (ratio) 0.989 0.985 0.976 0.958 0.942 0.918 0.899 0.876 0.852 0.823 0.800 0.750 0.719 0.682 0.642 0.602 0.547 0.596 0.682 0.771 0.793 ANGLE (deg) -3.4 -8.3 -16.4 -24.1 -32.0 -39.3 -46.0 -52.6 -58.8 -64.9 -70.9 -82.4 -92.7 -102.5 -109.8 -116.5 -124.9 -128.7 -132.6 -142.5 -157.5 MAGNITUDE (ratio) 2.420 2.414 2.368 2.301 2.251 2.170 2.080 2.001 1.924 1.829 1.747 1.621 1.535 1.424 1.349 1.283 1.130 1.018 0.979 0.804 0.541 ANGLE (deg) 175.7 169.1 158.8 148.5 138.8 129.5 120.7 112.1 103.2 94.7 86.5 70.7 54.6 39.4 22.5 -15.1 -49.1 -79.4 -116.2 -153.5 MAGNITUDE (ratio) 0.000 0.001 0.003 0.004 0.005 0.005 0.005 0.005 0.005 0.005 0.005 0.005 0.008 0.010 0.013 0.018 0.014 0.040 0.077 0.120 0.149 ANGLE (deg) 79.9 78.3 80.3 73.7 70.7 67.2 67.8 68.6 72.9 78.7 88.3 120.5 139.8 137.8 156.8 175.1 172.6 -163.9 -164.0 178.8 158.3 BF904; BF904R MAGNITUDE (ratio) 0.993 0.992 0.987 0.980 0.974 0.966 0.958 0.951 0.944 0.937 0.933 0.928 0.930 0.924 0.928 0.928 0.887 0.837 0.778 0.629 0.479 ANGLE (deg) -1.6 -3.9 -7.8 -11.4 -15.2 -18.7 -22.2 -25.5 -28.9 -32.1 -35.2 -41.7 -48.4 -54.9 -62.9 -73.1 -81.0 -95.8 -109.6 -119.5 -119.9 Noise data: VG2-S (MHz) Fmin (dB) 2.00 (ratio) 0.686 (deg) 49.6 50.40 Rev. November 2007 Semiconductors Product specification N-channel dual gate MOS-FETs PACKAGE OUTLINES Plastic surface mounted package; leads BF904; BF904R SOT143B detail scale DIMENSIONS original dimensions) UNIT 0.48 0.38 0.88 0.78 0.15 0.09 0.45 0.15 0.55 0.45 OUTLINE VERSION SOT143B REFERENCES JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-02-28 Rev. November 2007 Semiconductors Product specification N-channel dual gate MOS-FETs BF904; BF904R Plastic surface mounted package; reverse pinning; leads SOT143R detail scale DIMENSIONS original dimensions) UNIT 0.48 0.38 0.88 0.78 0.15 0.09 0.55 0.25 0.45 0.25 OUTLINE VERSION SOT143R REFERENCES JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE 97-03-10 Rev. November 2007 Semiconductors BF904; BF904R N-channel dual gate MOS-FETs Legal information Data sheet status Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet Product status[3] Development Qualification Production Definition This document contains data from objective specification product development. This document contains data from preliminary specification. This document contains product specification. Please consult most recently issued document before initiating completing design. term `short data sheet' explained section "Definitions". product status device(s) described this document have changed since this document published differ case multiple devices. latest product status information available Internet http://www.nxp.com. Definitions Draft document draft version only. content still under internal review subject formal approval, which result modifications additions. 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Semiconductors makes representation warranty that such applications will suitable specified without further testing modification. Limiting values Stress above more limiting values defined Absolute Maximum Ratings System 60134) cause permanent damage device. Limiting values stress ratings only operation device these other conditions above those given Characteristics sections this document implied. Exposure limiting values extended periods affect device reliability. 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November 2007 Semiconductors BF904; BF904R N-channel dual gate MOS-FETs Revision history Revision history Document BF904_904R_N_6 Modifications: BF904_904R_5 (9397 05898) BF904R_4 (9397 02668) BF904R_3 BF904R_2 BF904R_1 Release date 20071113 Data sheet status Product data sheet Product specification Product specification Product specification Change notice Supersedes BF904_904R_5 BF904R_4 BF904R_3 BF904R_2 BF904R_1 Fig. page Figure note changed 19990517 19970905 19950425 Please aware that important notices concerning this document product(s) described herein, have been included section `Legal information'. B.V. 2007. rights reserved. more information, please visit: http://www.nxp.com sales office addresses, please send email salesaddresses@nxp.com Date release: November 2007 Document identifier: BF904_904R_N_6 Other recent searchesSTD6NF10 - STD6NF10 STD6NF10 Datasheet STU6NF10 - STU6NF10 STU6NF10 Datasheet SPMQ461-01 - SPMQ461-01 SPMQ461-01 Datasheet IDT72V205 - IDT72V205 IDT72V205 Datasheet IDT72V215 - IDT72V215 IDT72V215 Datasheet IDT72V225 - IDT72V225 IDT72V225 Datasheet IDT72V235 - IDT72V235 IDT72V235 Datasheet IDT72V245 - IDT72V245 IDT72V245 Datasheet Fo-80 - Fo-80 Fo-80 Datasheet EN5691 - EN5691 EN5691 Datasheet LC7851E - LC7851E LC7851E Datasheet AN2648 - AN2648 AN2648 Datasheet 2SC5846G - 2SC5846G 2SC5846G Datasheet 2SC4105 - 2SC4105 2SC4105 Datasheet
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