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300mA CMOS with Shutdown VREF Bypass Very Ground Current Longer B


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TC1269
300mA CMOS with Shutdown VREF Bypass
Very Ground Current Longer Battery Life Very Dropout Voltage 300mA Output Circuit High Output Voltage Accuracy Standard Custom Output Voltages Power Saving Shutdown Mode Bypass Input Ultra Quiet Operation Over Current Over Temperature Protection Space-Saving MSOP Package
General Description
TC1269 fixed output, high accuracy (typically ±0.5%) CMOS upgrade older (bipolar) dropout regulators. Total supply current typically 50µA full load times lower than bipolar regulators). TC1269 features include ultra noise operation (plus optional Bypass input); very dropout voltage (typically 240mV full load), fast response step changes load. Supply current reduced 0.05µA (typical) VOUT falls zero when shutdown input low. TC1269 incorporates both over temperature over current protection. TC1269 stable with output capacitor only maximum output current 300mA.
Applications
Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulator SMPS Pagers Digital Cameras
Typical Application
VOUT VOUT
SHDN
Shutdown Control (from Power Control Logic)
TC1269
Bypass
Device Selection Table
Part Number TC1269-2.5VUA TC1269-2.8VUA TC1269-3.0VUA TC1269-3.3VUA TC1269-5.0VUA Output* Voltage Package Junction Temp. Range
CBYPASS 470pF (Optional)
8-Pin MSOP -40°C +125°C 8-Pin MSOP -40°C +125°C 8-Pin MSOP -40°C +125°C 8-Pin MSOP -40°C +125°C 8-Pin MSOP -40°C +125°C
*Other output voltages available. Please contact Microchip Technology Inc. details.
Package Type
8-Pin MSOP
VOUT
SHDN Bypass
TC1269
2002 Microchip Technology Inc.
DS21380B-page
TC1269
ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only functional operation device these other conditions above those indicated operation sections specifications implied. Exposure Absolute Maximum Rating conditions extended periods affect device reliability.
Absolute Maximum Ratings*
Input Voltage .6.5V Output Voltage. (VSS 0.3) (VIN 0.3V) Maximum Voltage +0.3V -0.3V Power Dissipation.Internally Limited (Note Operating Temperature -40°C +125°C Storage Temperature. -65°C +150°C
TC1269 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VOUT 0.1µA, 3.3µF, SHDN VIH, 25°C, unless otherwise noted. Boldface type specifications apply junction temperatures -40°C +125°C. Symbol IOUTMAX VOUT OUT/T VOUT/VIN -VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Dropout Voltage Units Note Test Conditions
±0.5% 2.5% 2.5% 0.05 0.05 0.04 0.35
ppm/°C Note 0.1mA IOUT 0.1mA 100mA 300mA (Note SHDN SHDN 120Hz VOUT Note
VOUT/VOUT Load Regulation
ISS1 ISS2 PSRR IOUTSC OUT/PD SHDN Input
Note
Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise SHDN Input High Threshold SHDN Input Threshold
regulator output voltage setting. VOUT (VOUTMAX VOUTMIN) VOUT
nV/Hz 1kHz, 1µF, LOAD %VIN %VIN
Regulation measured constant junction temperature using duty cycle pulse testing. Load regulation tested over load range from 0.1mA maximum specified output current. Changes output voltage heating effects covered thermal regulation specification. Dropout voltage defined input output differential which output voltage drops below nominal value measured differential. Thermal Regulation defined change output voltage time after change power dissipation applied, excluding load line regulation effects. Specifications current pulse equal ILMAX msec. maximum allowable power dissipation function ambient temperature, maximum allowable junction temperature thermal resistance from junction-to-air (i.e., JA). Exceeding maximum allowable power dissipation causes device initiate thermal shutdown. Please Section Thermal Considerations more details.
DS21380B-page
2002 Microchip Technology Inc.
TC1269
DESCRIPTIONS
descriptions pins listed Table 2-1.
TABLE 2-1:
(8-Pin SOIC)
FUNCTION TABLE
Symbol VOUT Bypass SHDN Regulated voltage output. connect. connect. Ground terminal. Reference bypass input. Connecting 470pF this input further reduces output noise. connect. Shutdown control input. regulator fully enabled when logic high applied this input. regulator fully enabled when logic high applied this input. regulator enters shutdown when logic applied this input. During shutdown, output voltage falls zero supply current reduced 0.05µA (typical). Unregulated supply input. Description
2002 Microchip Technology Inc.
DS21380B-page
TC1269
DETAILED DESCRIPTION
Bypass Input
TC1269 precision regulator available fixed voltages. Unlike bipolar regulators, TC1269 supply current does increase with load current. addition, VOUT remains stable within regulation over entire IOUTMAX operating load current range, important consideration CMOS battery backup applications). Figure shows typical application circuit. regulator enabled time shutdown input (SHDN) above VIH, shutdown (disabled) when SHDN below VIL. SHDN controlled CMOS logic gate, port microcontroller. SHDN input required, should connected directly input supply. While shutdown, supply current decreases 0.05µA (typical), VOUT falls zero. 470pF capacitor connected from Bypass input ground reduces noise present internal reference, which turn significantly reduces output noise. output noise concern, this input left unconnected. Larger capacitor values used, results longer time period rated output voltage when power initially applied.
Output Capacitor
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
VOUT Battery
VOUT
SHDN
TC1269
Bypass
Shutdown Control (from Power Control Logic)
(min) capacitor from VOUT ground recommended. output capacitor should have effective series resistance greater than less than 5.0, resonant frequency above 1MHz. capacitor should connected from there more than inches wire between regulator filter capacitor, battery used power source. Aluminum electrolytic tantalum capacitor types used. (Since many aluminum electrolytic capacitors freeze approximately -30°C, solid tantalums recommended applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection transient response improved increasing value input output capacitors employing passive filtering techniques.
CBYPASS 470pF (Optional)
DS21380B-page
2002 Microchip Technology Inc.
TC1269
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation used conjunction with Equation ensure regulator thermal operation within limits. example: Given: VINMAX ILOAD TAMAX 3.0V 250mA 55°C VOUTMIN 2.7V 2.5%
Integrated thermal protection circuitry shuts regulator when temperature exceeds 150°C. regulator remains until temperature drops approximately 140°C.
Power Dissipation
amount power regulator dissipates primarily function input output voltage, output current. following equation used calculate worst case actual power dissipation:
Find: Actual power dissipation Maximum allowable dissipation Actual power dissipation: (VINMAX VOUTMIN) ILOADMAX [(3.0 1.1) (2.7 .975)]250 10-3 167mW Maximum allowable power dissipation: PDMAX (TJMAX TAMAX) (125 350mW this example, TC1269 dissipates maximum 167mW; below allowable limit 350mW. similar manner, Equation Equation used calculate maximum current and/or input voltage limits.
EQUATION 4-1:
(VINMAX VOUTMIN)ILOAD Where: VINMAX VOUTMIN ILOADMAX Worst case actual power dissipation Maximum voltage Minimum regulator output voltage Maximum output (load) current
maximum allowable power dissipation (Equation 4-2) function maximum ambient temperature (TAMAX), maximum allowable temperature (TJMAX) thermal resistance from junction-to-air (JA).
EQUATION 4-2:
PDMAX (TJMAX TAMAX) Where terms previously defined.
Layout Considerations
primary path heat conduction package package leads. Therefore, layouts having ground plane, wide traces pads, wide power supply lines combine lower and, therefore, increase maximum allowable power dissipation limit.
2002 Microchip Technology Inc.
DS21380B-page
TC1269
Note:
TYPICAL CHARACTERISTICS
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Line Regulation
0.012 0.010 10.0
Output Noise
2.00 RLOAD COUT 1.80
Load Regulation
LOAD REGULATION
LINE REGULATION
1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 100mA 50mA 300mA
NOISE (µV/HZ)
0.008 0.006 0.004 0.002 0.000 -0.002 -0.004 -40° -20° 100° 120° TEMPERATURE (°C)
0.01
0.01
1000
0.00 -40° -20° 100° 120° TEMPERATURE (°C)
FREQUENCY (kHz)
Supply Current
100.0
DROPOUT VOLTAGE SUPPLY CURRENT (µA)
Dropout Voltage Load Current
0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 LOAD CURRENT (mA) -40°C 125°C 85°C 70°C 25°C
VOUT
VOUT Temperature
3.075 ILOAD 100µA CLOAD 3.3µF
90.0 80.0 70.0 60.0 50.0 40.0 -40° -20° 100° 120° TEMPERATURE (°C)
3.025
2.975
2.925 -40° -20° 100° 120° TEMPERATURE (°C)
DS21380B-page
2002 Microchip Technology Inc.
TC1269
PACKAGING INFORMATION
Package Marking Information
Package marking data available this time.
Taping Form
Component Taping Orientation 8-Pin MSOP Devices
User Direction Feed
Standard Reel Component Orientation Suffix Device
Carrier Tape, Number Components Reel Reel Size
Package Carrier Width Pitch Part Full Reel Reel Size
8-Pin MSOP
2500
Package Dimensions
8-Pin MSOP
.122 (3.10) .114 (2.90)
.197 (5.00) .189 (4.80)
.026 (0.65) TYP.
.122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05)
MAX. .028 (0.70) .016 (0.40)
.008 (0.20) .005 (0.13)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21380B-page
TC1269
NOTES:
DS21380B-page
2002 Microchip Technology Inc.
TC1269
SALES SUPPORT
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2002 Microchip Technology Inc.
DS21380B-page
TC1269
NOTES:
DS21380B-page
2002 Microchip Technology Inc.
TC1269
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, MATE, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode Total Endurance trademarks Microchip Technology Incorporated U.S.A. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2002, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
Printed recycled paper.
Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999 Mountain View, California March 2002. Company's quality system processes procedures QS-9000 compliant PICmicro 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001 certified.
2002 Microchip Technology Inc.
DS21380B-page
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05/01/02
DS21380B-page
2002 Microchip Technology Inc.
*08312SD*

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