500mA Fixed Output, Fast Response CMOS with Shutdown Very Dropout

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500mA Fixed Output, Fast Response CMOS with Shutdown Very Dropout

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TC1268
500mA Fixed Output, Fast Response CMOS with Shutdown
Very Dropout Voltage 500mA Output Current High Output Voltage Accuracy Standard Custom Output Voltages Over Current Over Temperature Protection SHDN Input Active Power Management ERROR Output Detect Battery 5µsec (typical) Wake-up Time from SHDN
General Description
TC1268 fixed output, fast turn-on, high accuracy (typically ±0.5%) CMOS dropout regulator. Designed specifically battery-operated systems, TC1268's CMOS construction eliminates wasted ground current, significantly extending battery life. Total supply current typically 80µA full load times lower than bipolar regulators). TC1268's features include ultra noise, very dropout voltage (typically 350mV full load), fast response step changes load. TC1268 also fast wake-up response time (5µsec typically) when released from shutdown. TC1268 incorporates both over temperature over current protection. TC1268 stable with output capacitor only maximum output current 500mA.
Applications
RAMBUS Memory Module Battery-Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulator SMPS Pagers Digital Cameras
Typical Application
VOUT VOUT COUT SHDN
TC1268
SHDN
Device Selection Table
Part Number TC1268-2.5VOA Output* Voltage Package Junction Temp. Range
8-Pin SOIC -40°C +125°C
*Other output voltages package options available. Please contact Microchip Technology Inc. details.
Package Type
8-Pin SOIC
VOUT BYPASS SHDN ERROR
TC1268
2002 Microchip Technology Inc.
DS21379B-page
TC1268
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .6.5V Power Dissipation.Internally Limited (Note Maximum Voltage +0.3V -0.3V Operating Temperature -40°C +125°C Storage Temperature. -65°C +150°C
*Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only functional operation device these other conditions above those indicated operation sections specifications implied. Exposure Absolute Maximum Rating conditions extended periods affect device reliability.
TC1268 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VOUT 100µA, 3.3µF, SHDN 25°C, unless otherwise noted. Boldface type specifications apply junction temperatures -40°C +125°C. Symbol IOUTMAX VOUT VOUT/T VOUT/VIN VOUT/VOUT VIN-VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage 2.5% 0.35 0.01 Units ppm/°C %/mA Note Note 0.1mA IOUTMAX (Note 100µA 100mA 300mA 500mA (Note SHDN VIH, SHDN 3.5V, VOUT 2.5V COUT 250mA (See Figure 3-2) 3.5V, VOUT 2.5V COUT 250mA (See Figure 3-2) 1kHz VOUT Note IOUTMAX Test Conditions Note
±0.5% 2.5% 0.05 0.002
ISHDN
Supply Current (Active Mode) Supply Current (Shutdown Mode) Wake-up Time (from Shutdown Mode)
µsec
Settling Time (from Shutdown Mode)
µsec
PSRR IOUTSC VOUT/PD SHDN Input
Note
Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise SHDN Input High Threshold SHDN Input Threshold
regulator output voltage setting. VOUT (VOUTMAX VOUTMIN) VOUT
1200 0.04
1400
nV/Hz %VIN %VIN
Regulation measured constant junction temperature using duty cycle pulse testing. Load regulation tested over load range from 0.1mA maximum specified output current. Changes output voltage heating effects covered thermal regulation specification. Dropout voltage defined input output differential which output voltage drops below nominal value measured differential. Thermal Regulation defined change output voltage time after change power dissipation applied, excluding load line regulation effects. Specifications current pulse equal ILMAX msec. maximum allowable power dissipation function ambient temperature, maximum allowable junction temperature thermal resistance from junction-to-air (i.e., JA). Exceeding maximum allowable power dissipation causes device initiate thermal shutdown. Please Section Thermal Considerations more details. Hysteresis voltage referenced minimum justify conditions: VDROPOUT 2.7V 0.1mA IOUTMAX.
DS21379B-page
2002 Microchip Technology Inc.
TC1268
TC1268 ELECTRICAL SPECIFICATIONS (CONTINUED)
Electrical Characteristics: VOUT 100µA, 3.3µF, SHDN 25°C, unless otherwise noted. Boldface type specifications apply junction temperatures -40°C +125°C. ERROR Output VMIN
Note
Minimum Operating Voltage Output Logic Voltage ERROR Threshold Voltage
regulator output voltage setting. VOUT (VOUTMAX VOUTMIN) VOUT
0.95
Flows ERROR
Regulation measured constant junction temperature using duty cycle pulse testing. Load regulation tested over load range from 0.1mA maximum specified output current. Changes output voltage heating effects covered thermal regulation specification. Dropout voltage defined input output differential which output voltage drops below nominal value measured differential. Thermal Regulation defined change output voltage time after change power dissipation applied, excluding load line regulation effects. Specifications current pulse equal ILMAX msec. maximum allowable power dissipation function ambient temperature, maximum allowable junction temperature thermal resistance from junction-to-air (i.e., JA). Exceeding maximum allowable power dissipation causes device initiate thermal shutdown. Please Section Thermal Considerations more details. Hysteresis voltage referenced minimum justify conditions: VDROPOUT 2.7V 0.1mA IOUTMAX.
2002 Microchip Technology Inc.
DS21379B-page
TC1268
DESCRIPTIONS
descriptions pins listed Table 2-1.
TABLE 2-1:
(8-Pin SOIC)
FUNCTION TABLE
Symbol VOUT BYPASS ERROR SHDN Regulated voltage output. Ground terminal. connect. Reference bypass input. Connecting 470pF this input further reduces output noise. Out-of-Regulation Flag. (Open drain output). This output goes when VOUT out-of-tolerance approximately -5%. Shutdown control input. regulator fully enabled when logic high applied this input. regulator enters shutdown when logic applied this input. During shutdown, output voltage falls zero supply current reduced (typical). connect. Unregulated supply input. Description
DETAILED DESCRIPTION
TC1268 precision, fixed output LDO. Unlike bipolar regulators, TC1268 supply current does increase with load current. addition, VOUT remains stable within regulation over entire ILOAD load current range, important consideration CMOS battery back-up applications). Figure shows typical application circuit.
total turn response defined Settling Time (TS), Figure 3-2. Settling Time (inclusive with TWK) defined condition when output within fully enabled value (15µsec typical) when released from shutdown. settling time output voltage dependent load conditions output capacitance VOUT response). Wake-up Time (TWK) important parameter consider when using TC1268 RAMBUS applications. this application, voltage held 2.5V switching regulator during normal power conditions switched power mode, where TC1268 takes over supplies same 2.5V, much lower current (300mA). order voltage drop during transition from high power power, TC1268 very fast wake-up time 5µsec support 2.5V rail. This makes TC1268 ideal applications involving RAMBUS.
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
VOUT VOUT COUT SHDN ERROR 0.2µF
Battery
TC1268
SHDN
CBYP 10nF
FIGURE 3-2:
WAKE-UP RESPONSE TIME
required only ERROR used processor RESET signal (See Text)
Turn Response
SHDN
turn response defined separate response categories, Wake-up Time (TWK) Settling Time (TS). TC1268 fast Wake-up Time (5µsec typical) when released from shutdown. Figure Wake-up Time designated TWK. Wake-up Time defined time takes output rise VOUT value after being released from shutdown.
VOUT
DS21379B-page
2002 Microchip Technology Inc.
TC1268
Bypass Input ERROR Output
10nF capacitor connected from bypass input ground reduces noise present internal reference, which turn, significantly reduces output noise. output noise concern, this input left unconnected. Larger capacitor values used, this results longer time period achieve rated output voltage, once power initially applied. ERROR driven whenever VOUT falls regulation more than (typical). This condition caused input voltage, output current limiting, thermal limiting. ERROR threshold below rated VOUT, regardless programmed output voltage value (e.g., ERROR 2.375V (typ.) 2.5V regulator). ERROR output operation shown Figure 3-3. Note that ERROR active when VOUT below VTH, inactive when VOUT above shown Figure 3-1, ERROR used battery flag, processor RESET signal (with addition timing capacitor C1). should chosen maintain ERROR below processor RESET input least 200msec allow time system stabilize. Pull-up resistor tied VOUT, other voltage less than (VIN 0.3V).
Output Capacitor
(min) capacitor from VOUT ground required. output capacitor should have effective series resistance greater than less than resonant frequency above 1MHz. capacitor should connected from there more than inches wire between regulator filter capacitor, battery used power source. Aluminum electrolytic tantalum capacitor types used. (Since many aluminum electrolytic capacitors freeze approximately -30°C, solid tantalums recommended applications operating below -25°C.) When operating from sources other than batteries, supply noise rejection transient response improved increasing value input output capacitors employing passive filtering techniques.
FIGURE 3-3:
VOUT
ERROR OUTPUT OPERATION
Hysteresis (VH)
ERROR
2002 Microchip Technology Inc.
DS21379B-page
TC1268
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation used conjunction with Equation ensure regulator thermal operation within limits. example: Given: VINMAX 3.3V VOUTMIN 2.5V 0.5% ILOADMAX 275mA TJMAX TAMAX 125°C 95°C 60°C/W
Integrated thermal protection circuitry shuts regulator when temperature exceeds 160°C. regulator remains until temperature drops approximately 150°C.
Power Dissipation
amount power regulator dissipates primarily function input output voltage, output current. following equation used calculate worst case actual power dissipation:
Find: Actual power dissipation Maximum allowable dissipation Actual power dissipation: (VINMAX VOUTMIN)ILOADMAX [(3.3 1.1) (2.5 .995)]275 10-3 314mW Maximum allowable power dissipation: PDMAX (TJMAX TAMAX) (125 500mW this example, TC1268 dissipates maximum 314mW; below allowable limit 500mW. similar manner, Equation Equation used calculate maximum current and/or input voltage limits. example, maximum allowable found substituting maximum allowable power dissipation 500mW into Equation 4-1, from which VINMAX 3.94V.
EQUATION 4-1:
(VINMAX VOUTMIN)ILOADMAX Where: Worst case actual power dissipation VINMAX Maximum voltage VOUTMIN Minimum regulator output voltage ILOADMAX Maximum output (load) current maximum allowable power dissipation (Equation 4-2) function maximum ambient temperature (TAMAX), maximum allowable temperature (TJMAX) thermal resistance from junction-to-air (JA).
EQUATION 4-2:
PDMAX (TJMAX TAMAX) Where terms previously defined. Table shows various values TC1268 package.
TABLE 4-1:
THERMAL RESISTANCE GUIDELINES TC1268 8-PIN SOIC PACKAGE
Copper Area (Backside) Board Area Thermal Resistance (JA) 60°C/W 60°C/W 68°C/W 74°C/W
Copper Area (Topside)*
2500 2500 2500 1000 2500 2500 2500 2500 2500 2500
*Pin ground. Device mounted topside.
DS21379B-page
2002 Microchip Technology Inc.
TC1268
Note:
TYPICAL CHARACTERISTICS
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Fast Response TC1268
Fast Response TC1268
SHDN
Conditions: VOUT 2.50V 3.50V COUT RLOAD
SHDN
Conditions: VOUT 2.50V 3.50V COUT RLOAD
VOUT
VOUT
100µsec/DIV; 15µsec Rise Time
10µsec/DIV; 15µsec Rise Time
2002 Microchip Technology Inc.
DS21379B-page
TC1268
PACKAGING INFORMATION
Package Marking Information
Package marking data available this time.
Taping Form
Component Taping Orientation 8-Pin SOIC (Narrow) Devices
User Direction Feed
Standard Reel Component Orientation Suffix Device
Carrier Tape, Number Components Reel Reel Size
Package Carrier Width Pitch Part Full Reel Reel Size
8-Pin SOIC
2500
Package Dimensions
8-Pin SOIC
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) TYP.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) MAX. .050 (1.27) .016 (0.40) Dimensions: inches (mm) .010 (0.25) .007 (0.18)
DS21379B-page
2002 Microchip Technology Inc.
TC1268
SALES SUPPORT
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2002 Microchip Technology Inc.
DS21379B-page
TC1268
NOTES:
DS21379B-page
2002 Microchip Technology Inc.
TC1268
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, MATE, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode Total Endurance trademarks Microchip Technology Incorporated U.S.A. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2002, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
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2002 Microchip Technology Inc.
DS21379B-page
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05/01/02
DS21379B-page
2002 Microchip Technology Inc.
*B97312SD*

500mA Fixed Output, Fast Response CMOS with Shutdown Very Dropout

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