300mA CMOS with Shutdown VREF Bypass Extremely Supply Current (50

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300mA CMOS with Shutdown VREF Bypass Extremely Supply Current (50

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TC1174
300mA CMOS with Shutdown VREF Bypass
Extremely Supply Current (50µA, Typ.) Very Dropout Voltage 300mA Output Current Adjustable Output Voltages Power Saving Shutdown Mode Bypass Input Ultra Quiet Operation Over Current Over Temperature Protection Space-Saving MSOP Package Option
General Description
TC1174 adjustable output CMOS dropout regulator. Total supply current typically 50µA full load times lower than bipolar regulators). TC1174 features include ultra noise operation (plus optional Bypass input); very dropout voltage (typically 270mV full load) internal feed-forward compensation fast response step changes load. Supply current reduced 0.05µA (typical) VOUT falls zero when shutdown input low. TC1174 incorporates both over temperature over current protection. TC1174 stable with output capacitor only maximum output current 300mA.
Applications
Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators SMPS Pagers
Typical Application
VOUT
470K
Device Selection Table
Part Number TC1174VOA TC1174VUA Output Voltage Adjustable Package 8-Pin SOIC Junction Temp. Range -40°C +125°C
TC1174
SHDN Shutdown Control (from Power Control Logic) CBYPASS 470pF (Optional) VOUT VREF
470K
Bypass
Adjustable 8-Pin MSOP -40°C +125°C
Package Type
8-Pin MSOP VOUT
SHDN Bypass
TC1174VUA
8-Pin SOIC VOUT
TC1174VOA SHDN Bypass
2002 Microchip Technology Inc.
DS21363B-page
TC1174
ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only functional operation device these other conditions above those indicated operation sections specifications implied. Exposure Absolute Maximum Rating conditions extended periods affect device reliability.
Absolute Maximum Ratings*
Input Voltage .6.5V Output Voltage. (VSS 0.3V) (VIN 0.3V) Power Dissipation.Internally Limited (Note Maximum Voltage +0.3V -0.3V Operating Temperature Range. -40°C 125°C Storage Temperature. -65°C +150°C
TC1174 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VOUT 0.1µA, 3.3µF, SHDN 25°C, unless otherwise noted. Boldface type specifications apply junction temperatures -40°C +125°C. Symbol IOUTMAX VREF VOUT/T VOUT/VIN VOUT/VOUT VIN-VOUT Parameter Input Operating Voltage Maximum Output Current Reference Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage 1.165 1.20 0.05 0.05 0.04 1.235 0.35 Units ppm/°C Note 0.1mA IOUTMAX (Note 0.1mA 100mA 300mA (Note SHDN SHDN 1kHz VOUT Note 10kHz, IOUTMAX 470pF from Bypass Note Test Conditions
ISS1 ISS2 PSRR IOUTSC VOUT/PD SHDN Input Input IADJ
Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise
nV/Hz
SHDN Input High Threshold SHDN Input Threshold Adjustable Input Leakage Current
%VIN %VIN
VOUT (VOUT VOUT MIN) VOUT Regulation measured constant junction temperature using duty cycle pulse testing. Load regulation tested over load range from 0.1mA maximum specified output current. Changes output voltage heating effects covered thermal regulation specification. Dropout voltage defined input output differential which output voltage drops below nominal value measured differential. Thermal Regulation defined change output voltage time after change power dissipation applied, excluding load line regulation effects. Specifications current pulse equal ILMAX msec. maximum allowable power dissipation function ambient temperature, maximum allowable junction temperature thermal resistance from junction-to-air (i.e., JA). Exceeding maximum allowable power dissipation causes device initiate thermal shutdown. Please Section Thermal Considerations more details. minimum justify conditions: VDROPOUT 2.7V 0.1mA MAX.
DS21363B-page
2002 Microchip Technology Inc.
TC1174
DESCRIPTIONS
descriptions pins listed Table 2-1.
TABLE 2-1:
(8-Pin SOIC) (8-Pin MSOP)
FUNCTION TABLE
Symbol VOUT Bypass SHDN Regulated voltage output. Ground terminal. connect. Output voltage adjust terminal. Output voltage setting programmed with resistor divider from VOUT this input. capacitor also added this input reduce output noise. Reference bypass input. Connecting 470pF this input further reduces output noise. Shutdown control input. regulator fully enabled when logic high applied this input. regulator enters shutdown when logic applied this input. During shutdown, output voltage falls zero supply current reduced 0.05µA (typical). connect. Unregulated supply input. Description
2002 Microchip Technology Inc.
DS21363B-page
TC1174
DETAILED DESCRIPTION
Bypass Input
TC1174 adjustable drop-out regulator. Unlike bipolar regulators, TC1174's supply current does increase with load current. addition, VOUT remains stable within regulation over entire IOUTMAX operating load current range, important consideration CMOS battery back-up applications). Figure shows typical application circuit. regulator enabled time shutdown input (SHDN) above VIH, shutdown (disabled) when SHDN below VIL. SHDN controlled CMOS logic gate, port microcontroller. SHDN input required, should connected directly input supply. While shutdown, supply current decreases 0.05µA (typical), VOUT falls zero. 470pF capacitor connected from Bypass input ground reduces noise present internal reference, which turn significantly reduces output noise. output noise concern, this input left unconnected. Larger capacitor values used, results longer time period rated output voltage when power initially applied.
Output Capacitor
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
VOUT Battery Shutdown Control (from Power Control Logic) CBYPASS 470pF (Optional)
VOUT
470K
TC1174
SHDN
(min) capacitor from VOUT ground required. output capacitor should have effective series resistance greater than less than 5.0. capacitor should connected from there more than inches wire between regulator filter capacitor, battery used power source. Aluminum electrolytic tantalum capacitor types used. (Since many aluminum electrolytic capacitors freeze approximately -30°C, solid tantalums recommended applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection transient response improved increasing value input output capacitors employing passive filtering techniques.
Adjust Input
470K
Bypass
output voltage setting determined values (Figure 3-1). ohmic values these resistors should between 470K minimize bleeder current. output voltage setting calculated using following equation.
EQUATION 3-1:
VOUT VREF
voltage adjustment range TC1174 from VREF (VIN 0.05V).
DS21363B-page
2002 Microchip Technology Inc.
TC1174
THERMAL CONSIDERATIONS
Thermal Shutdown
EQUATION 4-2:
PDMAX (TJMAX TAMAX) Where terms previously defined. Equation used conjunction with Equation ensure regulator thermal operation within limits. example: Given: VINMAX 3.0V VOUTMIN 2.7V 0.5% ILOADMAX 250mA 125°C TJMAX 55°C TAMAX 8-Pin MSOP Package Find: Actual power dissipation Maximum allowable dissipation Actual power dissipation: (VINMAX VOUTMIN)ILOADMAX [(3.0 1.1) (2.7 .995)]250 10-3 155mW Maximum allowable power dissipation: PDMAX (TJMAX TAMAX) (125 350mW this example, TC1174 dissipates maximum 155mW; below allowable limit 350mW. similar manner, Equation Equation used calculate maximum current and/or input voltage limits. example, maximum allowable found substituting maximum allowable power dissipation 350mW into Equation 4-1, from which VINMAX 4.1V.
Integrated thermal protection circuitry shuts regulator when temperature exceeds 150°C. regulator remains until temperature drops approximately 140°C.
Power Dissipation
amount power regulator dissipates primarily function input output voltage, output current. following equation used calculate worst case actual power dissipation:
EQUATION 4-1:
(VINMAX VOUTMIN)ILOADMAX Where: VINMAX VOUTMIN ILOADMAX Worst case actual power dissipation Maximum voltage Minimum regulator output voltage Maximum output (load) current
maximum allowable power dissipation (Equation 4-2) function maximum ambient temperature (TAMAX), maximum allowable temperature (TJMAX) thermal resistance from junction-to-air (JA). 8-Pin SOIC package approximately 160°C/Watt, while 8-Pin MSOP package approximately 200°C/Watt.
Layout Considerations
primary path heat conduction package package leads. Therefore, layouts having ground plane, wide traces pads, wide power supply lines combine lower therefore increase maximum allowable power dissipation limit.
2002 Microchip Technology Inc.
DS21363B-page
TC1174
Note:
TYPICAL CHARACTERISTICS
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Line Regulation
0.012 0.010 LINE REGULATION 0.008 NOISE (µV/HZ) 0.006 0.004 0.002 0.000 -0.002 -0.004 -40° -20° 100° 120° TEMPERATURE (°C) 0.01 0.01 10.0
Output Noise
2.00 RLOAD COUT LOAD REGULATION 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 1000
Load Regulation
300mA
100mA 50mA
0.00 -40° -20° 100° 120° TEMPERATURE (°C)
FREQUENCY (kHz)
Supply Current
100.0 DROPOUT VOLTAGE SUPPLY CURRENT (µA) 90.0 80.0 70.0 60.0 50.0 40.0 -40° -20° 100° 120° TEMPERATURE (°C)
Dropout Voltage Load Current
0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 LOAD CURRENT (mA) -40°C 125°C 85°C 70°C 25°C VOUT 3.025 3.075
VOUT Temperature
ILOAD 100µA CLOAD 3.3µF
2.975
2.925 -40° -20° 100° 120° TEMPERATURE (°C)
DS21363B-page
2002 Microchip Technology Inc.
TC1174
PACKAGING INFORMATION
Package Marking Information
Package marking data available this time.
Taping Form
Component Taping Orientation 8-Pin MSOP Devices
User Direction Feed
Standard Reel Component Orientation Suffix Device
Carrier Tape, Number Components Reel Reel Size
Package Carrier Width Pitch Part Full Reel Reel Size
8-Pin MSOP
2500
Component Taping Orientation 8-Pin SOIC (Narrow) Devices
User Direction Feed
Standard Reel Component Orientation Suffix Device
Carrier Tape, Number Components Reel Reel Size
Package Carrier Width Pitch Part Full Reel Reel Size
8-Pin SOIC
2500
2002 Microchip Technology Inc.
DS21363B-page
TC1174
Package Dimensions
8-Pin MSOP
.122 (3.10) .114 (2.90)
.197 (5.00) .189 (4.80)
.026 (0.65) TYP.
.122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05)
MAX. .028 (0.70) .016 (0.40)
.008 (0.20) .005 (0.13)
Dimensions: inches (mm)
8-Pin SOIC
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) TYP.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) MAX. .050 (1.27) .016 (0.40) Dimensions: inches (mm) .010 (0.25) .007 (0.18)
DS21363B-page
2002 Microchip Technology Inc.
TC1174
SALES SUPPORT
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2002 Microchip Technology Inc.
DS21363B-page
TC1174
NOTES:
DS21363B-page
2002 Microchip Technology Inc.
TC1174
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, MATE, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode Total Endurance trademarks Microchip Technology Incorporated U.S.A. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2002, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
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2002 Microchip Technology Inc.
DS21363B-page
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05/01/02
DS21363B-page
2002 Microchip Technology Inc.
*36312SD*

300mA CMOS with Shutdown VREF Bypass Extremely Supply Current (50

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