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300mA CMOS with Shutdown ERROR Output Bypass Extremely Supply Cur


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TC1173
300mA CMOS with Shutdown ERROR Output Bypass
Extremely Supply Current Longer Battery Life Very Dropout Voltage 300mA Output Current Standard Custom Output Voltages ERROR Output Used Battery Detector Processor Reset Generator Power Saving Shutdown Mode Bypass Input Ultra Quiet Operation Over Current Over Temperature Protection Space-Saving MSOP Package Option
General Description
TC1173 precision output (typically ±0.5%) CMOS dropout regulator. Total supply current typically 50µA full load times lower than bipolar regulators). TC1173 features include ultra noise operation (plus optional Bypass input); very dropout voltage (typically 240mV full load) internal feed-forward compensation fast response step changes load. error output (ERROR) asserted when TC1173 out-of-regulation (due input voltage excessive output current). ERROR battery warning processor RESET signal (with addition external network). Supply current reduced 0.05µA (typical) VOUT ERROR fall zero when shutdown input low. TC1173 incorporates both over temperature over current protection. TC1173 stable with output capacitor only maximum output current 300mA.
Applications
Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators SMPS Pagers
Typical Application
VOUT
Device Selection Table
Part Number TC1173-xxVOA TC1173-xxVUA Package 8-Pin SOIC 8-Pin MSOP Junction Temp. Range -40°C +125°C -40°C +125°C
VOUT
TC1173
SHDN
NOTE: indicates output voltages Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0. Other output voltages available. Please contact Microchip Technology Inc. details.
Bypass
ERROR
ERROR
CBYPASS 470pF (Optional) Shutdown Control (from Power Control Logic)
Package Type
8-Pin MSOP
VOUT Bypass
8-Pin SOIC
SHDN ERROR VOUT Bypass TC1173VOA SHDN ERROR
TC1173VUA
2002 Microchip Technology Inc.
DS21362B-page
TC1173
ELECTRICAL CHARACTERISTICS
Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only functional operation device these other conditions above those indicated operation sections specifications implied. Exposure Absolute Maximum Rating conditions extended periods affect device reliability.
Absolute Maximum Ratings*
Input Voltage .6.5V Output Voltage. (VSS 0.3V) (VIN 0.3V) Power Dissipation.Internally Limited (Note Maximum Voltage +0.3V -0.3V Operating Temperature Range. -40°C 125°C Storage Temperature. -65°C +150°C
TC1173 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VOUT 0.1mA, 3.3µF, SHDN VIH, 25°C, unless otherwise noted. Boldface type specifications apply junction temperatures -40°C +125°C. Symbol IOUTMAX VOUT VOUT/T VOUT/VIN VOUT/VOUT VIN-VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage 2.5% ±0.5% 0.05 0.05 0.04 2.5% 0.35 Units ppm/°C Note Note 0.1mA IOUTMAX (Note 0.1mA 100mA 300mA (Note SHDN VIH, SHDN 1kHz VOUT Note 1kHz, 1µF, RLOAD Test Conditions Note
ISS1 ISS2 PSRR IOUTSC VOUT/PD SHDN Input ERROR Output VMIN
Note
Supply Current Shutdown Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise
nV/Hz
SHDN Input High Threshold SHDN Input Threshold Minimum Operating Voltage Output Logic Voltage ERROR Threshold Voltage ERROR Positive Hysteresis
0.95
%VIN %VIN Note Flows ERROR
user-programmed regulator output voltage setting. VOUT (VOUT VOUT MIN) VOUT Regulation measured constant junction temperature using duty cycle pulse testing. Load regulation tested over load range from 0.1mA maximum specified output current. Changes output voltage heating effects covered thermal regulation specification. Dropout voltage defined input output differential which output voltage drops below nominal value measured differential. Thermal Regulation defined change output voltage time after change power dissipation applied, excluding load line regulation effects. Specifications current pulse equal ILMAX msec. maximum allowable power dissipation function ambient temperature, maximum allowable junction temperature thermal resistance from junction-to-air (i.e., JA). Exceeding maximum allowable power dissipation causes device initiate thermal shutdown. Please Section Thermal Considerations more details. Hysteresis voltage referenced minimum justify conditions: VDROPOUT 2.7V 0.1mA MAX.
DS21362B-page
2002 Microchip Technology Inc.
TC1173
DESCRIPTIONS
descriptions pins listed Table 2-1.
TABLE 2-1:
(8-Pin SOIC) (8-Pin MSOP)
FUNCTION TABLE
Symbol VOUT Bypass ERROR SHDN Regulated voltage output. Ground terminal. connect. Reference bypass input. Connecting 470pF this input further reduces output noise. Out-of-Regulation Flag. (Open drain output). This output goes when VOUT out-of-tolerance approximately Shutdown control input. regulator fully enabled when logic high applied this input. regulator enters shutdown when logic applied this input. During shutdown, output voltage falls zero supply current reduced 0.05µA (typical). connect. Unregulated supply input. Description
2002 Microchip Technology Inc.
DS21362B-page
TC1173
DETAILED DESCRIPTION
FIGURE 3-2:
TC1173 fixed output, drop-out regulator. Unlike bipolar regulators, TC1173's supply current does increase with load current. addition, VOUT remains stable within regulation over entire IOUTMAX operating load current range, important consideration CMOS battery back-up applications). Figure shows typical application circuit. regulator enabled time shutdown input (SHDN) above VIH, shutdown (disabled) when SHDN below VIL. SHDN controlled CMOS logic gate, port microcontroller. SHDN input required, should connected directly input supply. While shutdown, supply current decreases 0.05µA (typical), VOUT falls zero ERROR disabled.
ERROR OUTPUT OPERATION
VOUT HYSTERESIS (VH)
ERROR
Output Capacitor
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
VOUT Battery
VOUT
TC1173
SHDN
Bypass
ERROR
RESET Battery 0.2µF
(min) capacitor from VOUT ground recommended. output capacitor should have effective series resistance greater than less than 5.0. capacitor should connected from there more than inches wire between regulator filter capacitor, battery used power source. Aluminum electrolytic tantalum capacitor types used. (Since many aluminum electrolytic capacitors freeze approximately -30°C, solid tantalums recommended applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection transient response improved increasing value input output capacitors employing passive filtering techniques.
Shutdown Control (from Power Control Logic)
Bypass Input
CBYPASS 470pF (Optional)
required only ERROR used processor RESET signal. (see text)
ERROR Output
ERROR driven whenever VOUT falls regulation more than (typical). This condition caused input voltage, output current limiting, thermal limiting. ERROR threshold below rated VOUT regardless programmed output voltage value (e.g., ERROR 4.75V (typ.) 5.0V regulator 2.85V (typ.) 3.0V regulator). ERROR output operation shown Figure 3-2. Note that ERROR active when VOUT below VTH, inactive when VOUT above shown Figure 3-1, ERROR used battery flag, processor RESET signal (with addition timing capacitor C3). should chosen maintain ERROR below processor RESET input least msec allow time system stabilize. Pull-up resistor tied VOUT, other voltage less than (VIN 0.3V).
470pF capacitor connected from Bypass input ground reduces noise present internal reference, which turn significantly reduces output noise. output noise concern, this input left unconnected. Larger capacitor values used, results longer time period rated output voltage when power initially applied.
DS21362B-page
2002 Microchip Technology Inc.
TC1173
THERMAL CONSIDERATIONS
Thermal Shutdown
EQUATION 4-2:
PDMAX (TJMAX TAMAX) Where terms previously defined. Equation used conjunction with Equation ensure regulator thermal operation within limits. example: Given: VINMAX 3.0V VOUTMIN 2.7V 0.5% ILOADMAX 250mA 125°C TJMAX 55°C TAMAX 200°C/W 8-Pin MSOP Package Find: Actual power dissipation Maximum allowable dissipation Actual power dissipation: (VINMAX VOUTMIN)ILOADMAX [(3.0 1.1) (2.7 .995)]250 10-3 155mW Maximum allowable power dissipation: PDMAX (TJMAX TAMAX) (125 350mW this example, TC1173 dissipates maximum 155mW; below allowable limit 350mW. similar manner, Equation Equation used calculate maximum current and/or input voltage limits. example, maximum allowable found substituting maximum allowable power dissipation 250mW into Equation 4-1, from which VINMAX 4.1V.
Integrated thermal protection circuitry shuts regulator when temperature exceeds 150°C. regulator remains until temperature drops approximately 140°C.
Power Dissipation
amount power regulator dissipates primarily function input output voltage, output current. following equation used calculate worst case actual power dissipation:
EQUATION 4-1:
(VINMAX VOUTMIN)ILOADMAX Where: VINMAX VOUTMIN ILOADMAX Worst case actual power dissipation Maximum voltage Minimum regulator output voltage Maximum output (load) current
maximum allowable power dissipation (Equation 4-2) function maximum ambient temperature (TAMAX), maximum allowable temperature (TJMAX) thermal resistance from junction-to-air (JA). 8-Pin SOIC package approximately 160°C/Watt, while 8-Pin MSOP package approximately 200°C/Watt.
Layout Considerations
primary path heat conduction package package leads. Therefore, layouts having ground plane, wide traces pads, wide power supply lines combine lower therefore increase maximum allowable power dissipation limit.
2002 Microchip Technology Inc.
DS21362B-page
TC1173
Note:
TYPICAL CHARACTERISTICS
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Line Regulation
0.012 0.010 LINE REGULATION NOISE (µV/HZ) 0.008 0.006 0.004 0.002 0.000 -0.002 -0.004 -40° -20° 100° 120° TEMPERATURE (°C) 0.01 0.01 10.0
Output Noise
2.00 RLOAD COUT LOAD REGULATION 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 1000
Load Regulation
300mA
100mA 50mA
0.00 -40° -20° 100° 120° TEMPERATURE (°C)
FREQUENCY (kHz)
Supply Current
100.0 DROPOUT VOLTAGE SUPPLY CURRENT (µA) 90.0 80.0 70.0 60.0 50.0 40.0 -40° -20° 100° 120° TEMPERATURE (°C)
Dropout Voltage Load Current
0.40 0.35 0.30 0.25 0.20 0.15 0.10 0.05 0.00 LOAD CURRENT (mA) -40°C 125°C 85°C 70°C 25°C VOUT 3.025 3.075
VOUT Temperature
ILOAD 100µA CLOAD 3.3µF
2.975
2.925 -40° -20° 100° 120° TEMPERATURE (°C)
DS21362B-page
2002 Microchip Technology Inc.
TC1173
PACKAGING INFORMATION
Package Marking Information
Package marking data available this time.
Taping Form
Component Taping Orientation 8-Pin MSOP Devices
User Direction Feed
Standard Reel Component Orientation Suffix Device
Carrier Tape, Number Components Reel Reel Size
Package Carrier Width Pitch Part Full Reel Reel Size
8-Pin MSOP
2500
Component Taping Orientation 8-Pin SOIC (Narrow) Devices
User Direction Feed
Standard Reel Component Orientation Suffix Device
Carrier Tape, Number Components Reel Reel Size
Package Carrier Width Pitch Part Full Reel Reel Size
8-Pin SOIC
2500
2002 Microchip Technology Inc.
DS21362B-page
TC1173
Package Dimensions
8-Pin MSOP
.122 (3.10) .114 (2.90)
.197 (5.00) .189 (4.80)
.026 (0.65) TYP.
.122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05)
MAX. .028 (0.70) .016 (0.40)
.008 (0.20) .005 (0.13)
Dimensions: inches (mm)
8-Pin SOIC
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) TYP.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) MAX. .050 (1.27) .016 (0.40) Dimensions: inches (mm) .010 (0.25) .007 (0.18)
DS21362B-page
2002 Microchip Technology Inc.
TC1173
SALES SUPPORT
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2002 Microchip Technology Inc.
DS21362B-page
TC1173
NOTES:
DS21362B-page
2002 Microchip Technology Inc.
TC1173
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, MATE, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode Total Endurance trademarks Microchip Technology Incorporated U.S.A. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2002, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
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Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999 Mountain View, California March 2002. Company's quality system processes procedures QS-9000 compliant PICmicro 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001 certified.
2002 Microchip Technology Inc.
DS21362B-page
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DS21362B-page
2002 Microchip Technology Inc.
*B26312SD*

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