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300mA CMOS Extremely Supply Current (50µA, Typ.) Very Dropout Vol


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TC1108
300mA CMOS
Extremely Supply Current (50µA, Typ.) Very Dropout Voltage 300mA Output Current High Output Voltage Accuracy Standard Custom Output Voltages Over Current Over Temperature Protection
General Description
TC1108 fixed output, high accuracy (typically ±0.5%) CMOS dropout regulator. Total supply current typically 50µA full load times lower than bipolar regulators). TC1108 features include ultra noise operation, very dropout voltage (typically 240mV full load), fast response step changes load. TC1108 incorporates both over temperature over current protection. TC1108 stable with output capacitor only maximum output current 300mA. available SOT-223 package.
Applications
Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators SMPS Pagers
Typical Application
VOUT VOUT
Device Selection Table
Part Number TC1108-xxVDB Package 3-Pin SOT-223 Junction Temp. Range -40°C +125°C
TC1108
NOTE: indicates output voltages Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0. Other output voltages available. Please contact Microchip Technology Inc. details.
Package Type
SOT-223
TC1108VDB
VOUT
2002 Microchip Technology Inc.
DS21357B-page
TC1108
ELECTRICAL CHARACTERISTICS
Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only functional operation device these other conditions above those indicated operation sections specifications implied. Exposure Absolute Maximum Rating conditions extended periods affect device reliability.
Absolute Maximum Ratings*
Input Voltage .6.5V Output Voltage. (VSS 0.3V) (VIN 0.3V) Power Dissipation.Internally Limited (Note Maximum Voltage +0.3V -0.3V Operating Temperature Range. -40°C 125°C Storage Temperature. -65°C +150°C
TC1108 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VOUT 100µA, 3.3µF, 25°C, unless otherwise noted. Boldface type specifications apply junction temperatures -40°C +125°C. Symbol IOUTMAX VOUT VOUT/T VOUT/VIN VOUT/VOUT VIN-VOUT Parameter Input Operating Voltage Maximum Output Current Output Voltage VOUT Temperature Coefficient Line Regulation Load Regulation Dropout Voltage 2.5% ±0.5% 0.05 0.04 2.5% 0.35 Units Note Note Test Conditions
ppm/°C Note 0.1mA IOUTMAX (Note 0.1mA 100mA 300mA (Note 1kHz VOUT Note
PSRR IOUTSC VOUT/PD
Note
Supply Current Power Supply Rejection Ratio Output Short Circuit Current Thermal Regulation Output Noise
nV/Hz 10kHz, COUT 1µF, RLOAD
regulator output voltage setting. VOUT (VOUT VOUT MIN) VOUT Regulation measured constant junction temperature using duty cycle pulse testing. Load regulation tested over load range from 0.1mA maximum specified output current. Changes output voltage heating effects covered thermal regulation specification. Dropout voltage defined input output differential which output voltage drops below nominal value measured differential. Thermal Regulation defined change output voltage time after change power dissipation applied, excluding load line regulation effects. Specifications current pulse equal ILMAX msec. maximum allowable power dissipation function ambient temperature, maximum allowable junction temperature thermal resistance from junction-to-air (i.e., JA). Exceeding maximum allowable power dissipation causes device initiate thermal shutdown. Please Section Thermal Considerations more details. minimum justify conditions: VDROPOUT 2.7V 0.1mA MAX.
DS21357B-page
2002 Microchip Technology Inc.
TC1108
DESCRIPTIONS
descriptions pins listed Table 2-1.
TABLE 2-1:
(3-Pin SOT-223)
FUNCTION TABLE
Symbol VOUT Unregulated supply input. Ground terminal. Regulated voltage output. Description
DETAILED DESCRIPTION
Output Capacitor
TC1108 precision, fixed output LDO. Unlike bipolar regulators, TC1108's supply current does increase with load current. addition, VOUT remains stable within regulation over entire IOUTMAX operating load current range, important consideration CMOS battery back-up applications). Figure shows typical application circuit.
FIGURE 3-1:
TYPICAL APPLICATION CIRCUIT
Battery
VOUT
VOUT
TC1108
(min) capacitor from VOUT ground required. output capacitor should have effective series resistance greater than less than 5.0. capacitor should connected from there more than inches wire between regulator filter capacitor, battery used power source. Aluminum electrolytic tantalum capacitor types used. (Since many aluminum electrolytic capacitors freeze approximately -30°C, solid tantalums recommended applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection transient response improved increasing value input output capacitors employing passive filtering techniques.
2002 Microchip Technology Inc.
DS21357B-page
TC1108
THERMAL CONSIDERATIONS
Thermal Shutdown
Equation used conjunction with Equation ensure regulator thermal operation within limits. example: Given: VINMAX 3.3V VOUTMIN 2.7V 0.5% ILOADMAX 275mA TJMAX TAMAX 125°C 95°C 59°C/W
Integrated thermal protection circuitry shuts regulator when temperature exceeds 150°C. regulator remains until temperature drops approximately 140°C.
Power Dissipation
amount power regulator dissipates primarily function input output voltage, output current. following equation used calculate worst case actual power dissipation:
Find: Actual power dissipation Maximum allowable dissipation Actual power dissipation: (VINMAX VOUTMIN)ILOADMAX [(3.3 1.1) (2.7 .995)]275 10-3 260mW Maximum allowable power dissipation: PDMAX (TJMAX TAMAX) (125 508mW this example, TC1108 dissipates maximum 260mW; below allowable limit 508mW. similar manner, Equation Equation used calculate maximum current and/or input voltage limits. example, maximum allowable VIN, found sustituting maximum allowable power dissipation 508mW into Equation 4-1, from which VINMAX 4.6V.
EQUATION 4-1:
(VINMAX VOUTMIN)ILOADMAX Where: VINMAX VOUTMIN ILOADMAX Worst case actual power dissipation Maximum voltage Minimum regulator output voltage Maximum output (load) current
maximum allowable power dissipation (Equation 4-2) function maximum ambient temperature (TAMAX), maximum allowable temperature (TJMAX) thermal resistance from junction-to-air (JA).
EQUATION 4-2:
PDMAX JMAX TAMAX) Where terms previously defined. Table shows various values TC1108 versus board copper area.
TABLE 4-1:
THERMAL RESISTANCE GUIDELINES TC1108
Copper Area (Backside) Board Area Thermal Resistance (JA) 45°C/W 45°C/W 53°C/W 59°C/W 52°C/W 55°C/W
Copper Area (Topside)*
2500 2500 2500 1000 2500 2500 1000 2500 2500 2500 2500 1000
1000 1000 1000
NOTE: *Tab device attached topside copper
DS21357B-page
2002 Microchip Technology Inc.
TC1108
Note:
TYPICAL CHARACTERISTICS
graphs tables provided following this note statistical summary based limited number samples provided informational purposes only. performance characteristics listed herein tested guaranteed. some graphs tables, data presented outside specified operating range (e.g., outside specified power supply range) therefore outside warranted range.
Line Regulation
0.012 0.010 LINE REGULATION 0.008 NOISE (µV/HZ) 0.006 0.004 0.002 0.000 -0.002 -0.004 -40° -20° 100° 120° TEMPERATURE (°C) 0.01 0.01 10.0
Output Noise
2.00 RLOAD COUT LOAD REGULATION 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 1000
Load Regulation
300mA
100mA 50mA
0.00 -40° -20° 100° 120° TEMPERATURE (°C)
FREQUENCY (kHz)
Supply Current
100.0
Dropout Voltage Load Current
0.40 0.35 125°C 85°C 70°C 25°C 0.15 0.10 0.05 0.00 LOAD CURRENT (mA) -40°C 3.025 3.075
VOUT Temperature
ILOAD 100µA CLOAD 3.3µF
DROPOUT VOLTAGE
SUPPLY CURRENT (µA)
90.0 80.0 70.0 60.0 50.0 40.0 -40° -20° 100° 120° TEMPERATURE (°C)
0.30 0.25 0.20
VOUT
2.975 2.925 -40° -20° 100° 120° TEMPERATURE (°C)
2002 Microchip Technology Inc.
DS21357B-page
TC1108
PACKAGING INFORMATION
Package Marking Information
part number code represents temperature date code identity subcontractor identity TC1108 TC1108-2.5VDB TC1108-2.8VDB TC1108-3.0VDB TC1108-3.3VDB TC1108-5.0VDB Code 110825 110828 110830 110833 110850
Taping Form
Component Taping Orientation 3-Pin SOT-223 Devices
User Direction Feed
Device Marking
Standard Reel Component Orientation Suffix Device (Mark Right Side
Carrier Tape, Number Components Reel Reel Size
Package Carrier Width Pitch Part Full Reel Reel Size
3-Pin SOT-223
4000
DS21357B-page
2002 Microchip Technology Inc.
TC1108
Package Dimensions
3-Pin SOT-223
.264 (6.70) .248 (6.30)
.122 (3.10) .114 (2.90)
.287 (7.30) .146 (3.70) .264 (6.70) .130 (3.30)
.091 (2.30) TYP. .031 (0.80) .024 (0.60) .071 (1.80) MAX. .004 (0.10) .001 (0.02) .181 (4.60) TYP.
.041 (1.04) .033 (0.84)
MAX. .036 (0.91) MIN.
.013 (0.33) .009 (0.24)
Dimensions: inches (mm)
2002 Microchip Technology Inc.
DS21357B-page
TC1108
NOTES:
DS21357B-page
2002 Microchip Technology Inc.
TC1108
SALES SUPPORT
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2002 Microchip Technology Inc.
DS21357B-page
TC1108
NOTES:
DS21357B-page
2002 Microchip Technology Inc.
TC1108
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, MATE, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode Total Endurance trademarks Microchip Technology Incorporated U.S.A. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2002, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
Printed recycled paper.
Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999 Mountain View, California March 2002. Company's quality system processes procedures QS-9000 compliant PICmicro 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001 certified.
2002 Microchip Technology Inc.
DS21357B-page
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DS21357B-page
2002 Microchip Technology Inc.
*B75312SD*

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