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Package Type 8-Pin PDIP CAP+ 100mA Charge Pump Voltage


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TC1121
Package Type
8-Pin PDIP
CAP+
100mA Charge Pump Voltage Converter with Shutdown
Optional High-Frequency Operation Allows Small Capacitors Operating Current GND) 50µA High Output Current (100mA) Converts 2.4V 5.5V Input Voltage Corresponding Negative Output Voltage (Inverter Mode) Uses Only Capacitors; Inductors Required Selectable Oscillator Frequency 10kHz 200kHz Power-Saving Shutdown Input Available 8-Pin MSOP, 8-Pin PDIP 8-Pin Small Outline (SOIC) Packages
TC1121CPA TC1121EPA SHDN
VOUT
CAP-
8-Pin SOIC 8-Pin MSOP
Applications
Laptop Computers Medical Instruments Disk Drives µP-Based Controllers Process Instrumentation
TC1121COA CAP+ TC1121EOA TC1121CUA SHDN TC1121EUA
CAP- VOUT
General Description
TC1121 charge pump converter with 100mA output current capability. converts 2.4V 5.5V input corresponding negative output voltage. with charge pump converters, TC1121 uses inductors saving cost, size EMI. on-board oscillator operates typical frequency 10kHz when frequency control input (FC) connected ground. oscillator frequency increases 200kHz when connected allowing smaller capacitors. Operation sub-10kHz frequencies results lower quiescent NScurrent accomplished with addition external capacitor from (pin ground. TC1121 also driven from external clock NSconnected OSC. Typical supply current 10kHz 50µA, falls less than when shutdown input brought low, whether internal external clock used. TC1121 available 8-pin SOIC, MSOP PDIP packages.
Device Selection Table
Part Number TC1121COA TC1121CPA TC1121CUA TC1121EOA TC1121EPA TC1121EUA Package 8-Pin SOIC 8-Pin PDIP 8-Pin MSOP 8-Pin SOIC 8-Pin PDIP 8-Pin MSOP Operating Temp. Range +70°C +70°C +70°C -40°C +85°C -40°C +85°C -40°C +85°C
2002 Microchip Technology Inc.
DS21358B-page
TC1121
Functional Block Diagram
Control
C1121
Oscillator
witch atrix
ogic ircuits
DS21358B-page
2002 Microchip Technology Inc.
TC1121
ELECTRICAL CHARACTERISTICS
*Stresses above those listed under "Absolute Maximum Ratings" cause permanent damage device. These stress ratings only functional operation device these other conditions above those indicated operation sections specifications implied. Exposure Absolute Maximum Rating conditions extended periods affect device reliability.
Absolute Maximum Ratings*
Supply Voltage (VDD) OSC, SHDN Input Voltage .-0.3V 0.3V) Output Short Circuit Duration Sec. Package Power Dissipation 70°C) 8-Pin PDIP 730mW 8-Pin SOIC 470mW 8-Pin MSOP 333mW Operating Temperature Range Suffix. +70°C Suffix. -40°C +85°C Storage Temperature Range. -65°C +150°C
TC1121 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: 70°C suffix), -40°C +85°C suffix), ±10% COSC Open, 10µF, SHDN VIH, typical values 25°C unless otherwise noted. Symbol ISHUTDOWN ROUT IOUT FOSC PEFF Parameter Active Supply Current Shutdown Supply Current Supply Voltage SHDN Input Logic High SHDN Input Logic Input Leakage Current Output Source Resistance Output Current Oscillator Frequency Power Efficiency 99.9 Units
Test Conditions Open, Open Open, SHDN
SHDN, IOUT 60mA VOUT more negative than -3.75V Open, Open SHDN VIH, between VOUT between VOUT 60mA Open
VEFF
Note
Voltage Conversion Efficiency
Connecting input terminal voltages greater than less than cause destructive latch-up. recommended that inputs from sources operating from external supplies applied prior "power TC1121.
2002 Microchip Technology Inc.
DS21358B-page
TC1121
DESCRIPTIONS
descriptions pins listed Table 2-1.
TABLE 2-1:
(8-Pin MSOP, PDIP, SOIC)
FUNCTION TABLE
Symbol CAP+ CAP- SHDN Description Frequency control internal oscillator, open, FOSC 10kHz typ; FOSC 200kHz typ; effect when driven externally. Charge-pump capacitor, positive terminal. Power-supply ground input. Charge-pump capacitor, negative terminal. Output, negative voltage. Shutdown. Oscillator control input. external capacitor added slow oscillator. Take care minimize stray capacitance. external oscillator also connected overdrive OSC. Power-supply positive voltage input.
DS21358B-page
2002 Microchip Technology Inc.
TC1121
APPLICATIONS
Negative Voltage Converter
Changing Oscillator Frequency
TC1121's clock frequency controlled four modes:
TC1121 typically used charge-pump voltage inverter. only external capacitors used operating circuit (Figure 3-1).
TABLE 3-1:
Open Open Open Open Open
OSCILLATOR FREQUENCY MODES
Oscillator Frequency
10kHz 200kHz Typical Operating Characteristics External Clock Frequency
FIGURE 3-1:
CHARGE PUMP INVERTER
5.5V
External Capacitor External Clock
C1121
SHDN*
oscillator runs 10kHz (typical) when connected. oscillator frequency lowered connecting capacitor between GND, still multiply frequency times this mode. external clock source that swings within 100mV overdrive inverter mode. driven CMOS logic output. When overdriven, effect. Note that frequency signal appearing CAP+ CAP- half that oscillator. addition, lowering oscillator frequency, effective output resistance charge-pump increases. compensate this, value charge-pump capacitors increased. Because 5kHz output ripple frequency enough interfere with other circuitry, oscillator frequency increased with external oscillator. output ripple frequency half selected oscillator frequency. Although TC1121's quiescent current will increase clock frequency increased, allows smaller capacitance values used
SHDN should tied used.
TC1121 sensitive load current changes, although output actively regulated. typical output source resistance 11.8 means that input results output voltage under light load, only decreases -3.8V with 100mA load. supplied output current from capacitor during one-half charge-pump cycle. This results peak-to-peak ripple VRIPPLE IOUT/2(fPUMP) (C2) IOUT (ESRC2) Where fPUMP 5kHz (one half nominal 10kHz oscillator frequency), 150µF with 0.2, ripple about 90mV with 100mA load current. raised 390µF, ripple drops 45mV.
Capacitor Selection
addition load current, following factors affect TC1121 output voltage drop from ideal value output resistance, pump (C1) reservoir (C2) capacitor ESRs capacitance. voltage drop load current times output resistance. loss load current times C2's ESR; C1's loss larger because handles currents greater than load current during charge-pump operation. Therefore, voltage drop about four times C1's multiplied load current, high) capacitor greater impact performance than general, TC1121's pump frequency increases, capacitance values needed maintain comparable ripple output resistance diminish proportionately.
2002 Microchip Technology Inc.
DS21358B-page
TC1121
Cascading Devices Paralleling Devices
produce greater negative magnitudes initial supply voltage, TC1121 cascaded (see Figure 3-2). Resulting output resistance approximately equal individual TC1121 ROUT values. output voltage (where integer representing number devices cascaded) defined VOUT (VIN). reduce output resistance, multiple TC1121s paralleled (see Figure 3-3). Each device needs pump capacitor reservoir capacitor serves devices. value should increased factor (the number devices).
FIGURE 3-2:
CASCADING TC1121s INCREASE OUTPUT VOLTAGE
HDN*
C1121
C1121
HDN*
SHDN should tied used.
FIGURE 3-3:
PARALLELING TC1121s REDUCE OUTPUT RESISTANCE
CAP+
HDN*
C1121
C1121
HDN*
TC1121)/n(number devices) used.
DS21358B-page
2002 Microchip Technology Inc.
TC1121
Combined Positive Supply Multiplication Negative Voltage Conversion
respective capacitors multiplied positive voltage. This particular configuration leads higher source impedances generated supplies finite impedance common charge-pump driver.
Figure shows this dual function circuit, which capacitors perform pump reservoir functions generate negative voltage. Capacitors
FIGURE 3-4:
COMBINED POSITIVE MULTIPLER NEGATIVE CONVERTER
1N4148
C1121
HDN*
(2VIN) (VFD2)
SHDN should tied used.
2002 Microchip Technology Inc.
DS21358B-page
TC1121
PACKAGING INFORMATION
Package Marking Information
Package marking data available this time.
Package Dimensions
8-Pin MSOP
.122 (3.10) .114 (2.90)
.197 (5.00) .189 (4.80)
.026 (0.65) TYP.
.122 (3.10) .114 (2.90) .043 (1.10) MAX. .016 (0.40) .010 (0.25) .006 (0.15) .002 (0.05)
MAX. .028 (0.70) .016 (0.40)
.008 (0.20) .005 (0.13)
Dimensions: inches (mm)
8-Pin Plastic
.260 (6.60) .240 (6.10)
.045 (1.14) .030 (0.76) .400 (10.16) .348 (8.84) .200 (5.08) .140 (3.56) .150 (3.81) .115 (2.92)
.070 (1.78) .040 (1.02)
.310 (7.87) .290 (7.37)
.040 (1.02) .020 (0.51)
.015 (0.38) .008 (0.20) .400 (10.16) .310 (7.87)
MIN.
.110 (2.79) .090 (2.29)
.022 (0.56) .015 (0.38)
Dimensions: inches (mm)
DS21358B-page
2002 Microchip Technology Inc.
TC1121
Package Dimensions (Continued)
8-Pin SOIC
.157 (3.99) .150 (3.81)
.244 (6.20) .228 (5.79)
.050 (1.27) TYP.
.197 (5.00) .189 (4.80) .069 (1.75) .053 (1.35) .020 (0.51) .010 (0.25) .013 (0.33) .004 (0.10) MAX. .050 (1.27) .016 (0.40) Dimensions: inches (mm) .010 (0.25) .007 (0.18)
2002 Microchip Technology Inc.
DS21358B-page
TC1121
NOTES:
DS21358B-page
2002 Microchip Technology Inc.
TC1121
Sales Support
Data Sheets Products supported preliminary Data Sheet have errata sheet describing minor operational differences recommended workarounds. determine errata sheet exists particular device, please contact following: Your local Microchip sales office Microchip Corporate Literature Center U.S. FAX: (480) 792-7277 Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision silicon Data Sheet (include Literature using. Customer Notification System Register site (www.microchip.com/cn) receive most current information products.
2002 Microchip Technology Inc.
DS21358B-page11
TC1121
NOTES:
DS21358B-page12
2002 Microchip Technology Inc.
TC1121
Information contained this publication regarding device applications like intended through suggestion only superseded updates. your responsibility ensure that your application meets with your specifications. representation warranty given liability assumed Microchip Technology Incorporated with respect accuracy such information, infringement patents other intellectual property rights arising from such otherwise. Microchip's products critical components life support systems authorized except with express written approval Microchip. licenses conveyed, implicitly otherwise, under intellectual property rights.
Trademarks Microchip name logo, Microchip logo, FilterLab, KEELOQ, microID, MPLAB, PIC, PICmicro, PICMASTER, PICSTART, MATE, SEEVAL Embedded Control Solutions Company registered trademarks Microchip Technology Incorporated U.S.A. other countries. dsPIC, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, MXDEV, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode Total Endurance trademarks Microchip Technology Incorporated U.S.A. Serialized Quick Turn Programming (SQTP) service mark Microchip Technology Incorporated U.S.A. other trademarks mentioned herein property their respective companies. 2002, Microchip Technology Incorporated, Printed U.S.A., Rights Reserved.
Printed recycled paper.
Microchip received QS-9000 quality system certification worldwide headquarters, design wafer fabrication facilities Chandler Tempe, Arizona July 1999 Mountain View, California March 2002. Company's quality system processes procedures QS-9000 compliant PICmicro® 8-bit MCUs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, non-volatile memory analog products. addition, Microchip's quality system design manufacture development systems 9001 certified.
2002 Microchip Technology Inc.
DS21358B-page
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DS21358B-page
2002 Microchip Technology Inc.

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