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RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-254AA) Part Number
Top Searches for this datasheet90889C RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-254AA) Part Number Radiation Level RDS(on) IRHM9150 100K Rads (Si) 0.080 IRHM93150 300K Rads (Si) 0.080 -22A -22A IRHM9150 JANSR2N7422 100V, P-CHANNEL REF: MIL-PRF-19500/662 Hard HEXFET TECHNOLOGY Part Number JANSR2N7422 JANSF2N7422 TO-254AA International Rectifier's RADHard HEXFETtechnology provides high performance power MOSFETs space applications. This technology over decade proven performance reliability satellite applications. These devices have been characterized both Total Dose Single Event Effects (SEE). combination Rdson gate charge reduces power losses switching applications such converters motor control. These devices retain well established advantages MOSFETs such voltage control, fast switching, ease paralleling temperature stability electrical parameters. Features: Single Event Effect (SEE) Hardened RDS(on) Total Gate Charge Proton Tolerant Simple Drive Requirements Ease Paralleling Hermetically Sealed Surface Mount Ceramic Package Light Weight Absolute Maximum Ratings Parameter -12V, 25°C -12V, 100°C 25°C dv/dt TSTG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight footnotes refer last page Pre-Irradiation Units W/°C V/ns 0.063 (1.6mm) from case 10s) (typical) www.irf.com 12/6/01 IRHM9150 Pre-Irradiation Electrical Characteristics 25°C (Unless Otherwise Specified) Parameter Units Test Conditions =-1.0mA Reference 25°C, -1.0mA -12V, -14A -12V, -22A VGS, -1.0mA >-15V, -14A VDS= -80V ,VGS=0V -80V, 125°C -20V =-12V, -22A -50V -50V, -22A, =-12V, 2.35 BVDSS Drain-to-Source Breakdown Voltage -100 DSS/T Temperature Coefficient Breakdown -0.093 V/°C Voltage RDS(on) Static Drain-to-Source On-State 0.080 Resistance 0.085 VGS(th) Gate Threshold Voltage -2.0 -4.0 Forward Transconductance IDSS Zero Gate Voltage Drain Current -250 IGSS IGSS td(on) td(off) Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance -100 Measured from drain lead (6mm/0.25in. from package) source lead (6mm/0.25in. from package) Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance 4300 1100 -25V 1.0MHz Source-Drain Diode Ratings Characteristics Parameter Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time Units -3.0 Test Conditions 25°C, -22A, 25°C, -22A, di/dt -100A/µs -50V Intrinsic turn-on time negligible. Turn-on speed substantially controlled Thermal Resistance Parameter RthJC RthJA RthCS Junction-to-Case Junction-to-Ambient Case-to-Sink Units 0.83 0.21 °C/W Test Conditions Typical socket mount Note: Corresponding Spice Saber models available Website. footnotes refer last page www.irf.com Radiation Characteristics Pre-Irradiation IRHM9150 International Rectifier Radiation Hardened MOSFETs tested verify their radiation hardness capability. hardness assurance program International Rectifier comprised radiation environments. Every manufacturing tested total ionizing dose (per notes using TO-3 package. Both pre- post-irradiation performance tested specified using same drive circuitry test conditions order provide direct comparison. Table Electrical Characteristics 25°C, Post Total Dose Irradiation Parameter BVDSS VGS(th) IGSS IGSS IDSS RDS(on) RDS(on) Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance (TO-3) Static Drain-to-Source On-State Resistance (TO-254) Diode Forward Voltage 100K Rads(Si)1 300K Rads (Si)2 Units Test Conditions -1.0mA VDS, -1.0mA -20V VDS=-80V, -12V, =-14A -12V, =-14A -22A -100 -2.0 -4.0 -100 0.080 0.080 -3.0 -100 -2.0 -5.0 -100 0.080 0.080 Part number IRHM9150 (JANSR2N7422) Part number IRHM93150 (JANSF2N7422) International Rectifier radiation hardened MOSFETs have been characterized heavy environment Single Event Effects (SEE). Single Event Effects characterization illustrated Fig. Table Table Single Event Effect Safe Operating Area 36.8 59.9 Energy (MeV) Range (µm) @VGS=0V 32.8 -100 -100 @VGS=5V -100 -100 S(V) @VGS=10V -100 @VGS=15V @VGS=20V -120 -100 Single Event Effect, Safe Operating Area footnotes refer last page www.irf.com IRHM9150 Pre-Irradiation Drain-to-Source Current -5.0V 20µs PULSE WIDTH Drain-to-Source Current -15V -12V -10V -9.0V -8.0V -7.0V -6.0V BOTTOM -5.0V -15V -12V -10V -9.0V -8.0V -7.0V -6.0V BOTTOM -5.0V -5.0V 20µs PULSE WIDTH -VDS Drain-to-Source Voltage -VDS Drain-to-Source Voltage Typical Output Characteristics Typical Output Characteristics DS(on) Drain-to-Source Resistance (Normalized) -22A Drain-to-Source Current -50V 20µs PULSE WIDTH Gate-to-Source Voltage Typical Transfer Characteristics -12V Junction Temperature Normalized On-Resistance Vs.Temperature www.irf.com Pre-Irradiation IRHM9150 7000 6000 -VGS Gate-to-Source Voltage 1MHz Ciss SHORTED Crss Coss -22A Capacitance (pF) 5000 Ciss -80V -50V -20V 4000 3000 2000 1000 TEST CIRCUIT FIGURE -VDS Drain-to-Source Voltage Total Gate Charge (nC) Typical Capacitance Drain-to-Source Voltage Typical Gate Charge Gate-to-Source Voltage 1000 -ISD Reverse Drain Current OPERATION THIS AREA LIMITED DS(on) Drain Current 100us 10ms Single Pulse 1000 -VSD ,Source-to-Drain Voltage -VDS Drain-to-Source Voltage Typical Source-Drain Diode Forward Voltage Maximum Safe Operating Area www.irf.com IRHM9150 Pre-Irradiation D.U.T. Drain Current Pulse Width Duty Factor 10a. Switching Time Test Circuit td(on) d(off) Case Temperature Maximum Drain Current CaseTemperature 10b. Switching Time Waveforms 0.50 Thermal Response thJC 0.20 0.10 0.05 0.02 0.01 0.01 SINGLE PULSE (THERMAL RESPONSE) 0.001 0.00001 Notes: Duty factor Peak thJC 0.0001 0.001 0.01 Rectangular Pulse Duration (sec) Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com Pre-Irradiation IRHM9150 Single Pulse Avalanche Energy (mJ) 1200 1000 -20V -9.8A -14A BOTTOM -22A 12a. Unclamped Inductive Test Circuit Starting Junction Temperature 12c. Maximum Avalanche Energy Drain Current (BR)DSS 12b. Unclamped Inductive Waveforms Current Regulator Same Type D.U.T. -12V .2µF .3µF -12V -3mA Charge Current Sampling Resistors 13a. Basic Gate Charge Waveform 13b. Gate Charge Test Circuit www.irf.com D.U.T. IRHM9150 Pre-Irradiation Foot Notes: Repetitive Rating; Pulse width limited maximum junction temperature. -25V, starting 25°C, L=2.1mH Peak -22A, =-12V -22A, di/dt -450A/µs, -100V, 150°C Pulse width Duty Cycle Total Dose Irradiation with Bias. volt applied during irradiation MIL-STD-750, method 1019, condition Total Dose Irradiation with Bias. volt applied during irradiation MlL-STD-750, method 1019, condition Case Outline Dimensions TO-254AA 0.12 [.005] 3.78 [.149] 3.53 [.139] 13.84 [.545] 13.59 [.535] 6.60 [.260] 6.32 [.249] 3.78 [.149] 3.53 [.139] 13.84 [.545] 13.59 [.535] 6.60 [.260] 6.32 [.249] 0.12 [.005] 1.27 [.050] 1.02 [.040] 1.27 [.050] 1.02 [.040] 17.40 [.685] 16.89 [.665] 20.32 [.800] 20.07 [.790] 13.84 [.545] 13.59 [.535] 22.73 [.895] 21.21 [.835] 17.40 [.685] 16.89 [.665] 20.32 [.800] 20.07 [.790] 13.84 [.545] 13.59 [.535] 1.52 [.060] 17.40 [.685] 16.89 [.665] 0.84 [.033] MAX. 4.82 [.190] 3.81 [.150] 3.81 [.150] 4.06 [.160] 3.56 [.140] 1.14 [.045] 0.89 [.035] 0.36 [.014] 3.81 [.150] 1.14 [.045] 0.89 [.035] 0.36 [.014] 3.81 [.150] DIME IONING OLERANCING Y14.5M-1994. DIMENS IONS HOWN MILLIMET [INCHES CONT ROLLING DIMENS ION: INCH. CONFORMS JEDE OUTLINE O-254AA. IGNMENT DRAIN OURCE CAUTION BERYLLIA WARNING MIL-PRF-19500 Packages containing beryllia shall ground, sandblasted, machined have other operations performed them which will produce beryllia beryllium dust. Furthermore, beryllium oxide packages shall placed acids that will produce fumes containing beryllium. WORLD HEADQUARTERS: Kansas St., Segundo, California 90245, Tel: (310) 252-7105 Fax: (310) 252-7903 Visit www.irf.com sales contact information. 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