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100V, 0.180 Ohm, N-Channel Power MOSFET 2N6796 N-Channel enhancem
Top Searches for this datasheet2N6796 100V, 0.180 Ohm, N-Channel Power MOSFET 2N6796 N-Channel enhancement mode silicon gate power field effect transistor designed applications such switching regulators, switching converters, motor drivers, relay drivers, drivers high power bipolar switching transistors requiring high speed gate drive power. This type operated directly from integrated circuits. Features 100V rDS(ON) 0.180 Power Dissipation Limited Nanosecond Switching Speeds Linear Transfer Characteristics High Input Impedance Majority Carrier Device Ordering Information PART NUMBER 2N6796 PACKAGE TO-205AF BRAND 2N6796 Related Literature TB334 "Guidelines Soldering Surface Mount Components Boards" NOTE: When ordering, entire part number. Symbol Packaging JEDEC TO-205AF DRAIN (CASE) SOURCE GATE ©2001 Fairchild Semiconductor Corporation 2N6796 Rev. 2N6796 Absolute Maximum Ratings 25oC, Unless Otherwise Specified 2N6796 0.20 UNITS W/oC Drain Source Breakdown Voltage (Note Drain Gate Voltage (RGS 20k) (Note .VDGR Continuous Drain Current (Note 100oC Pulsed Drain Current (Note Gate Source Voltage (Note Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Maximum Power Dissipation (Figure Linear Derating Factor (Figure Operating Storage Temperature TSTG Maximum Temperature Soldering Leads 0.063in (1.6mm) from Case 10s. Package Body 10s, Techbrief .Tpkg CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those indicated operational sections this specification implied. NOTE: 25oC 125oC. Electrical Specifications PARAMETER 25oC, Unless Otherwise Specified SYMBOL BVDSS VGS(TH) IDSS VDS(ON) IGSS rDS(ON) td(ON) td(OFF) CISS COSS CRSS Free Operation 80V, 310mA 3.12V, 25V, 1MHz, (Figure TEST CONDITIONS 0.25mA, VDS, 0.5mA 100V, 80V, 125oC ±20V 10V, 125oC 25oC, 30V, (Figure MOSFET Switching Times Essentially Independent Operating Temperature 0.75 0.14 1000 1.56 ±100 0.180 0.350 UNITS oC/W oC/W Drain Source Breakdown Voltage Gate Threshold Voltage Zero Gate Voltage Drain Current On-State Drain Current (Note Gate Source Leakage Current Drain Source Resistance (Note Diode Forward Voltage (Note Forward Transconductance (Note Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance Thermal Resistance Junction Case Thermal Resistance Junction Ambient Safe Operating Area Source Drain Diode Specifications PARAMETER Reverse Recovery Time Reverse Recovered Charge NOTES: Pulse test: pulse width 300µs, duty cycle Repetitive rating: pulse width limited maximum junction temperature. Transient Thermal Impedance curve (Figure SYMBOL TEST CONDITIONS 150oC, dISD/dt 100A/µs 150oC, dISD/dt 100A/µs UNITS ©2001 Fairchild Semiconductor Corporation 2N6796 Rev. 2N6796 Typical Performance Curves POWER DISSIPATION MULTIPLIER DRAIN CURRENT Unless Otherwise Specified CASE TEMPERATURE (oC) CASE TEMPERATURE (oC) FIGURE NORMALIZED POWER DISSIPATION CASE TEMPERATURE FIGURE MAXIMUM CONTINUOUS DRAIN CURRENT CASE TEMPERATURE ZJC, NORMALIZED THERMAL IMPEDANCE 0.05 0.02 0.01 SINGLE PULSE 0.01 10-5 10-4 10-3 10-2 10-1 NOTES: DUTY FACTOR: t1/t2 PEAK RECTANGULAR PULSE DURATION FIGURE NORMALIZED MAXIMUM TRANSIENT THERMAL IMPEDANCE OPERATION THIS AREA LIMITED rDS(ON) DRAIN CURRENT 10µs 100µs DRAIN CURRENT 1000 PULSE DURATION 80µs 25oC RATED SINGLE PULSE 10ms 100ms -0.1 VDS, DRAIN SOURCE VOLTAGE VDS, DRAIN SOURCE VOLTAGE FIGURE FORWARD BIAS SAFE OPERATING AREA FIGURE OUTPUT CHARACTERISTICS ©2001 Fairchild Semiconductor Corporation 2N6796 Rev. 2N6796 Typical Performance Curves DRAIN CURRENT VDS, DRAIN SOURCE VOLTAGE Unless Otherwise Specified (Continued) PULSE DURATION 80µs DRAIN CURRENT 80µs PULSE TEST 125oC 25oC -55oC VGS, GATE SOURCE VOLTAGE FIGURE SATURATION CHARACTERISTICS rDS(ON), ON-STATE RESISTANCE NORMALIZED ON-RESISTANCE 2.00 1.75 1.50 1.25 1.00 0.75 0.50 FIGURE TRANSFER CHARACTERISTICS DRAIN CURRENT 0.25 JUNCTION TEMPERATURE (oC) NOTE: Heating effect pulse minimal. FIGURE DRAIN SOURCE RESISTANCE GATE VOLTAGE DRAIN CURRENT FIGURE NORMALIZED DRAIN SOURCE RESISTANCE JUNCTION TEMPERATURE 1.15 NORMALIZED ON-RESISTANCE 1.10 2000 1MHz CISS CRSS COSS 1600 1.05 1.00 0.95 0.90 0.85 0.80 JUNCTION TEMPERATURE (oC) CAPACITANCE (pF) 1200 CISS COSS CRSS VDS, DRAIN SOURCE VOLTAGE FIGURE NORMALIZED DRAIN SOURCE BREAKDOWN VOLTAGE JUNCTION TEMPERATURE FIGURE CAPACITANCE DRAIN SOURCE VOLTAGE ©2001 Fairchild Semiconductor Corporation 2N6796 Rev. 2N6796 Typical Performance Curves gfs, TRANSCONDUCTANCE Unless Otherwise Specified (Continued) ISD, SOURCE DRAIN CURRENT 80µs PULSE TEST -55oC 25oC 125oC 150oC 25oC DRAIN CURRENT VSD, SOURCE DRAIN VOLTAGE FIGURE TRANSCONDUCTANCE DRAIN CURRENT FIGURE SOURCE DRAIN DIODE VOLTAGE VGS, GATE SOURCE TOTAL GATE CHARGE (nC) FIGURE GATE SOURCE VOLTAGE GATE CHARGE ©2001 Fairchild Semiconductor Corporation 2N6796 Rev. 2N6796 Test Circuits Waveforms BVDSS VARY OBTAIN REQUIRED PEAK 0.01 FIGURE UNCLAMPED ENERGY TEST CIRCUIT FIGURE UNCLAMPED ENERGY WAVEFORMS td(ON) tOFF td(OFF) PULSE WIDTH FIGURE SWITCHING TIME TEST CIRCUIT FIGURE RESISTIVE SWITCHING WAVEFORMS CURRENT REGULATOR (ISOLATED SUPPLY) SAME TYPE Qg(TOT) BATTERY 0.2µF 0.3µF IG(REF) CURRENT SAMPLING RESISTOR CURRENT SAMPLING RESISTOR IG(REF) FIGURE GATE CHARGE TEST CIRCUIT FIGURE GATE CHARGE WAVEFORMS ©2001 Fairchild Semiconductor Corporation 2N6796 Rev. TRADEMARKS following registered unregistered trademarks Fairchild Semiconductor owns authorized intended exhaustive list such trademarks. Quiet SeriesDISCLAIMER FAST QFETQSQT OptoelectronicsQuiet SeriesSILENT SWITCHER SMART SuperSOTTM-6 SuperSOTTM-8 VCX STAR*POWER used under license FAIRCHILD SEMICONDUCTOR RESERVES RIGHT MAKE CHANGES WITHOUT FURTHER NOTICE PRODUCTS HEREIN IMPROVE RELIABILITY, FUNCTION DESIGN. FAIRCHILD DOES ASSUME LIABILITY ARISING APPLICATION PRODUCT CIRCUIT DESCRIBED HEREIN; NEITHER DOES CONVEY LICENSE UNDER PATENT RIGHTS, RIGHTS OTHERS. LIFE SUPPORT POLICY FAIRCHILD'S PRODUCTS AUTHORIZED CRITICAL COMPONENTS LIFE SUPPORT DEVICES SYSTEMS WITHOUT EXPRESS WRITTEN APPROVAL FAIRCHILD SEMICONDUCTOR CORPORATION. used herein: Life support devices systems devices critical component component life systems which, intended surgical implant into support device system whose failure perform body, support sustain life, whose reasonably expected cause failure life failure perform when properly used accordance support device system, affect safety with instructions provided labeling, effectiveness. reasonably expected result significant injury user. PRODUCT STATUS DEFINITIONS Definition Terms Datasheet Identification Advance Information Product Status Formative Design Definition This datasheet contains design specifications product development. Specifications change manner without notice. This datasheet contains preliminary data, supplementary data will published later date. Fairchild Semiconductor reserves right make changes time without notice order improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves right make changes time without notice order improve design. Preliminary First Production Identification Needed Full Production Obsolete Production This datasheet contains specifications product that been discontinued Fairchild semiconductor. datasheet printed reference information only. Rev. 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