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MC74HC164A identical pinout LS164. device inputs compatible with stand
Top Searches for this datasheetMC74HC164A 8-Bit Serial-Input/ Parallel-Output Shift Register MC74HC164A identical pinout LS164. device inputs compatible with standard CMOS outputs; with pullup resistors, they compatible with LSTTL outputs. MC74HC164A 8-bit, serial-input parallel-output shift register. serial data inputs, provided that input used data enable. Data entered each rising edge clock. active-low asynchronous Reset overrides Clock Serial Data inputs. PDIP-14 SUFFIX CASE MC74HC164AN AWLYYWW SOIC-14 SUFFIX CASE 751A TSSOP-14 SUFFIX CASE 948G 164A ALYW HC164A AWLYWW Output Drive Capability: LSTTL Loads Outputs Directly Interface CMOS, NMOS, Operating Voltage Range: Input Current: High Noise Immunity Characteristic CMOS Devices Compliance with Requirements Defined JEDEC Standard Chip Complexity: FETs Equivalent Gates LOGIC DIAGRAM SERIAL DATA INPUTS DATA PARALLEL DATA OUTPUTS Assembly Location Wafer Year Work Week ASSIGNMENT RESET CLOCK CLOCK RESET FUNCTION TABLE Inputs Outputs Change ORDERING INFORMATION Device MC74HC164AN MC74HC164AD MC74HC164ADR2 MC74HC164ADT MC74HC164ADTR2 Package PDIP-14 SOIC-14 SOIC-14 TSSOP-14 TSSOP-14 Shipping 2000 Rail 2500 Reel Rail 2500 Reel Reset Clock data input data shifted from preceding stage rising edge clock input. Semiconductor Components Industries, LLC, 2000 March, 2000 Rev. Publication Order Number: MC74HC164A/D MC74HC164A MAXIMUM RATINGS* Symbol Parameter Value Unit Supply Voltage (Referenced GND) Input Voltage (Referenced GND) Vout Output Voltage (Referenced GND) Input Current, Iout Output Current, Supply Current, Pins Power Dissipation Still Air, Plastic SOIC Package TSSOP Package Tstg Storage Temperature This device contains protection circuitry guard against damage high static voltages electric fields. However, precautions must taken avoid applications voltage higher than maximum rated voltages this high-impedance circuit. proper operation, Vout should constrained range (Vin Vout) VCC. Unused inputs must always tied appropriate logic voltage level (e.g., either VCC). Unused outputs must left open. Lead Temperature, from Case Seconds (Plastic DIP, SOIC TSSOP Package) *Maximum Ratings those values beyond which damage device occur. Functional operation should restricted Recommended Operating Conditions. Derating Plastic DIP: mW/_C from 125_C SOIC Package: mW/_C from 125_C TSSOP Package: mW/_C from 125_C high frequency heavy load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). RECOMMENDED OPERATING CONDITIONS Symbol Parameter Unit Supply Voltage (Referenced GND) Vin, Vout Input Voltage, Output Voltage (Referenced GND) Operating Temperature, Package Types Input Rise Fall Time (Figure 1000 ELECTRICAL CHARACTERISTICS (Voltages Referenced GND) Guaranteed Limit Symbol Parameter Test Conditions -55_C 25_C 3.15 1.35 85_C 125_C 3.15 1.35 3.15 1.35 Unit Minimum High-Level Input Voltage Vout |Iout| Maximum Low-Level Input Voltage Vout |Iout| Minimum High-Level Output Voltage |Iout| |Iout| |Iout| |Iout| 2.48 3.98 5.48 2.34 3.84 5.34 2.20 3.70 5.20 http://onsemi.com MC74HC164A ELECTRICAL CHARACTERISTICS (Voltages Referenced GND) Guaranteed Limit Symbol Parameter Test Conditions -55_C 25_C 85_C 125_C 0.33 0.33 0.33 0.40 0.40 0.40 Unit Maximum Low-Level Output Voltage |Iout| |Iout| |Iout| |Iout| Iout 0.26 0.26 0.26 Maximum Input Leakage Current Maximum Quiescent Supply Current (per Package) NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Guaranteed Limit Symbol fmax Parameter -55_C 25_C ELECTRICAL CHARACTERISTICS Input 85_C 125_C Unit Maximum Clock Frequency (50% Duty Cycle) (Figures tPLH, tPHL Maximum Propagation Delay, Clock (Figures tPHL Maximum Propagation Delay, Reset (Figures tTLH, tTHL Maximum Output Transition Time, Output (Figures Maximum Input Capacitance NOTES: propagation delays with loads other than Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). Typical 25°C, Power Dissipation Capacitance (Per Package)* Used determine no-load dynamic power consumption: load considerations, Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). http://onsemi.com NOTE: Information typical parametric values found Chapter Semiconductor High-Speed CMOS Data Book (DL129/D). TIMING REQUIREMENTS (Input Symbol trec Maximum Input Rise Fall Times (Figure Minimum Pulse Width, Reset (Figure Minimum Pulse Width, Clock (Figure Minimum Recovery Time, Reset Inactive Clock (Figure Minimum Hold Time, Clock (Figure Minimum Setup Time, Clock (Figure Parameter http://onsemi.com MC74HC164A -55_C 25_C 1000 Guaranteed Limit 85_C 125_C 1000 1000 Unit MC74HC164A DESCRIPTIONS INPUTS (Pins register completely static, allowing clock rates down continuous intermittent mode. OUTPUTS (Pins Serial Data Inputs. Data these inputs determine data entered into first stage shift register. high level entered into shift register, both inputs must high, thereby allowing input used data-enable input. When only serial input used, other must connected VCC. Clock (Pin Parallel Shift Register Outputs. shifted data presented these outputs true, noninverted, form. CONTROL INPUT Reset (Pin Shift Register Clock. positive-going transition this shifts data each stage next stage. shift Active-Low, Asynchronous Reset Input. voltage applied this input resets internal flip-flops sets Outputs level state. SWITCHING WAVEFORMS CLOCK tPHL 1/fmax tPLH tPHL RESET trec tTLH tTHL CLOCK Figure Figure TEST POINT VALID CLOCK *Includes probe capacitance DEVICE UNDER TEST OUTPUT Figure Figure Test Circuit http://onsemi.com MC74HC164A EXPANDED LOGIC DIAGRAM CLOCK RESET TIMING DIAGRAM CLOCK RESET http://onsemi.com MC74HC164A PACKAGE DIMENSIONS PDIP-14 SUFFIX CASE 646-06 ISSUE NOTES: LEADS WITHIN 0.13 (0.005) RADIUS TRUE POSITION SEATING PLANE MAXIMUM MATERIAL CONDITION. DIMENSION CENTER LEADS WHEN FORMED PARALLEL. DIMENSION DOES INCLUDE MOLD FLASH. ROUNDED CORNERS OPTIONAL. INCHES 0.715 0.770 0.240 0.260 0.145 0.185 0.015 0.021 0.040 0.070 0.100 0.052 0.095 0.008 0.015 0.115 0.135 0.300 0.015 0.039 MILLIMETERS 18.16 19.56 6.10 6.60 3.69 4.69 0.38 0.53 1.02 1.78 2.54 1.32 2.41 0.20 0.38 2.92 3.43 7.62 0.39 1.01 SEATING PLANE SOIC-14 SUFFIX CASE 751A-03 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSIONS INCLUDE MOLD PROTRUSION. MAXIMUM MOLD PROTRUSION 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.127 (0.005) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. 0.25 (0.010) SEATING PLANE 0.25 (0.010) MILLIMETERS 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 0.19 0.25 0.10 0.25 5.80 6.20 0.25 0.50 INCHES 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 0.008 0.009 0.004 0.009 0.228 0.244 0.010 0.019 http://onsemi.com MC74HC164A PACKAGE DIMENSIONS TSSOP-14 SUFFIX CASE 948G-01 ISSUE NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. DIMENSION DOES INCLUDE MOLD FLASH, PROTRUSIONS GATE BURRS. MOLD FLASH GATE BURRS SHALL EXCEED 0.15 (0.006) SIDE. DIMENSION DOES INCLUDE INTERLEAD FLASH PROTRUSION. INTERLEAD FLASH PROTRUSION SHALL EXCEED 0.25 (0.010) SIDE. DIMENSION DOES INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL 0.08 (0.003) TOTAL EXCESS DIMENSION MAXIMUM MATERIAL CONDITION. TERMINAL NUMBERS SHOWN REFERENCE ONLY. DIMENSION DETERMINED DATUM PLANE -W-. MILLIMETERS 4.90 5.10 4.30 4.50 1.20 0.05 0.15 0.50 0.75 0.65 0.50 0.60 0.09 0.20 0.09 0.16 0.19 0.30 0.19 0.25 6.40 INCHES 0.193 0.200 0.169 0.177 0.047 0.002 0.006 0.020 0.030 0.026 0.020 0.024 0.004 0.008 0.004 0.006 0.007 0.012 0.007 0.010 0.252 0.10 (0.004) 0.15 (0.006) 0.25 (0.010) IDENT. DETAIL 0.15 (0.006) SECTION 0.10 (0.004) SEATING PLANE DETAIL Semiconductor trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. 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