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CHANNEL 900V 1.05 TO-247/ISOWATT218 FAST POWER MOSFET TYPE 7NA90
Top Searches for this datasheetSTW7NA90 STH7NA90FI CHANNEL 900V 1.05 TO-247/ISOWATT218 FAST POWER MOSFET TYPE 7NA90 STH7NA90F DS(on) TYPICAL RDS(on) 1.05 GATE SOURCE VOLTAGE RATING 100% AVALANCHE TESTED REPETITIVE AVALANCHE DATA 100oC INTRINSIC CAPACITANCE GATE CHARGE MINIMIZED REDUCED VOLTAGE SPREAD TO-247 APPLICATIONS HIGH CURRENT, HIGH SPEED SWITCHING SWITCH MODE POWER SUPPLY (SMPS) CONSUMER INDUSTRIAL LIGHTING DC-AC CONVERTER WELDING EQUIPMENT UNINTERRUPTABLE POWER SUPPLY (UPS) ISOWATT218 INTERNAL SCHEMATIC DIAGRAM ABSOLUTE MAXIMUM RATINGS Symbol Parameter Drain-source Voltage (VGS Drain- gate Voltage ate-source Voltage Drain Current (continuous) Drain Current (continuous) Drain Current (pulsed) otal Dissipation Derating Factor Insulation ithstand Voltage (DC) Storage Temperature Max. Operating Junction Temperature Value W7NA90 STH7NA90F 1.52 0.56 4000 Pulse width limited safe operating area October 1998 STW7NA90 STH7NA90FI THERMAL DATA TO-247 -case -amb thc-sink Thermal Resistance Junction-case 0.65 ISOWATT 1.78 Thermal Resistance Junction-ambient Thermal Resistance Case-sink Maximum Lead Temperature Soldering Purpose AVALANCHE CHARACTERISTICS Symbo Parameter Avalanche Current, Repetitive Not-Repetitive (pulse width limited max) Single Pulse Avalanche Energy (starting Value Unit ELECTRICAL CHARACTERISTICS (Tcase unless otherwise specified) Symbo (BR)DSS IGSS Parameter Drain-source Breakdown Voltage Test ditions Min. Typ. Max. Unit Rating Zero Gate Voltage Drain Current Rating Gate-body Leakage Current (VDS Symbo GS(th) DS(on) Parameter Gate Threshold Voltage Static Drain-source Resistance State Drain Current Test ditions Min. 2.25 Typ. 1.05 Max. 3.75 Unit ID(o DS(on DYNAMIC Symbo Parameter Forward Transconductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Test ditions ID(o DS(on Min. Typ. 3100 4000 Max. Unit STW7NA90 STH7NA90FI ELECTRICAL CHARACTERISTICS (continued) SWITCHING Symbo d(on) Parameter Turn-on Time Rise Time Total Charge Gate-Source Charge Gate-Drain Charge Test ditions (see test circuit, figure Min. Typ. Max. Unit SWITCHING Symbo (Voff) Parameter Off-voltage Rise Fall Cross-over Time Test ditions (see test circuit, figure Min. Typ. Max. Unit SOURCE DRAIN DIODE Symbo Parameter Source-drain Current Source-drain Current (pulsed) Forward Voltage Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current 13.8 di/dt A/µs (see test circuit, figure Test ditions Min. Typ. Max. Unit Pulsed: Pulse duration duty cycle Pulse width limited safe operating area Safe Operating Area TO-247 Safe Operating Area ISOWATT218 STW7NA90 STH7NA90FI Thermal Impedance TO-247 Thermal Impedance ISOWATT218 Output Characteristics Transfer Characteristics Transconductance Static Drain-source Resistance STW7NA90 STH7NA90FI Gate Charge Gate-source Voltage Capacitance Variations Normalized Gate Threshold Voltage Temperature Normalized Resistance Temperature Source-drain Diode Forward Characteristics STW7NA90 STH7NA90FI Fig. Unclamped Inductive Load Test Circuit Fig. Unclamped Inductive Waveform Fig. Switching Times Test Circuits Resistive Load Fig. Gate Charge test Circuit Fig. Test Circuit Inductive Load Switching Diode Recovery Times STW7NA90 STH7NA90FI TO-247 MECHANICAL DATA MIN. 3.55 15.3 19.7 14.2 34.6 3.65 0.079 0.140 10.9 15.9 20.3 14.8 0.602 0.776 0.559 0.413 1.362 0.217 0.118 0.144 TYP. MAX. MIN. 0.185 0.087 0.016 0.039 0.079 0.118 0.429 0.626 0.779 0.582 inch TYP. MAX. 0.209 0.102 0.031 0.055 0.094 0.134 DIM. P025P STW7NA90 STH7NA90FI ISOWATT218 MECHANICAL DATA DIM. MIN. 5.35 1.88 0.75 1.05 10.8 15.8 20.8 19.1 22.8 40.5 4.85 20.25 TYP. MAX. 5.65 2.08 1.25 11.2 16.2 21.2 19.9 23.6 42.5 5.25 20.75 MIN. 0.210 0.130 0.114 0.074 0.029 0.041 0.425 0.622 0.818 0.752 0.897 1.594 0.190 0.797 0.137 0.082 0.181 inch TYP. MAX. 0.222 0.149 0.122 0.081 0.039 0.049 0.441 0.637 0.834 0.783 0.929 1.673 0.206 0.817 0.145 0.090 P025C STW7NA90 STH7NA90FI Information furnished believed accurate reliable. However, STMicroelectronics assumes responsibility consequences such information infringement patents other rights third parties which result from use. license granted implication otherwise under patent patent rights STMicroelectronics. Specification mentioned this publication subject change without notice. This publication supersedes replaces information previously supplied. STMicroelectronics products authorized critical components life support devices systems without express written approval STMicroelectronics. logo trademark STMicroelectronics 1998 STMicroelectronics Printed Italy Rights Reserved STMicroelectronics GROUP COMPANIES Australia Brazil Canada China France Germany Italy Japan Korea Malaysia Malta Mexico Morocco Netherlands Singapore Spain Sweden Switzerland Taiwan Thailand United Kingdom U.S.A. http://www.st.com Other recent searchesNC7WZ86 - NC7WZ86 NC7WZ86 Datasheet MIC4744YTSE - MIC4744YTSE MIC4744YTSE Datasheet MIC4742 - MIC4742 MIC4742 Datasheet MG3A - MG3A MG3A Datasheet L6007-01 - L6007-01 L6007-01 Datasheet DP83840 - DP83840 DP83840 Datasheet C9732DK-11 - C9732DK-11 C9732DK-11 Datasheet
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