HLB125HE EPITAXIAL PLANAR TRANSISTOR Description HLB125

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HLB125HE EPITAXIAL PLANAR TRANSISTOR Description HLB125

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Spec. HE200214 Issued Date 2002.09.01 Revised Date 2004.11.08 Page
HLB125HE
EPITAXIAL PLANAR TRANSISTOR
Description
HLB125HE designed lighting applications switch-mode power supplies. high voltage capability high switching speeds. TO-220
Features
High Speed Switching Saturation Voltage High Reliability
Absolute Maximum Ratings (TA=25°C)
Maximum Temperatures Storage Temperature +150 Junction Temperature Maximum Maximum Power Dissipation Total Power Dissipation (TC=25°C) Maximum Voltages Currents (TA=25°C) VCEX Collector Emitter Voltage VCEO Collector Emitter Voltage VEBO Emitter Base Voltage Collector Current (Continuous) Base Current (Continuous)
Electrical Characteristics (TA=25°C)
Symbol BVCEX BVCEO IEBO ICEX *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *VBE(sat) *hFE Min. Typ. Max. Unit IC=10mA VEB=9V VCE=700V, VBE(off)=1.5V IC=1A, IB=200mA IC=2A, IB=500mA IC=4A, IB=1A IC=1A, IB=200mA IC=2A, IB=500mA IC=2A, VCE=5V
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Test Conditions IC=1mA, VBE(off)=1.5V
HLB125HE
HSMC Product Specification
Characteristics Curve
Current Gain Collector Current
Spec. HE200214 Issued Date 2002.09.01 Revised Date 2004.11.08 Page
Saturation Voltage Collector Current
10000
VCE(sat) IC=5IB
Saturation Voltage (mV)
1000
VCE=5V
1000 10000
1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage Collector Current
1000 10000
Saturation Voltage Collector Current
VCE(sat) IC=4IB
VBE(sat) IC=5IB
Saturation Voltage (mV)
Saturation Voltage (mV)
1000
1000 Collector Current-IC (mA)
10000
1000
10000
Collector Current-IC (mA)
Saturation Voltage Collector Current
10000 VBE(sat) IC=4IB 1000
Capacitance Reverse-Biased Voltage
Saturation Voltage (mV)
Capacitance (pF)
1000
1000 10000
Collector Current-IC (mA)
Reverse-Biased
HLB125HE
HSMC Product Specification
Spec. HE200214 Issued Date 2002.09.01 Revised Date 2004.11.08 Page
Switching time Collector Current
10.0 Vcc=125V, IC=2A, IB1=IB2=0.4A
Safe Operating Area
Tstg
PT=10uS
Collector Current-IC
Switching Time(us).
PT=1s
PT=1ms
PT=100ms Toff 0.01 1000 10000
Collector Current(A)
Forward Voltage-VCE
HLB125HE
HSMC Product Specification
TO-220AB Dimension
Marking:
Free Mark
Pb-Free: (Note) Normal: None
Spec. HE200214 Issued Date 2002.09.01 Revised Date 2004.11.08 Page
Date Code Control Code
Note: Green label used pb-free packing Style: 1.Base 2.Collector 3.Emitter Material: Lead solder plating: Sn60/Pb40 (Normal), Sn/3.0Ag/0.5Cu Pure-Tin (Pb-free) Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Min. 5.58 8.38 4.40 1.15 0.35 2.03 9.66 3.00 0.75 2.54 1.14 12.70 14.48
Max. 7.49 8.90 4.70 1.39 0.60 2.92 10.28 *16.25 *3.83 4.00 0.95 3.42 1.40 *2.54 14.27 15.87
Typical, Unit:
3-Lead TO-220AB Plastic Package HSMC Package Code:
Important Notice:
rights reserved. Reproduction whole part prohibited without prior written approval HSMC. HSMC reserves right make changes products without notice. HSMC semiconductor products warranted suitable Life-Support Applications, systems. HSMC assumes liability consequence customer product design, infringement patents, application assistance.
Head Office Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. Sec. Chung-Shan Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 Factory Kuang Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HLB125HE
HSMC Product Specification
Soldering Methods HSMC's Products
Storage environment: Temperature=10oC~35oC Humidity=65%±15% Reflow soldering surface-mount devices Figure Temperature profile
Ramp-up Tsmax Temperature
Spec. HE200214 Issued Date 2002.09.01 Revised Date 2004.11.08 Page
Critical Zone
Tsmin Preheat
Ramp-down
25oC Peak Time
Profile Feature Average ramp-up rate Preheat Temperature (Tsmin) Temperature (Tsmax) Time (min max) (ts) Tsmax Ramp-up Rate Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within actual Peak Temperature (tP) Ramp-down Rate Time 25oC Peak Temperature Flow (wave) soldering (solder dipping) Products devices. Pb-Free devices.
Sn-Pb Eutectic Assembly C/sec 100oC 150oC 60~120 <3oC/sec 183oC 60~150 +0/-5 10~30 <6oC/sec minutes
Pb-Free Assembly <3oC/sec 150oC 200oC 60~180 <3oC/sec 217oC 60~150 260oC +0/-5oC 20~40 <6oC/sec minutes
Peak temperature
Dipping time 5sec ±1sec 5sec ±1sec
+0/-5
HLB125HE
HSMC Product Specification

HLB125HE EPITAXIAL PLANAR TRANSISTOR Description HLB125

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