REPETITIVE AVALANCHE dv/dt RATED HEXFET TRANSISTOR IRHM2C50S
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91252A
REPETITIVE AVALANCHE dv/dt RATED
HEXFET TRANSISTOR
IRHM2C50SE IRHM7C50SE
N-CHANNEL
SINGLE EVENT EFFECT (SEE) HARD
600Volt, 0.6, (SEE) HARD HEXFET
International Rectifier's (SEE) HARD technology HEXFETs demonstrate immunity failure. Additionally, under identical pre- post-irrradiation test conditions, International Rectifier's HARD HEXFETs retain identical electrical specifications Rads (Si) total dose. compensation gate drive circuitry required. These devices also capable surviving transient ionization pulses high 1012 Rads (Si)/Sec, return normal operation within microseconds. Since process utilizes International Rectifier's patented HEXFET technology, user expect highest quality reliability industry. HARD HEXFET transistors also feature well-established advantages MOSFETs, such voltage control, very fast switching, ease paralleling temperature stability electrical parameters. They well-suited applications such switching power supplies, motor controls, inverters, choppers, audio amplifiers high-energy pulse circuits space weapons environments.
Product Summary
Part Number IRHM2C50SE IRHM7C50SE BVDSS 600V 600V RDS(on) 0.60 0.60 10.4A 10.4A
Features:
Radiation Hardened Rads (Si) Single Event Burnout (SEB) Hardened Single Event Gate Rupture (SEGR) Hardened Gamma (Flash X-Ray) Hardened Neutron Tolerant Identical Pre- Post-Electrical Test Conditions Repetitive Avalanche Rating Dynamic dv/dt Rating Simple Drive Requirements Ease Paralleling Hermetically Sealed Electrically Isolated Ceramic Eyelets
Absolute Maximum Ratings
Parameter
12V, 25°C 12V, 100°C 25°C dv/dt TSTG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight 10.4 41.6 10.4 15.1
Pre-Irradiation
IRHM2C50SE, IRHM7C50SE Units
W/°C V/ns
(0.063 (1.6mm) from case sec.) (typical)
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1/6/99
IRHM2C50SE, IRHM7C50SE Devices
Pre-Irradiation
Electrical Characteristics 25°C (Unless Otherwise Specified)
Parameter
BVDSS Drain-to-Source Breakdown Voltage BVDSS/TJ Temperature Coefficient Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage Forward Transconductance IDSS Zero Gate Voltage Drain Current
Units
0.60 0.65 -100 V/°C
Test Conditions
1.0mA Reference 25°C, 1.0mA 12V, 6.5A 12V, 10.4A VGS, 1.0mA 15V, 6.5A VDS= Rating,VGS=0V Rating 125°C -20V 12V, 10.4A Rating 300V, 10.4A, 2.35
IGSS IGSS td(on) td(off)
Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance Internal Source Inductance
ckage Maue esrd ckage bnigpd
Modified MOSFET itrn
Ciss Coss Crss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
2510
1.0MHz
Source-Drain Diode Ratings Characteristics
Parameter
Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Units
10.4 41.6
Test Conditions
Modified MOSFET symbol show
25°C, 10.4A, 25°C, 10.4A, di/dt 100A/µs
Intrinsic turn-on time negligible. Turn-on speed substantially controlled
Thermal Resistance
Parameter
RthJC RthCS RthJA Junction-to-Case Case-to-Sink Junction-to-Ambient
0.83 0.21
Units
°C/W
Test Conditions
Typical socket mount
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Radiation Characteristics
Radiation Performance Hard HEXFETs
IRHM2C50SE, IRHM7C50SE Devices
either dose rate test circuits that used. Both pre- post-irradiation performance tested specified using same drive circuitry test conditions order provide direct comparison. should noted that radiation Every manufacturing tested dose rate level Rads (Si) only parameter limit (total dose) environment MlL-STD-750, test change GSTh minimum method 1019 condition International Rectifier High dose rate testing done special imposed standard gate condition volts note bias condition equal request basis using dose rate Rads (Si)/Sec Table vice rated voltage note Post-irradiation limits devices irradiated Rads International Rectifier radiation hardened HEXFETs (Si) Rads (Si) identical pre- have been characterized heavy Single Event sented Table column IRHM2C50SE col- Effects (SEE) environments. Single Event Effects IRHM7C50SE. values Table will characterization shown Table International Rectifier Radiation Hardened HEXFETs tested verify their hardness capability. hardness assurance program International Rectifier comprises radiation environments.
Table Dose Rate
Parameter
BVDSS VGS(th) IGSS IGSS IDSS RDS(on)1
IRHM2C50SE IRHM7C50SE
Rads (Si) Rads (Si) Units
Test Conditions
1.0mA VDS, 1.0mA VDS=0.8 Rating, 12V, =6.5A 25°C, 10.4A,VGS
Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance Diode Forward Voltage
-100
-100
Table High Dose Rate
Parameter
VDSS di/dt
1011 Rads (Si)/sec 1012 Rads (Si)/sec
Drain-to-Source Voltage
Units Test Conditions Applied drain-to-source voltage during gamma-dot Peak radiation induced photo-current A/µsec Rate rise photo-current Circuit inductance required limit di/dt
Table Single Event Effects
(Si) (MeV/mg/cm2)
Fluence (ions/cm2)
Range (µm)
VDSBias
Bias
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IRHM2C50SE, IRHM7C50SE Devices
Pre-Irradiation
Drain-to-Source Current
Drain-to-Source Current
9.0V 8.0V 7.0V 6.0V BOTTOM 5.0V
9.0V 8.0V 7.0V 6.0V BOTTOM 5.0V
5.0V
5.0V
20µs PULSE WIDTH
20µs PULSE WIDTH
Drain-to-Source Voltage
Drain-to-Source Voltage
Typical Output Characteristics
Typical Output Characteristics
Drain-to-Source Current
DS(on) Drain-to-Source Resistance (Normalized)
10.4A
20µs PULSE WIDTH
Gate-to-Source Voltage
Junction Temperature(
Typical Transfer Characteristics
Normalized On-Resistance Temperature
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Pre-Irradiation
IRHM2C50SE, IRHM7C50SE Devices
5000
Gate-to-Source Voltage
4000
Ciss Crss Coss
1MHz SHORTED
10.4A
480V 300V 120V
Capacitance (pF)
3000
Ciss
2000
Coss
1000
Crss
TEST CIRCUIT FIGURE
Drain-to-Source Voltage
Total Gate Charge (nC)
Typical Capacitance Drain-to-Source Voltage
Typical Gate Charge Gate-to-Source Voltage
1000
Reverse Drain Current
OPERATION THIS AREA LIMITED RDS(on)
Drain Current
10us 100us 10ms
Single Pulse
1000 10000
,Source-to-Drain Voltage
Drain-to-Source Voltage
Typical Source-Drain Diode Forward Voltage
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Maximum Safe Operating Area
IRHM2C50SE, IRHM7C50SE Devices
Pre-Irradiation
D.U.T.
Drain Current
-VDD
Pulse Width Duty Factor
10a. Switching Time Test Circuit
Case Temperature
Maximum Drain Current Case Temperature
td(on)
d(off)
10b. Switching Time Waveforms
0.50
Thermal Response thJC
0.20 0.10 0.05 0.02 0.01
SINGLE PULSE (THERMAL RESPONSE)
Notes: Duty factor Peak thJC
0.01
0.001 0.00001
0.0001
0.001
0.01
Rectangular Pulse Duration (sec)
Maximum Effective Transient Thermal Impedance, Junction-to-Case
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Pre-Irradiation
IRHM2C50SE, IRHM7C50SE Devices
Single Pulse Avalanche Energy (mJ)
1200
1000
4.7A 6.6A BOTTOM 10.4A
12a. Unclamped Inductive Test Circuit
Starting Junction Temperature(
12c. Maximum Avalanche Energy Drain Current
12b. Unclamped Inductive Waveforms
Current Regulator Same Type D.U.T.
.2µF .3µF
D.U.T.
Charge
Current Sampling Resistors
13a. Basic Gate Charge Waveform
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13b. Gate Charge Test Circuit
IRHM2C50SE, IRHM7C50SE Devices
Repetitive Rating; Pulse width limited
maximum junction temperature. Refer current HEXFET reliability report. Starting 25°C, [0.5 (IL2) =50V Peak 10.4A, 10.4A, di/dt 400A/µs, BVDSS, 150°C Suggested 2.35 Pulse width Duty Cycle
Pre-Irradiation
Total Dose Irradiation with Bias.
volt applied during irradiation MIL-STD-750, method 1019, condition Total Dose Irradiation with Bias. rated BVDSS (pre-irradiation) applied during irradiation MlL-STD -750, method 1019, condition This test performed using flash x-ray source operated e-beam mode (energy ~2.5 MeV), nsec pulse. Pre-Irradiation Post-Irradiation test conditions identical facilitate direct comparison circuit applications.
Case Outline Dimensions TO-254AA
ITTE
LEGEND DRAIN SOURCE GATE
LEGEND DRAIN SOURCE GATE
Conforms JEDEC Outline TO-254AA Dimensions Millimeters Inches
CAUTION BERYLLIA WARNING MIL-PRF-19500 Package containing beryllia shall ground, sandblasted, machined, have other operations perfomed them which will produce beryllia beryllium dust. Furthermore, beryllium oxide packages shall placed acids that will produce fumes containing beryllium.
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