IRL540NS/L HEXFET® Power MOSFET Advanced Process Technology

The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers.

IRL540NS/L HEXFET® Power MOSFET Advanced Process Technology

Datasheet Thumbnail

Top Searches for this datasheet

-91535
IRL540NS/L
HEXFET® Power MOSFET
Advanced Process Technology Surface Mount (IRL540NS) Low-profile through-hole (IRL540NL) 175°C Operating Temperature Fast Switching Fully Avalanche Rated Description
VDSS 100V
RDS(on) 0.044
Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques achieve extremely on-resistance silicon area. This benefit, combined with fast switching speed ruggedized device design that HEXFET Power MOSFETs well known for, provides designer with extremely efficient reliable device wide variety applications. D2Pak surface mount power package capable accommodating sizes HEX-4. provides highest power capability lowest possible onresistance existing surface mount package. D2Pak suitable high current applications because internal connection resistance dissipate 2.0W typical surface mount application. through-hole version (IRF540NL) available lowprofile applications.
Absolute Maximum Ratings
Parameter
25°C 100°C 25°C 25°C dv/dt TSTG Continuous Drain Current, Continuous Drain Current, Pulsed Drain Current Power Dissipation Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Soldering Temperature, seconds
Max.
0.91 (1.6mm from case
Units
W/°C V/ns
Thermal Resistance
Parameter
Junction-to-Case Junction-to-Ambient Mounted,steady-state)**
Typ.
Max.
Units
°C/W
5/13/98
IRL540NS/L
Electrical Characteristics 25°C (unless otherwise specified)
V(BR)DSS
V(BR)DSS/TJ
Parameter Drain-to-Source Breakdown Voltage Breakdown Voltage Temp. Coefficient Static Drain-to-Source On-Resistance Gate Threshold Voltage Forward Transconductance Drain-to-Source Leakage Current Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Total Gate Charge Gate-to-Source Charge Gate-to-Drain ("Miller") Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Source Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance
RDS(on) VGS(th) IDSS IGSS td(on) td(off) Ciss Coss Crss
Min.
Max. Units Conditions 250µA V/°C Reference 25°C, 0.044 10V, 0.053 5.0V, 0.063 4.0V, 250µA 25V, 100V, 80V, 150°C -100 -16V 5.0V, Fig. 5.0, 5.0V 2.7, Fig. Between lead, center contact 1800 1.0MHz, Fig.
Typ. 0.11
Source-Drain Ratings Characteristics
Parameter Continuous Source Current (Body Diode) Pulsed Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse RecoveryCharge Forward Turn-On Time
Min. Typ. Max. Units
Conditions MOSFET symbol showing integral reverse junction diode. 25°C, 18A, 25°C, di/dt 100A/µs Intrinsic turn-on time negligible (turn-on dominated LS+LD)
Notes: Repetitive rating; pulse width limited max. junction temperature. fig.
Pulse width 300µs; duty cycle
Uses IRL540N data test conditions
Starting 25°C, 1.9mH
18A. (See Figure
18A, di/dt 180A/µs, V(BR)DSS,
175°C When mounted square FR-4 G-10 Material recommended soldering techniques refer application note #AN-994.
IRL540NS/L
1000
8.0V 6.0V 4.0V 3.0V BOTTOM 2.5V
1000
Drain-to-Source Current
Drain-to-Source Current
8.0V 6.0V 4.0V 3.0V BOTTOM 2.5V
2.5V
2.5V
20µs PULSE WIDTH 25°C
20µs PULSE WIDTH 175°C
Drain-to-Source Voltage
Drain-to-Source Voltage
Typical Output Characteristics
Typical Output Characteristics
1000
Drain-to-Source Resistance (Normalized)
Drain-to-Source Current
25°C 175°C
20µs PULSE WIDTH
Gate-to-Source Voltage
Junction Temperature (°C)
Typical Transfer Characteristics
Normalized On-Resistance Temperature
IRL540NS/L
3000
Gate-to-Source Voltage
1MHz SHORTED
Capacitance (pF)
2000
1000
TEST CIRCUIT FIGURE
Drain-to-Source Voltage
Total Gate Charge (nC)
Typical Capacitance Drain-to-Source Voltage
Typical Gate Charge Gate-to-Source Voltage
1000
1000
Reverse Drain Current
OPERATION THIS AREA LIMITED
Drain Current
10µs
175°C
25°C
100µs
25°C 175°C Single Pulse
10ms
1000
Source-to-Drain Voltage
Drain-to-Source Voltage
Typical Source-Drain Diode Forward Voltage
Maximum Safe Operating Area
IRL540NS/L
D.U.T.
Drain Current
-VDD
5.0V
Pulse Width Duty Factor
10a. Switching Time Test Circuit
Case Temperature
Maximum Drain Current Case Temperature
td(on)
d(off)
10b. Switching Time Waveforms
Thermal Response thJC
0.50 0.20 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) Notes: Duty factor Peak thJC 0.0001 0.001 0.01
0.01 0.00001
Rectangular Pulse Duration (sec)
Maximum Effective Transient Thermal Impedance, Junction-to-Case
IRL540NS/L
Single Pulse Avalanche Energy (mJ)
BOTTOM
7.3A
12a. Unclamped Inductive Test Circuit
Starting Junction Temperature (°C)
12c. Maximum Avalanche Energy Drain Current
12b. Unclamped Inductive Waveforms
Current Regulator Same Type D.U.T.
.2µF .3µF
D.U.T.
Charge
Current Sampling Resistors
13a. Basic Gate Charge Waveform
13b. Gate Charge Test Circuit
IRL540NS/L
Peak Diode Recovery dv/dt Test Circuit
D.U.T
Circuit Layout Considerations Stray Inductance Ground Plane Leakage Inductance Current Transformer
dv/dt controlled Driver same type D.U.T. controlled Duty Factor D.U.T. Device Under Test
Driver Gate Drive P.W. Period
P.W. Period VGS=10V
D.U.T. Waveform Reverse Recovery Current Body Diode Forward Current di/dt D.U.T. Waveform Diode Recovery dv/dt
Re-Applied Voltage Inductor Curent
Body Diode
Forward Drop
Ripple
Logic Level Devices N-Channel HEXFETS
IRL540NS/L
D2Pak Package Outline
0.54 (.415 0.29 (.405 (.055
(.18 (.16
-B1.3 (.05 (.04
6.47 6.18 5.49 4.73 5.28 4.78 (.110 (.090 2.61 2.32
(.07 (.05
1.40 1.14 (.20
0.25
0.55 0.46
1.43
FTER 4.5M ATSINK
(.35 (.70
3.81 (.08 (.100
Part Marking Information
D2Pak
PART F530S
DATE CODE
IRL540NS/L
Package Outline
TO-262 Outline
Part Marking Information
TO-262
IRL540NS/L
Tape Reel Information
D2Pak
(.06 (.05
CTIO
(.42 (.42 (.06 (.04 (.63 (.62
13.50 (.532 12.80 (.504
(1.079)
0.00
60.00 (2.3
LLIN
(1.03 (.961
0.40 (1.1 MAX.
WORLD HEADQUARTERS: Kansas St., Segundo, California 90245, Tel: (310) 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey 9BB, Tel: 1883 732020 CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario 2Z8, Tel: (905) 1897 GERMANY: Saalburgstrasse 157, 61350 Homburg Tel: 6172 96590 ITALY: Liguria 10071 Borgaro, Torino Tel: 0111 EAST: Bldg., 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan Tel: 3983 0086 SOUTHEAST ASIA: Outram Road, #10-02 Boon Liat Building, Singapore 0316 Tel: 8371 http://www.irf.com/ Data specifications subject change without notice. 5/98

IRL540NS/L HEXFET® Power MOSFET Advanced Process Technology

Top Searches for this datasheet

Other recent searches