RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-254AA) Part Number

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RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-254AA) Part Number

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90675C
RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-254AA)
Part Number Radiation Level IRHM7150 100K Rads (Si) IRHM3150 300K Rads (Si) IRHM4150 IRHM8150 600K Rads (Si) 1000K Rads (Si) RDS(on) 0.065 0.065 0.065 0.065
REF: MIL-PRF-19500/603 Hard HEXFET TECHNOLOGY
IRHM7150 JANSR2N7268 100V, N-CHANNEL
Part Number JANSR2N7268 JANSF2N7268 JANSG2N7268 JANSH2N7268
TO-254AA
International Rectifiers RADHard provides high performance power MOSFETs space applications. This technology over decade proven performance reliability satellite applications. These devices have been characterized both Total Dose Single Event Effects (SEE). combination Rdson gate charge reduces power losses switching applications such converters motor control. These devices retain well established advantages MOSFETs such voltage control, fast switching, ease paralleling temperature stability electrical parameters.
HEXFET® technol-
Features:
Single Event Effect (SEE) Hardened RDS(on) Total Gate Charge Proton Tolerant Simple Drive Requirements Ease Paralleling Hermetically Sealed Ceramic Eyelets Light Weight
Absolute Maximum Ratings
Parameter
12V, 25°C 12V, 100°C 25°C dv/dt TSTG Continuous Drain Current Continuous Drain Current Pulsed Drain Current Max. Power Dissipation Linear Derating Factor Gate-to-Source Voltage Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy Peak Diode Recovery dv/dt Operating Junction Storage Temperature Range Lead Temperature Weight footnotes refer last page
Pre-Irradiation
Units
W/°C
V/ns
(0.063 (1.6mm) from case 10s) (Typical)
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8/14/01
IRHM7150
Pre-Irradiation
25°C (Unless Otherwise Specified)
Electrical Characteristics
Parameter
Units
0.13 V/°C
Test Conditions
1.0mA Reference 25°C, 1.0mA 12V, 12V, VGS, 1.0mA 15V, VDS= 80V,VGS=0V 125°C -20V 12V, 50V, 14A, 12V, 2.35
IGSS IGSS td(on) td(off)
Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (Miller) Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Inductance
-100
Ciss
Input Capacitance Output Capacitance Reverse Transfer Capacitance
4300 1200
Source-Drain Diode Ratings Characteristics
Parameter
Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time
Units
25°C, 34A, 25°C, 34A, di/dt 100A/µs
Intrinsic turn-on time negligible. Turn-on speed substantially controlled
Thermal Resistance
Parameter
RthJC RthCS RthJA Junction-to-Case Case-to-sink Junction-to-Ambient
Units
0.83 0.21
°C/W
Note: Corresponding Spice Saber models available Website. footnotes refer last page
BVDSS Drain-to-Source Breakdown Voltage Temperature Coefficient Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage Forward Transconductance IDSS Zero Gate Voltage Drain Current
0.065 0.076
Measured from drain lead (6mm/0.25in. from package) source lead (6mm/0.25in. from package)
1.0MHz
Test Conditions
Test Conditions
Typical socket mount
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Radiation Characteristics Pre-Irradiation
IRHM7150
International Rectifier Radiation Hardened MOSFETs tested verify their radiation hardness capability. hardness assurance program International Rectifier comprised radiation environments. Every manufacturing tested total ionizing dose (per notes using TO-3 package. Both pre- post-irradiation performance tested specified using same drive circuitry test conditions order provide direct comparison.
Table Electrical Characteristics 25°C, Post Total Dose Irradiation
Parameter
100K Rads(Si)
-100 0.065 0.065
1000K Rads (Si)
Units
Test Conditions
BVDSS V/5JD IGSS IGSS IDSS RDS(on) RDS(on)
Drain-to-Source Breakdown Voltage Gate Threshold Voltage# Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source# On-State Resistance (TO-3) Static Drain-to-Source# On-State Resistance (TO-254AA) Diode Forward Voltage#
1.25
-100 0.09 0.09
1.0mA VDS, 1.0mA VDS=80V, 12V, =21A 12V, =21A
Part number IRHM7150 (JANSR2N7268) Part numbers IRHM3150 (JANSF2N7268), IRHM4150 (JANSG2N7268) IRHM8150 (JANSH2N7268)
International Rectifier radiation hardened MOSFETs have been characterized heavy environment Single Event Effects (SEE). Single Event Effects characterization illustrated Fig. Table
Table Single Event Effect Safe Operating Area
Energy Range VDS(V) MeV/(mg/cm (MeV) (µm) @VGS=0V@VGS=-5V@VGS=-10V @VGS=-15V @VGS=-20V @VGS=-25V 36.8
Single Event Effect, Safe Operating Area
footnotes refer last page
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IRHM7150
Post-Irradiation Pre-Irradiation
Typical Response Gate Threshhold Voltage Total Dose Exposure
Typical Response On-State Resistance Total Dose Exposure
Typical Response Transconductance Total Dose Exposure
Typical Response Drain Source Breakdown Total Dose Exposure
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Post-Irradiation Pre-Irradiation
IRHM7150
Typical Zero Gate Voltage Drain Current Total Dose Exposure
Typical On-State Resistance Neutron Fluence Level
Gate Stress VGSS Equals Volts During Radiation
Typical Transient Response Hard HEXFET During 1x1012 (Si)/Sec Exposure
VDSS Stress Equals BVDSS During Radiation
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IRHM7150
Note: Bias Conditions during radiation: Vdc,
Characteristics RadiationPost-Irradiation Pre-Irradiation
Typical Output Characteristics Pre-Irradiation
Typical Output Characteristics Post-Irradiation 100K Rads (Si)
Typical Output Characteristics Post-Irradiation 300K Rads (Si)
Typical Output Characteristics Post-Irradiation Mega Rads(Si)
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Radiation Characteristics Pre-Irradiation
Note: Bias Conditions during radiation: Vdc,
IRHM7150
Typical Output Characteristics Pre-Irradiation
Typical Output Characteristics Post-Irradiation 100K Rads (Si)
Typical Output Characteristics Post-Irradiation 300K Rads (Si)
Typical Output Characteristics Post-Irradiation Mega Rads(Si)
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IRHM7150
Pre-Irradiation
Typical Output Characteristics
Typical Output Characteristics
Typical Transfer Characteristics
Normalized On-Resistance Temperature
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Pre-Irradiation
IRHM7150
Typical CapacitanceVs. Drain-to-Source Voltage
Typical Gate Charge Gate-to-Source Voltage
Typical Source-Drain Diode Forward Voltage
Maximum Safe Operating Area
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IRHM7150
Pre-Irradiation
D.U.T.
-VDD
Pulse Width Duty Factor
26a. Switching Time Test Circuit
Maximum Drain Current Case Temperature
td(on) d(off)
26b. Switching Time Waveforms
Maximum Effective Transient Thermal Impedance, Junction-to-Case
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Pre-Irradiation
IRHM7150
DRIVER
D.U.T
0.01
28a. Unclamped Inductive Test Circuit
V(BR)DSS
28c. Maximum Avalanche Energy Drain Current
28b. Unclamped Inductive Waveforms
Current Regulator Same Type D.U.T.
.2µF .3µF
D.U.T.
Charge
Current Sampling Resistors
29a. Basic Gate Charge Waveform
29b. Gate Charge Test Circuit
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IRHM7150
Pre-Irradiation
Foot Notes:
Repetitive Rating; Pulse width limited
maximum junction temperature. 25V, starting 25°C, 0.86mH Peak 26A, 26A, di/dt 190A/µs, 100V, 150°C
Pulse width Duty Cycle Total Dose Irradiation with Bias.
volt applied during irradiation MIL-STD-750, method 1019, condition Total Dose Irradiation with Bias. volt applied during irradiation MlL-STD-750, method 1019, condition
Case Outline Dimensions TO-254AA
.005 3.78 .149 3.53 .139 -A13.84 .545 13.59 .535 6.60 .260 6.32 .249 -B1.27 .050 1.02 .040
17.40 .685 16.89 .665 31.40 1.235 30.39 1.199
20.32 .800 20.07 .790
13.84 .545 13.59 .535
LEGEND COLL EMIT GATE
3.81 .150
1.14 .045 0.89 .035 .020 .010
3.81 .150
LEGEND DRAIN SOURCE GATE IRHM57163SED IRHM57163SEU
CAUTION BERYLLIA WARNING MIL-PRF-19500 Packages containing beryllia shall ground, sandblasted, machined have other operations performed them which will produce beryllia beryllium dust. Furthermore, beryllium oxide packages shall placed acids that will produce fumes containing beryllium.
WORLD HEADQUARTERS: Kansas St., Segundo, California 90245, Tel: (310) 252-7105 Fax: (310) 252-7903 Visit www.irf.com sales contact information. Data specifications subject change without notice. 08/01
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RADIATION HARDENED POWER MOSFET THRU-HOLE (TO-254AA) Part Number

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