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Transient Voltage Suppression
Multilayer Products Overview Multilayer Data Sheets Series Series SurgeNetArray AUML Series Multilayer Surface Mount Transient Voltage Surge Suppressors Multilayer Surface Mount Suppressor/Filter SurgeNet Four Section Array Transient Voltage Suppressor
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Multilayer Surface Mount Automotive Transient Surge Suppressors
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Multilayer Products Overview
with most electronic components, devices Transient Voltage Suppression have evolved meet specific customer needs market demands. This more evident than with Littelfuse Multilayer Suppressor technology. This product family combines required electrical performance with leadless chip, surface mount package. These devices provide designer with means ensure circuit reliability form factor necessary meet space constraints today's densely packaged electronic products. Multilayer Suppressors address specific part transient voltage spectrum circuit board level environment where, although lower energy, transients from ESD, inductive load switching, even lightning surge remnants would otherwise reach sensitive integrated circuits. Each these events relate product's
ElectroMagnetic Compatibility (EMC), immunity transients that could cause damage malfunction. importance evident subject numerous recent international testing standards legislation mandating compliance many countries. Littelfuse offers four distinct versions Multilayer Suppressors Series which supports broadest application range, Series intended while providing filter functions, Series Quad Array 1206 chip AUML Series characterized specific transients found automotive electronic systems. Application examples Multilayers given table below number pertinent Application Notes provided Section
Transient Voltage Suppressor Device Selection Guide
MARKET TYPICAL APPLICATIONS SEGMENT CIRCUITS EXAMPLES Volt- Hand-Held/Portable Controllers age, Board Devices Instrumentation Level Remote Sensors Products Computer Medical Electronics, etc. Port Interfaces DEVICE FAMILY SERIES MLE, SP72X Line, TVSS Products Panels Power Taps TVSS Devices Appliance/Controls Instrument Cluster Window Control/Wiper Modules Power Meters Power Supplies Circuit Breakers Consumer Electronics UltraMOVTM, CIII, DATA BOOK SECTION TECHNOLOGY Multilayer Suppressor SCR/Diode Array SURFACE MOUNT PRODUCT?
Automotive Electronics
Body Controllers Multiplex
AUML, MLE, SP72X
Multilayer Suppressor
SCR/Diode Array Multilayer Suppressor SCR/Diode Array Thyristor/Zener Thyristor
Telecommu- Cellular/Cordless Phone Modems nications Secondary Phone Line Products Protectors Data Line Connectors
Repeaters Line Cards T1/E1/ISDN
MLE, SP72X Surgector
Industrial, High Current Relays Robotics High Energy Solenoids Large Motors/Pumps/ Products Motor Drives Compressors Distribution Panels Arrester Lightning Arrester Assemblies High Voltage Power Products Distribution Lines Utility Transformers Available both surface mount through-hole packages.
DA/DB, BA/BB,
Series
Data Sheet July 1999 File Number 2461.10
Multilayer Surface Mount Transient Voltage Surge Suppressors /Title Series) /Subject (Multilayer Surface Mount Transient Voltage Surge Suppressors) /Autho /Keywords (TVS, Transient Suppression, Protection, Automotive, Load Dump, Alternator Field Decay,
Series family Transient Voltage Surge Suppression devices based Littelfuse Multilayer fabrication technology. These components designed suppress variety transient events, including those specified other standards used Electromagnetic Compliance (EMC). Series typically applied protect integrated circuits other components circuit board level. wide operating voltage energy range make Series suitable numerous applications power supply, control signal lines. Series manufactured from semiconducting ceramics providing bidirectional voltage clamping supplied leadless, surface mount form, compatible with modern reflow wave soldering procedures. Littelfuse manufactures other Multilayer Series products. Series data sheet applications. AUML Series automotive applications Quad Array.
Features
Leadless 0603, 0805, 1206 1210 Chip Sizes Multilayer Ceramic Construction Technology -55oC 125oC Operating Temperature Range Wide Operating Voltage Range VM(DC) 3.5V 120V Rated Surge Current Rated Energy 1000) Inherent Bidirectional Clamping Plastic Epoxy Packaging Assures Better than 94V-0 Flammability Rating Standard Capacitance Types Available
Applications
Suppression Inductive Switching Other Transient Events Such Surge Voltage Circuit Board Level Protection Components Sensitive 1000-42, MIL-STD-883C Method 3015.7, Other Industry Specifications (See Also Series) Provides On-Board Transient Voltage Protection Transistors Used Help Achieve Electromagnetic Compliance Products Replace Larger Surface Mount Zeners Many Applications
Packaging
SERIES (LEADLESS CHIP)
1-800-999-9445 1-847-824-1188 Copyright
Littelfuse, Inc. 1999
Series
Absolute Maximum Ratings
ratings individual members series, device ratings specifications table. SERIES Continuous: Steady State Applied Voltage: Voltage Range (VM(DC)) Voltage Range (VM(AC)RMS) Transient: Non-Repetitive Surge Current, 8/20µs Waveform, (ITM) Non-Repetitive Surge Energy, 10/1000µs Waveform, (WTM). Operating Ambient Temperature Range (TA) Storage Temperature Range (TSTG) Temperature Coefficient Clamping Voltage (VC) Specified Test Current UNITS
<0.01
%/oC
Device Ratings Specifications
MAXIMUM RATINGS (125oC) MAXIMUM NONREPETITIVE SURGE CURRENT (8/20µs) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs) MAXIMUM CLAMPING VOLTAGE NOTED) (8/20µs) SPECIFICATIONS (25oC)
MAXIMUM CONTINUOUS WORKING VOLTAGE
NOMINAL VOLTAGE TEST CURRENT VN(DC) VN(DC) 16.0 18.5 20.3 20.3 20.3 20.3
TYPICAL CAPACITANCE 1MHz
VM(DC) VM(AC) PART NUMBER V3.5MLA0603 V3.5MLA0805 V3.5MLA0805L V3.5MLA1206 V5.5MLA0603 V5.5MLA0805 V5.5MLA0805L V5.5MLA1206 V9MLA0603 V9MLA0805L V12MLA0805L V14MLA0603 V14MLA0805 V14MLA0805L V14MLA1206
I(A)
W(J)
15.5 15.5 15.5 15.5
11.0 15.9 15.9 15.9 15.9
(pF) 1100 2200 1200 6000 1600 4500 1600
Series
Device Ratings Specifications
(Continued) SPECIFICATIONS (25oC) MAXIMUM CLAMPING VOLTAGE NOTED) (8/20µs)
MAXIMUM RATINGS (125oC) MAXIMUM NONREPETITIVE SURGE CURRENT (8/20µs) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs)
MAXIMUM CONTINUOUS WORKING VOLTAGE
NOMINAL VOLTAGE TEST CURRENT VN(DC) VN(DC) 28.0 28.0 28.0 28.0 28.0 38.5 38.5 38.5 38.5 66.5 66.5
TYPICAL CAPACITANCE 1MHz
VM(DC) VM(AC) PART NUMBER V18MLA0603 V18MLA0805 V18MLA0805L V18MLA1206 V18MLA1210 V26MLA0603 V26MLA0805 V26MLA0805L V26MLA1206 V26MLA1210 V30MLA0603 V30MLA0805L V30MLA1210 V30MLA1210L V33MLA1206 V42MLA1206 V48MLA1210 V48MLA1210L V56MLA1206 V60MLA1210 V68MLA1206 V85MLA1210 V120MLA1210 NOTES:
I(A)
W(J)
29.5 29.5 29.5 29.5 54.5 54.5
(pF) 1100 1250 1000 1575 1530
suffix capacitance energy version. Contact Sales custom capacitance requirements. Typical leakage 25oC 25µA, maximum leakage 50µA VM(DC). Average power dissipation transients 0603, 0805, 1206 1210 sizes exceed 0.05, 0.10W, 0.10W 0.15W, respectively.
Series Power Dissipation Ratings
PERCENT RATED VALUE
When transients occur rapid succession average power dissipation energy (watt-seconds) pulse times number pulses second. power developed must within specifications shown Device Ratings Characteristics table specific device. Certain parameter ratings must derated high temperatures shown Figure
AMBIENT TEMPERATURE (oC)
FIGURE CURRENT, ENERGY POWER DERATING CURVE
PERCENT PEAK VALUE
VIRTUAL ORIGIN WAVE TIME FROM PEAK VIRTUAL FRONT TIME 1.25 VIRTUAL TIME HALF VALUE (IMPULSE DURATION) EXAMPLE: 8/20µs CURRENT WAVEFORM: VIRTUAL FRONT TIME 20µs VIRTUAL TIME HALF VALUE
TIME
FIGURE PEAK PULSE CURRENT TEST WAVEFORM
Series Maximum Transient Characteristic Curves
V30MLA0603 V26MLA0603 V18MLA0603 V14MLA0603
MAXIMUM CLAMPING VOLTAGE
V9MLA0603
V5.5MLA0603
V3.5MLA0603 MAXIMUM CLAMP VOLTAGE
MAXIMUM LEAKAGE 25oC V3.5MLA0603 V30MLA0603 VM(AC) RATING 10µA 100µA 10mA 100mA 100A
100nA
CURRENT
FIGURE V3.5MLA0603 V30MLA0603 MAXIMUM CHARACTERISTIC CURVES
V26MLA080
MAXIMUM CLAMPING VOLTAGE
V18MLA0805 V14MLA0805 V5.5MLA0805
V3.5MLA080
MAXIMUM CLAMP VOLTAGE
MAXIMUM LEAKAGE 25oC V3.5MLA0805 V30MLA0805 VM(AC) RATING 10µA 100µA 10mA CURRENT 100mA 100A 1000A
100nA
FIGURE V3.5MLA0805 V26MLA0805 MAXIMUM CHARACTERISTIC CURVES
Series Maximum Transient Characteristic Curves
V30MLA0805L V26MLA0805L V18MLA0805L V14MLA0805L V12MLA0805L MAXIMUM CLAMPING VOLTAGE
(Continued)
V9MLA0805L V5.5MLA0805L V3.5MLA0805L
MAXIMUM CLAMP VOLTAGE MAXIMUM LEAKAGE
25oC V3.5MLA0805L V30MLA0805L VM(AC) RATING 10mA CURRENT 100mA 100A 1000A
100nA
10µA
100µA
FIGURE V3.5MLA0805L V30MLA0805L MAXIMUM CHARACTERISTIC CURVES
1000 V68MLA1206 V56MLA1206 V42MLA1206 V33MLA1206 V26MLA1206 V18MLA1206
25oC V3.5MLA1206 V68MLA1206 VM(AC) RATING
MAXIMUM CLAMPING VOLTAGE
V14MLA1206
V5.5MLA1206 V3.5MLA1206
MAXIMUM LEAKAGE 100nA 10µA 100µA 10mA CURRENT
MAXIMUM CLAMP VOLTAGE 100mA 100A 1000A
FIGURE V3.5MLA1206 V68MLA1206 MAXIMUM CHARACTERISTIC CURVES
Series Maximum Transient Characteristic Curves
1000 25oC V18MLA1210 V120MLA1210 VM(AC) RATING
(Continued)
MAXIMUM CLAMPING VOLTAGE
V120MLA1210 V85MLA1210 V60MLA1210 MAXIMUM LEAKAGE
MAXIMUM CLAMP VOLTAGE
V48MLA1210, V48MLA1210L V30MLA1210, V30MLA1210L V26MLA1210 V18MLA1210 100nA 10µA 100µA 10mA CURRENT 100mA 100A 1000A
FIGURE V18MLA1210 V120MLA1210 MAXIMUM CHARACTERISTIC CURVES
Device Characteristics
current levels, curve multilayer transient voltage suppressor approaches linear (ohmic) relationship shows temperature dependent affect (Figure below maximum working voltage, suppressor high resistance mode (approaching maximum rated working voltage). Leakage currents maximum rated voltage below 50µA, typically 25µA. When clamping transients above 10mA range, multilayer suppressor approaches characteristic. Here, multilayer becomes virtually temperature independent (Figure
SUPPRESSOR VOLTAGE PERCENT VNOM VALUE 25oC
Speed Response
Multilayer Suppressor leadless device. response time limited parasitic lead inductances found other surface mount packaging. response time Zinc Oxide dielectric material less than nanosecond clamp very fast dV/dT events such ESD. Additionally, "real world" applications, associated circuit wiring often greatest factor effecting speed response. Therefore, transient suppressor placement within circuit considered important certain instances.
10-9 10-8 125oC 10-3 10-2
10-7 10-6 10-5 10-4 SUPPRESSOR CURRENT (ADC)
FIGURE TYPICAL TEMPERATURE DEPENDENCE CHARACTERISTIC CURVE LEAKAGE REGION
Series
Energy Absorption/Peak Current Capability
Energy dissipated within calculated multiplying clamping voltage, transient current transient duration. important advantage multilayer interdigitated electrode construction within mass dielectric material. This results excellent current distribution peak temperature energy absorbed very low. matrix semiconducting grains combine absorb distribute transient energy (heat) (Figure 10). This dramatically reduces peak temperature, thermal stresses enhances device reliability.
CLAMPING VOLTAGE
V26MLA1206
V5.5MLA1206
TEMPERATURE (oC)
FIGURE CLAMPING VOLTAGE OVER TEMPERATURE 10A)
FIRED CERAMIC DIELECTRIC
measure device capability energy handling peak current, V26MLA1206A part tested with multiple pulses peak current rating (150A, 8/20µs). test, 10,000 pulses later, device voltage characteristics still well within specification (Figure 11).
METAL TERMINATION
METAL ELECTRODES METAL TERMINATION
DEPLETION REGION
DEPLETION REGION GRAINS
FIGURE MULTILAYER INTERNAL CONSTRUCTION
PEAK CURRENT 150A 8/20µs DURATION, BETWEEN PULSES
VOLTAGE
V26MLA1206
2000 4000 6000 NUMBER PULSES 8000 10000 12000
FIGURE REPETITIVE PULSE CAPABILITY
5-10
Series Soldering Recommendations
principal techniques used soldering components surface mount technology Infra (IR) Reflow, Vapor Phase Reflow Wave Soldering. When wave soldering, suppressor attached substrate means adhesive. assembly then placed conveyor through soldering process. With Vapor Phase Reflow device placed solder paste substrate. solder paste heated reflows, solders unit board. With suppressor, recommended solder 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb), 63/37 (Sn/Pb). Littelfuse also recommends solder flux. Wave soldering operation most strenuous processes. avoid possibility generating stresses thermal shock, preheat stage soldering process recommended, peak temperature solder process should rigidly controlled. When using reflow process, care should taken ensure that chip subjected thermal gradient steeper than degrees second; ideal gradient being degrees second. During soldering process, preheating within degrees solders peak temperature essential minimize thermal shock. Examples soldering conditions series suppressors given tables below. Once soldering process been completed, still necessary ensure that further thermal shocks avoided. possible cause thermal shock printed circuit boards being removed from solder process subjected cleaning solvents room temperature. boards must allowed cool less than 50oC before cleaning.
MAXIMUM WAVE 260oC TEMPERATURE (oC) SECOND PREHEAT FIRST PREHEAT
TIME (MINUTES)
FIGURE WAVE SOLDER PROFILE
MAXIMUM TEMPERATURE 222oC TEMPERATURE (oC) 40-80 SECONDS ABOVE 183oC RAMP RATE >50oC/s PREHEAT ZONE
TIME (MINUTES)
Termination Options
Littelfuse offers types electrode termination finish Multilayer product series: Silver/Platinum (standard) Silver/Palladium (optional)
TEMPERATURE (oC)
FIGURE VAPOR PHASE SOLDER PROFILE
MAXIMUM TEMPERATURE 222oC 40-80 SECONDS ABOVE 183oC RAMP RATE <2oC/s PREHEAT DWELL PREHEAT ZONE
(The ordering information section describes designate them.)
TIME (MINUTES)
FIGURE REFLOW SOLDER PROFILE
5-11
Series Recommended Outline
NOTE
NOTE: Avoid metal runs this area. SIZE 1210 SIZE DEVICE SYMBOL 0.219 0.147 0.073 5.53 3.73 1.85 1206 SIZE DEVICE 0.203 0.103 0.065 5.15 2.62 1.65 0805 SIZE DEVICE 0.144 0.084 0.058 3.65 2.13 1.48 0603 SIZE DEVICE 0.11 0.064 0.044 1.62 1.12
Explanation Terms
Rated Voltage (VM(DC))
This maximum continuous voltage which applied maximum operating temperature device. rated operating voltage (working voltage) also used reference point leakage current. This voltage always less than breakdown voltage device.
system. leakage current drawn this level very low, specified Device Ratings table.
Nominal Voltage (VN(DC))
This voltage which device changes from (standby state) (clamping state) enters conduction mode operation. voltage value usually characterized point specified minimum maximum voltage range.
Rated Voltage (VM(AC)RMS)
This maximum continuous sinusoidal voltage which applied. This voltage applied temperature maximum operating temperature device.
Clamping Voltage (VC)
This peak voltage appearing across suppressor when measured conditions specified pulse current specified waveform.
Capacitance
This capacitance device specified frequency (1MHz) bias (1VP-P).
Maximum Non-Repetitive Surge Current (ITM)
This maximum peak current which applied 8/20µs impulse, with rated line voltage also applied, without causing device failure. pulse applied device either polarity with same confidence factor. Figure waveform description.
Maximum Non-Repetitive Surge Energy (WTM)
This maximum rated transient energy which dissipated single current pulse specified impulse duration (10/1000µs), with rated voltage applied, without causing device failure.
Leakage (IL) Rated Voltage
nonconducting mode, device very high impedance (approaching maximum rated voltage) appears essentially open circuit
5-12
Series Mechanical Dimensions
CHIP SIZE 1210 SYMBOL Max. 0.113 0.02 ±0.01 0.125 ±0.012 0.10 ±0.012 2.87 0.50 ±0.25 3.20 ±0.30 2.54 ±0.30 0.071 0.02 ±0.01 0.125 ±0.012 0.06 ±0.011 1206 1.80 0.50 ±0.25 3.20 ±0.03 1.60 ±0.28 0.043 0.01 0.029 0.079 ±0.008 0.049 ±0.008 0805 0.25 0.75 2.01 ±0.2 1.25 ±0.2 0.035 0.015 ±0.008 0.063 ±0.006 0.032 ±0.006 0603 ±0.2 ±0.15 ±0.1
Ordering Information
VXXML TYPES
1206
SERIES
DEVICE FAMILY TVSS Device MAXIMUM WORKING VOLTAGE
PACKING OPTIONS <100 Bulk (178mm) Diameter Reel (Note) 13in (330mm) Diameter Reel (Note) TERMINATION OPTION Letter: Ag/Pt (Standard) Ag/Pd CAPACITANCE OPTION Letter: Standard Capacitance Version (Where available device ratings standard versions)
MULTILAYER DESIGNATOR PERFORMANCE DESIGNATOR Standard (See Data Sheet) Array (See Data Sheet) NOTE: quantity table.
DEVICE SIZE: i.e.,
Standard Shipping Quantities
DEVICE SIZE 1210 1206 0805 0603 "13" INCH REEL ("T" OPTION) 8,000 10,000 10,000 10,000 INCH REEL ("H" OPTION) 2,000 2,500 2,500 2,500 BULK PACK ("A" OPTION)
5-13
Series Tape Reel Specifications
Conforms 481, Revision Supplied Publication
SYMBOL Width Cavity Length Cavity Depth Cavity Width Tape Distance Between Drive Hole Centers Cavity Centers Distance Between Drive Hole Centers Tape Edge Distance Between Cavity Center Axial Distance Between Drive Hole Centers Cavity Centers Axial Distance Between Drive Hole Centers Drive Hole Diameter Diameter Cavity Piercing Embossed Tape Thickness Tape Thickness DESCRIPTION MILLIMETERS Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. ±0.2 ±0.5 1.75 ±0.1 ±0.1 ±0.1 ±0.1 1.55 ±0.05 1.05 ±0.05
NOTE: Dimensions millimeters.
PRODUCT IDENTIFYING LABEL PLASTIC CARRIER TAPE
EMBOSSMENT TAPE
NOMINAL
178mm 330mm DIA. REEL
5-14
Series
Data Sheet January 1998 File Number 4263.2
Multilayer Surface Mount Suppressor/Filter /Title (MLE Series) /Subject (Multilayer Surface Mount Suppressor/Filt /Autho /Keywords (TVS, Transient Suppression, Protection, ESD, IEC, EMC, Electromagnet Compatibility, Array,
Series family Transient Voltage Suppression devices based Littelfuse Multilayer fabrication technology. These components designed suppress events, including those specified IEC1000-4-2 other standards used Electromagnetic Compliance testing. Series typically applied protect integrated circuits other components circuit board level operating 18VDC, less. Additionally, fabrication method materials these devices result capacitance characteristics suitable high frequency attenuation/low-pass filter circuit functions, thereby, providing suppression filtering single device. Series manufactured from semiconducting ceramics, providing bidirectional voltage clamping supplied leadless, surface mount form compatible with modern reflow wave soldering procedures. Littelfuse manufactures other Multilayer Series products. Series data sheet higher energy/peak current transient applications. AUML Series automotive applications, Quad Array.
Features
Rated (IEC-1000-4-2) Characterized Impedance Capacitance -55oC 125oC Operating Temperature Range Leadless 0603, 0805, 1206 Chip Sizes Operating Voltage 18VM(DC) Multilayer Ceramic Construction Technology
Applications
Protection Components Circuits Sensitive Transients Occurring Power Supply, Control Signal Lines Suppression Events Such Specified IEC-1000-4-2 MIL-STD-883C Method-3015.7, Electromagnetic Compliance (EMC) Used Mobile Communications, Computer/EDP Products, Medical Products, Hand Held/Portable Devices, Industrial Equipment, Including Diagnostic Port Protection Interfaces
Packaging
SERIES (LEADLESS CHIP)
1-800-999-9445 1-847-824-1188 Copyright
Littelfuse, Inc. 1998
Series
Absolute Maximum Ratings
ratings individual members series, device ratings specifications table. SERIES Continuous: Steady State Applied Voltage: Voltage Range (VM(DC)) Operating Ambient Temperature Range (TA) Storage Temperature Range (TSTG) UNITS
Device Ratings Specifications
CONTINUOUS WORKING VOLTAGE -55oC 125oC (NOTE VM(DC) PART NUMBER V18MLE0603 PERFORMANCE SPECIFICATIONS (25oC) NOMINAL VOLTAGE VNOM (NOTE TYPICAL CAPACITANCE 1MHz MAXIMUM LEAKAGE APPLIED VOLTAGE
(NOTE TYPICAL CLAMP VOLTAGE (8kV CONTACT NOTE PEAK <140 (15kV NOTE PEAK
(pF) <100
(µA)
V18MLE0603L
<160
<140
V18MLE080
<500
V18MLE0805L
<150
<100
V18MLE1206
<1700
NOTES: applications 18VDC less. Higher voltages available, contact Sales. Tested with IEC-1000-4-2 Human Body Model (HBM) discharge test circuit. Direct discharge device terminals (IEC preferred test method). Corona discharge through (represents actual event). Capacitance customized, contact Sales.
5-16
Series Typical Performance Curves
0603 PEAK CLAMPING VOLTAGE 0805 1206 PEAK CLAMPING VOLTAGE
0603 0805 1206
2000
4000
6000
8000
10000 12000 14000 16000
2000
4000
6000
8000
10000 12000 14000 16000
ELECTROSTATIC DISCHARGE VOLTAGE
ELECTROSTATIC DISCHARGE VOLTAGE
FIGURE CLAMPING CHARACTERISTIC CONTACT METHOD IEC-1000-4-2, RANGE 0.5kV 8.0kV
FIGURE CLAMPING CHARACTERISTIC DISCHARGE METHOD IEC1000-4-2, RANGE 15kV
PEAK CLAMPING VOLTAGE 0805L 1000 2000 3000 4000 5000 6000 7000 8000 ELECTROSTATIC DISCHARGE VOLTAGE 0603L PEAK CLAMPING VOLTAGE
2000 4000 6000 8000 10000 12000 14000 16000 ELECTROSTATIC DISCHARGE VOLTAGE 0603L 0805L
FIGURE CLAMPING CHARACTERISTIC CONTACT METHOD IEC-1000-4-2, RANGE 0.5kV 8.0kV
FIGURE CLAMPING CHARACTERISTIC DISCHARGE METHOD IEC1000-4-2, RANGE 15kV
5-17
Series Typical Performance Curves
(Continued)
DISCHARGES CLAMPING VOLTAGE
0603 IMPEDANCE
DISCHARGES
1206
1000 DISCHARGES
10,000 DISCHARGES
BIAS BIAS 0.01 1000 10000
100nA
10µA
100µA CURRENT
10mA
100mA
FREQUENCY (MHz)
FIGURE IMPEDANCE FREQUENCY TYPICAL CHARACTERISTIC WITH 18VDC BIAS
FIGURE V18MLE0805 LEAKAGE CHARACTERISTIC STABILITY AFTER 10,000 CONTACT IMPULSES NOTE: Figure example device clamping characteristics Standby "Leakage" current) region operation. intended illustrate stability device after application multiple, CONTACT discharges 1000-4-2. Note that discharges were applied polarity measurements were made that same polarity.
Multilayer Internal Construction
FIRED CERAMIC DIELECTRIC METAL TERMINATION
METAL ELECTRODES METAL TERMINATION
DEPLETION REGION
DEPLETION REGION GRAINS
FIGURE DIAGRAM INTERDIGITATED METAL ELECTRODES WITHIN CERAMIC DIELECTRIC MATERIAL REPRESENTATION GRAIN STRUCTURE WITHIN EACH LAYER
5-18
Series Soldering Recommendations
principal techniques used soldering components surface mount technology Infra (IR) Reflow, Vapour Phase Reflow, Wave Soldering. When wave soldering, suppressor attached circuit board means adhesive. assembly then placed conveyor through soldering process contact wave. With Vapour Phase Reflow, device placed solder paste substrate. solder paste heated, reflows solders unit board. With suppressor, recommended solder 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb), 63/37 (Sn/Pb). Littelfuse also recommends solder flux. Wave soldering most strenuous processes. avoid possibility generating stresses thermal shock, preheat stage soldering process recommended, peak temperature solder process should rigidly controlled. When using reflow process, care should taken ensure that chip subjected thermal gradient steeper than degrees second; ideal gradient being degrees second. During soldering process, preheating within degrees solders peak temperature essential minimize thermal shock. Examples soldering conditions series suppressors given tables below. Once soldering process been completed, still necessary ensure that further thermal shocks avoided. possible cause thermal shock printed circuit boards being removed from solder process subjected cleaning solvents room temperature. boards must allowed gradually cool less than 50oC before cleaning.
MAXIMUM WAVE 260oC TEMPERATURE (oC) SECOND PREHEAT FIRST PREHEAT
TIME (MINUTES)
FIGURE WAVE SOLDER PROFILE
MAXIMUM TEMPERATURE 222oC TEMPERATURE (oC) 40-80 SECONDS ABOVE 183oC RAMP RATE >50oC/s PREHEAT ZONE
TIME (MINUTES)
FIGURE VAPOR PHASE SOLDER PROFILE
Termination Options
Littelfuse offers types electrode termination finish Multilayer product series: Silver/Platinum (standard)
TEMPERATURE (oC) MAXIMUM TEMPERATURE 222oC 40-80 SECONDS ABOVE 183oC RAMP RATE <2oC/s PREHEAT DWELL PREHEAT ZONE
Silver/Palladium (optional)
TIME (MINUTES)
FIGURE REFLOW SOLDER PROFILE
5-19
Series Recommended Outline
NOTE
NOTE: Avoid metal runs this area. RECOMMENDED SIZE DIMENSIONS 1206 SIZE DEVICE SYMBOL 0.203 0.103 0.065 5.15 2.62 1.65 0805 SIZE DEVICE 0.144 0.084 0.058 3.66 2.13 1.48 0603 SIZE DEVICE 0.11 0.064 0.044 1.62 1.12
Explanation Terms
Rated Voltage (VM(DC)) This maximum continuous voltage which applied maximum operating temperature device. rated operating voltage (working voltage) also used reference point leakage current. This voltage always less than breakdown voltage device. Leakage (IL) Rated Voltage
nonconducting mode, device very high impedance (106) appears essentially open circuit system. leakage current drawn this level very low. Device Ratings.
Clamping Voltage (VC) This peak voltage appearing across suppressor when measured conditions specified pulse current specified waveform. Device Ratings. Capacitance
This capacitance device specified frequency (1MHz) bias (1VP-P). Device Ratings.
1000-4-2
electrostatic discharge requirements portion electromagnetic compatibility standard written International Electrotechnical Commission. specification describes specific human body model test conditions methods.
Nominal Voltage (VN(DC))
This voltage which device changes from state state enters conduction mode operation. voltage usually characterized point specified minimum maximum voltage listed.
5-20
Series Mechanical Dimensions
DEVICE DIMENSIONS 1206 SIZE SYMBOL Max. INCH 0.071 0.02 ±0.01 0.125 ±0.012 0.06 ±0.011 1.80 0.50 ±0.25 3.20 ±0.03 1.60 ±0.28 INCH 0.043 0.02 ±0.01 0.079 ±0.008 0.049 ±0.008 0805 SIZE 0.50 ±0.25 2.01 ±0.2 1.25 ±0.2 INCH 0.035 0.015 ±0.008 0.063 ±0.006 0.032 ±0.006 0603 SIZE ±0.2 ±0.15 ±0.1
Ordering Information
VXXMLE TYPES
1206
SERIES
DEVICE FAMILY TVSS Device MAXIMUM WORKING VOLTAGE MULTILAYER DESIGNATOR PERFORMANCE DESIGNATOR Standard (See Data Sheet) Array (See Data Sheet)
PACKING OPTIONS <100 Bulk (178mm) Diameter Reel (Note) 13in (330mm) Diameter Reel (Note) TERMINATION OPTION Letter: Ag/Pt (Standard) Ag/Pd
DEVICE SIZE: i.e.,
NOTE: quantity table.
CAPACITANCE OPTION Letter: Standard Capacitance Version (Where available device ratings standard versions)
Standard Shipping Quantities
DEVICE SIZE 1206 0805 0603 "13" INCH REEL ("T" OPTION) 10,000 10,000 10,000 INCH REEL ("H" OPTION) 2,500 2,500 2,500 BULK PACK ("A" OPTION)
5-21
Series Tape Reel Specifications
Conforms 481, Revision Supplied Publication
SYMBOL Width Cavity Length Cavity Depth Cavity Width Tape Distance Between Drive Hole Centers Cavity Centers Distance Between Drive Hole Centers Tape Edge Distance Between Cavity Center Axial Distance Between Drive Hole Centers Cavity Centers Axial Distance Between Drive Hole Centers Drive Hole Diameter Diameter Cavity Piercing Embossed Tape Thickness Tape Thickness DESCRIPTION MILLIMETERS Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. 1.75 1.55 0.05 1.05 0.05
NOTE: Dimensions millimeters.
PRODUCT IDENTIFYING LABEL PLASTIC CARRIER TAPE
EMBOSSMENT TAPE
NOMINAL
178mm 330mm DIA. REEL
5-22
SurgeNetArray
Data Sheet 1999 File Number 4682
SurgeNet Four Section Array Transient Voltage Suppressor /Title (MLN Array) /Subject (SurgeNet Four Section Array Transient Voltage Suppressor) /Autho /Keywords (Littelfuse, Inc., Suppression Products, array, suppressor, transguard, chip, leadThe SurgeNet Suppressor Array device designed transient voltages that exist circuit board level. This device provides four independent suppressors single "1206" leadless chip order reduce part count placement time well save space printed circuit boards. SurgeNet devices intended suppress ESD, other transients order protect integrated circuits other sensitive components operating voltage 18VDC SurgeNet devices rated 1000-4-2 human body model help products attain compliance. array offers excellent isolation crosstalk between sections. inherent capacitance SurgeNet device permits function filter/suppressor, thereby replacing separate zener/capacitor combinations. array manufactured with Littelfuse Multilayer technology process similar Littelfuse Series discrete leadless chips. SurgeNet also provided Dual version. Contact Littelfuse information.
Features
Four Individual Devices 1206 Chip Rated 1000-4-2 (Level Characterized Impedance Capacitance Adjacent Channel Crosstalk, -55dB 10MHz (Typ) Leakage (6nA 5.5V, 30nA 15V) Operating Voltage 18VM(DC) -55oC 125oC Operating Temperature Range Low-Profile, PCMCIA Compatible
Applications
Data, Diagnostic Ports Analog Signal/Sensor Lines Portable/Hand-Held Products Mobile Communications/Cellular Phones Computer/DSP Products Industrial Instruments Including Medical
Packaging
ARRAY (LEADLESS CHIP)
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1-800-999-9445 1-847-824-1188 Copyright Littelfuse, Inc. 1999 SurgeNetis trademark SurgeNet Electronics, Inc.
SurgeNet Array
Absolute Maximum Ratings
ratings individual members series, device ratings specifications table. ARRAY Continuous: Steady State Applied Voltage: Voltage Range (VM(DC)) Operating Ambient Temperature Range (TA) Storage Temperature Range (TSTG) UNITS
Device Ratings Specifications
RATINGS (125oC)
Single Section PERFORMANCE SPECIFICATIONS (25oC) MAXIMUM CLAMPING VOLTAGE NOTED CURRENT 8/20µs) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs)
MAXIMUM NONMAXIMUM REPETITIVE CONTINUOUS SURGE WORKING CURRENT VOLTAGE (8/20µs)
(NOTE MAXIMUM CLAMP VOLTAGE (NOTE (NOTE CONTACT 15kV PEAK PEAK
MAXIMUM CAPACITANCE 1MHz (1VP-P)
MAXIMUM LEAKAGE APPLIED IL(MAX) VOLTAGE (µA) 0.004 0.006 0.030 0.300
PART NUMBER V18MLN41206
(NOTE VM(DC)
I(A)
W(J)
(NOTE (pF)
NOTES: applications 18VDC less. Higher voltages available, contact Sales. Tested IEC-1000-4-2 Human Body Model (HBM) discharge test circuit.
Direct discharge device terminals (IEC preferred test method). Corona discharge through (represents actual event). Capacitance customized, contact Sales.
Temperature Derating
PERCENT RATED VALUE
applications exceeding 125oC ambient temperature, peak surge current energy ratings must reduced shown Figure
AMBIENT TEMPERATURE (oC)
FIGURE PEAK CURRENT ENERGY DERATING CURVE
PERCENT PEAK VALUE VIRTUAL ORIGIN WAVE TIME FROM PEAK VIRTUAL FRONT TIME 1.25 VIRTUAL TIME HALF VALUE (IMPULSE DURATION) EXAMPLE: 8/20µs CURRENT WAVEFORM: VIRTUAL FRONT TIME 20µs VIRTUAL TIME HALF VALUE
TIME
FIGURE PEAK PULSE CURRENT TEST WAVEFORM CLAMPING VOLTAGE
5-24
SurgeNet Array Typical Performance Curves
Single Section
SAMPLES 1000 10,000
VNOM
NUMBER DISCHARGES
CAPACITANCE (pF)
FIGURE NOMINAL VOLTAGE STABILITY 1000-4-2 (8kV CONTACT METHOD, SECTION)
FIGURE PRODUCT DISTRIBUTION CAPACITANCE (1MHz)
Typical Performance Curves
VARISTOR VOLTAGE 1.0E-07 1.0E-06 1.0E-0
Single Section
MAXIMUM CLAMP VOLTAGE MAXIMUM STANDBY CURRENT (LEAKAGE)
TYPICAL
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
CURRENT
FIGURE CHARACTERISTICS
NUMBER SURGES SURGE CURRENT
SQUARE WAVE PULSE DURATION (µs)
1000
10000
FIGURE PULSE RATING LONG DURATION SURGES (ANY SINGLE SECTION)
SurgeNet Array Typical Performance Curves
NORMALIZED VARISTOR VOLTAGE -40oC 25oC 85oC 125oC
Single Section
(Continued)
0.1µA
10µA CURRENT
100µA
FIGURE STANDBY CURRENT NORMALIZED VARISTOR VOLTAGE TEMPERATURE (ANY SINGLE SECTION)
CAPACITANCE (pF)
1MHz
10MHz FREQUENCY
100MHz
1GHz
FIGURE CAPACITANCE FREQUENCY
1000
OHMS
1MHz
10MHz
100MHz FREQUENCY
1GHz
10GHz
FIGURE EQUIVALENT SERIES RESISTANCE
5-26
SurgeNet Array Typical Performance Curves
10000
Single Section
(Continued)
1000 IMPEDANCE
1MHz
10MHz
100MHz FREQUENCY
1GHz
10GHz
FIGURE IMPEDANCE FREQUENCY
CROSSTALK (dB)
1VRMS
-100
-120 1kHz
10kHz
100kHz
1MHz FREQUENCY
10MHz
100MHz
1GHz
FIGURE ADJACENT CHANNEL CROSSTALK
Soldering Recommendations
principal techniques used soldering components surface mount technology Infrared (IR) Reflow, Vapour Phase Reflow, Wave Soldering. Typical profiles shown Figures When wave soldering, suppressor attached circuit board means adhesive. assembly then placed conveyor through soldering process contact wave. With Vapour Phase Reflow, device placed solder paste substrate. solder paste heated, reflows solders unit board. recommended solder suppressor 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb), 63/37 (Sn/Pb). Littelfuse also recommends solder flux. Wave soldering most strenuous processes. avoid possibility generating stresses thermal
shock, preheat stage soldering process recommended, peak temperature solder process should rigidly controlled. When using reflow process, care should taken ensure that chip subjected thermal gradient steeper than degrees second; ideal gradient being degrees second. During soldering process, preheating within degrees solders peak temperature essential minimize thermal shock. Examples soldering conditions array suppressors given tables below. Once soldering process been completed, still necessary ensure that further thermal shocks avoided. possible cause thermal shock printed circuit boards being removed from solder process subjected cleaning solvents room temperature. boards must allowed gradually cool less than 50oC before cleaning.
5-27
SurgeNet Array
MAXIMUM TEMPERATURE 222oC TEMPERATURE (oC) TEMPERATURE (oC) 40-80 SECONDS ABOVE 183oC RAMP RATE <2oC/s PREHEAT DWELL PREHEAT ZONE MAXIMUM TEMPERATURE 222oC 40-80 SECONDS ABOVE 183oC RAMP RATE >50oC/s PREHEAT ZONE
TIME (MINUTES) TIME (MINUTES)
FIGURE REFLOW SOLDER PROFILE
MAXIMUM WAVE 260oC TEMPERATURE (oC) SECOND PREHEAT FIRST PREHEAT
FIGURE VAPOR PHASE SOLDER PROFILE
Recommended Outline
TIME (MINUTES)
TABLE LAYOUT DIMENSIONS DIMENSION Millimeters Inches 0.89 0.035 1.65 0.065 2.54 0.100 0.46 0.018 0.79 0.030
FIGURE WAVE SOLDER PROFILE
Mechanical Dimensions
Inch Millimeter 0.126 ±0.008 ±0.2
0.063 ±0.008 ±0.2
0.053 1.35
0.030 0.76
0.045 ±0.004 1.14 ±0.1
0.015 ±0.004 0.38 ±0.1
0.016 ±0.004 0.007 +0.01/- 0.002 0.41 ±0.1 0.18 +0.25/-0.0
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SurgeNet Array Ordering Information
VXXMLN TYPES
DEVICE FAMILY TVSS Device MAXIMUM WORKING VOLTAGE
1206
PACKING OPTIONS <100 Bulk Pack (178mm) Diameter Reel (Note) 13in (330mm) Diameter Reel (Note) NOTE: Standard Shipping Quantities table.
MULTILAYER DESIGNATOR SERIES DESIGNATOR Array DEVICE SIZE: i.e., NUMBER SECTIONS TERMINATION OPTION Ag/Pd/Pt
Explanation Terms
Rated Voltage (VM(DC))
This maximum continuous voltage which applied maximum operating temperature device. rated operating voltage (working voltage) also used reference point leakage current. This voltage always less than breakdown voltage device.
Clamping Voltage (VC)
This peak voltage appearing across suppressor when measured conditions specified pulse current specified waveform. Device Ratings.
Capacitance
This capacitance device specified frequency (1MHz) bias (1VP-P). Device Ratings.
Leakage Rated Voltage
nonconducting mode, device very high impedance (106) appears essentially open circuit system. leakage current drawn this level very low. Device Ratings.
1000-4-2
electrostatic discharge requirements portion electromagnetic compatibility standard written International Electrotechnical Commission. specification describes specific human body model test conditions methods.
Nominal Voltage (VN(DC))
This voltage which device changes from state state enters conduction mode operation. voltage usually characterized point specified minimum maximum voltage listed.
5-29
SurgeNet Array Tape Reel Specifications
Conforms 481, Revision Supplied Publication
SYMBOL Width Cavity Length Cavity Depth Cavity Width Tape Distance Between Drive Hole Centers Cavity Centers Distance Between Drive Hole Centers Tape Edge Distance Between Cavity Center Axial Distance Between Drive Hole Centers Cavity Centers Axial Distance Between Drive Hole Centers Drive Hole Diameter Diameter Cavity Piercing Embossed Tape Thickness Tape Thickness DESCRIPTION MILLIMETERS Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. ±0.2 ±0.5 1.75 ±0.1 ±0.1 ±0.1 ±0.1 1.55 ±0.05 1.05 ±0.05
NOTE: Dimensions millimeters.
PRODUCT IDENTIFYING LABEL
PLASTIC CARRIER TAPE
EMBOSSMENT TAPE
NOMINAL
178mm 330mm DIA. REEL
Standard Shipping Quantities
DEVICE SIZE 1206 "13" INCH REEL ("T" OPTION) 10,000 INCH REEL ("H" OPTION) 2,500 BULK PACK ("A" OPTION)
5-30
AUML Series
Data Sheet July 1999 File Number 3387.
Multilayer Surface Mount Automotive /Title Transient Surge Suppressors (AUML Series) AUML Series Multilayer Transient Surge Suppressors specifically designed suppress destructive /Subtransient voltages found automobile. most ject common transient condition results from large inductive (Multi- energy discharges. electronic systems automobile, e.g. antilock brake systems, direct ignition layer systems, engine control, airbag control systems, wiper motor Surcontrols, etc., susceptible damage from these voltage face transients thus require protection. AUML transient Mount suppressors have temperature independent suppression Autocharacteristics affording protection from -55oC 125oC. motive AUML suppressor manufactured from semiconducting Tranceramics which offer rugged protection excellent sient transient energy absorption small package. devices Surge ceramic leadless chip form, eliminating lead inductance assuring fast speed response transient Supsurges. These Suppressors require significantly smaller presspace land pads than silicon diodes, offering sors) greater circuit board layout flexibility designer. /Author Also Littelfuse Series Multilayer Suppressors. /Keywords (Littelfuse, Inc., Suppression Products, TVS, Transient Suppression, Protection, Automotive, Load Dump,
Features
Load Dump Energy Rated Specification J1113 Leadless, Surface Mount Chip Form "Zero" Lead Inductance Variety Energy Ratings Available Temperature Derating 125oC Ambient High Peak Surge Current Capability Profile, Compact Industry Standard Chip Size; (1206, 1210, 1812 2220 Sizes) Inherent Bidirectional Clamping Plastic Epoxy Packaging Assures Better than 94V-0 Flammability Rating
Packaging
AUML SERIES
5-31
1-800-999-9445 1-847-824-1188 Copyright
Littelfuse, Inc. 1999
AUML Series
Absolute Maximum Ratings
ratings individual members series, Device Ratings Specifications chart AUML SERIES Continuous: Steady State Applied Voltage: Voltage Range (VM(DC)) Transient: Load Dump Energy, (WLD) Jump Start Capability minutes), (VJUMP) Operating Ambient Temperature Range (TA) Storage Temperature Range (TSTG). Temperature Coefficient Clamping Voltage (VC) Specified Test Current UNITS
24.5 <0.01
%/oC
CAUTION: Stresses above those listed "Absolute Maximum Ratings" cause permanent damage device. This stress only rating operation device these other conditions above those indicated operational sections this specification implied.
Device Ratings Specifications
MAXIMUM RATINGS (125oC) MAXIMUM CONTINUOUS VOLTAGE VM(DC) JUMP START VOLTAGE MIN) VJUMP 24.5 24.5 24.5 24.5 LOAD DUMP ENERGY PULSES) SPECIFICATIONS (25oC) NOMINAL VARISTOR VOLTAGE 10mA TEST CURRENT VN(DC) VN(DC) MAXIMUM STANDBY LEAKAGE 13VDC) (µA) MAXIMUM CLAMPING VOLTAGE (VC) TEST CURRENT (8/20µs)
PART NUMBER V18AUMLA1206 V18AUMLA1210 V18AUMLA1812 V18AUMLA2220 NOTES:
Average power dissipation transients exceed 0.1W, 0.15W, 0.3W model sizes 1206, 1210, 1812 2220 respectively. Load dump energy rating (into suppressor) voltage transient with resultant time constant 115ms 230ms. Thermal shock capability Mil-Std-750, Method 1051: -55oC 125oC, minutes 25oC, Cycles: minutes each extreme. application specific requirements, please contact Littelfuse.
Power Dissipation Ratings
When transients occur rapid succession, average power dissipation energy (watt-seconds) pulse times number pulses second. power developed must within specifications shown Device Ratings Characteristics table specific device. Certain parameter ratings must derated high temperatures shown Figure
PERCENT RATED VALUE
AMBIENT TEMPERATURE (oC)
FIGURE CURRENT, ENERGY POWER DERATING CURVE
5-32
AUML Series Characteristics Curves
MAXIMUM LEAKAGE 1210/1206 1812 2220 MAXIMUM CLAMPING VOLTAGE
VOLTAGE
1210/1206
1812 2220
10µA 100µA 10mA 100mA 100A CURRENT
FIGURE MAXIMUM LEAKAGE CURRENT/CLAMPING VOLTAGE CURVE AUML SERIES
VOLTAGE
-40oC 25oC
85oC
125oC 10µA 100µA 10mA CURRENT 100mA 100A 1000A
FIGURE TYPICAL CHARACTERISTICS V18AUMLA2220 25oC, 85oC 125oC
Temperature Effects
leakage region AUML suppressor, device characteristics approaches linear (ohmic) relationship shows temperature dependent affect. this region suppressor high resistance mode (approaching 106) appears near open-circuit. Leakage currents maximum rated voltage microamp range. When clamping transients higher currents above milliamp range), AUML suppressor approaches 1-10 characteristic. this region characteristics AUML virtually temperature independent. Figure shows typical effect temperature characteristics AUML suppressor.
5-33
AUML Series Load Dump Energy Capability
Load dump transient occurs when alternator load automobile abruptly reduced. worst case scenario this transient occurs when battery disconnected while operating full rated load. There number different load dump specifications existence automotive industry, with most common being that recommended Society Automotive Engineers, specification #SAE J1113. Because diversity these load dump specifications Littelfuse defines load dump energy capability AUML suppressor range that energy dissipated device itself, independent test circuit setup. resultant load dump energy handling capability serves excellent figure merit AUML suppressor. Standard load dump specifications require device capability pulses rated energy, across temperature range 40oC 125oC. This capability requirement well within ratings AUML series (Figure Further testing AUML series concentrated extending number load dump pulses, rated energy, which applied devices. reliability information thus generated gives indication inherent capability these devices. example device durability 1210 size been subjected over 2000 pulses rated energy joules; 1812 size have been pulsed over 1000 times joules 2220 size been pulsed rated energy joules over times. cases there been little change device characteristics (Figure very high energy absorption capability AUML suppressor achieved means highly controlled manufacturing process. This technology ensures that large volume suppressor material, with interdigitated layer construction, available energy absorption extremely small package. Unlike equivalent rated silicon diodes, entire AUML device volume available
FIRED CERAMIC DIELECTRIC
dissipate load dump energy. Hence, peak temperatures generated load dump transient significantly lower evenly dissipated throughout complete device (Figure This even energy dissipation ensures that there lower peak temperatures generated grain boundaries AUML suppressor. There number different size devices available AUML series, each with load dump energy rating, which size dependent. Experience shown that while effects load dump transient real concern, frequency occurrence much less than those energy inductive spikes. Such energy inductive spikes generated result motors switching off, from occurrences, fuse blowing, etc. essential that suppression technology selected also capability suppress such transients. Testing V18AUMLA2220 shown that after being subjected repetitive energy pulse joules, over 6000 times, characteristic changes have occurred (Figure
Speed Response
clamping action AUML suppressor depends conduction mechanism similar that other semiconductor devices (i.e. Junctions). apparent slow response time often associated with transient voltage suppressors (Zeners, MOVs) often parasitic inductance package leads device less dependent basic material (silicon, zinc oxide). Thus, single most critical element affecting response time suppressor lead inductance. AUML suppressor surface mount device, with leads external packaging, thus, virtually zero inductance. actual response time AUML surge suppressor nanosecond range, more than sufficient transients which likely encountered automotive environment.
METAL ELECTRODES
DEPLETION REGION
DEPLETION REGION GRAINS
FIGURE INTERDIGITATED CONSTRUCTION AUML SUPPRESSOR
5-34
AUML Series
V(10mA) VOLTAGE LOAD DUMPS 2220 1812 1210
FIGURE AUML LOAD DUMP PULSING OVER TEMPERATURE RANGE 125oC
V(10mA) VOLTAGE 1,000 2,000 LOAD DUMPS 1210 2220 1812
FIGURE REPETITIVE LOAD DUMP PULSING RATED ENERGY
10mA
VOLTAGE
V18AUMLA2220
1000 2000 3000 4000 5000 NUMBER PULSES 6000 7000
FIGURE REPETITIVE ENERGY TESTING V18AUMLA2220 ENERGY LEVEL JOULES
AUML Series Soldering Recommendations
principal techniques used soldering components surface mount technology Infra (IR) Reflow, Vapour Phase Reflow, Wave Soldering. When wave soldering, suppressor attached circuit board means adhesive. assembly then placed conveyor through soldering process contact wave. With Vapour Phase Reflow, device placed solder paste substrate. solder paste heated, reflows solders unit board. recommended solder 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb), 63/37 (Sn/Pb). Littelfuse also recommends solder flux. Wave soldering most strenuous processes. avoid possibility generating stresses thermal shock, preheat stage soldering process recommended, peak temperature solder process should rigidly controlled. When using reflow process, care should taken ensure that chip subjected thermal gradient steeper than degrees second; ideal gradient being degrees second. During soldering process, preheating within degrees solders peak temperature essential minimize thermal shock. Examples soldering conditions AUML Series suppressors given tables below. Once soldering process been completed, still necessary ensure that further thermal shocks avoided. possible cause thermal shock printed circuit boards being removed from solder process subjected cleaning solvents room temperature. boards must allowed gradually cool less than 50oC before cleaning.
MAXIMUM TEMPERATURE 222oC TEMPERATURE (oC) 40-80 SECONDS ABOVE 183oC RAMP RATE >50oC/s PREHEAT ZONE MAXIMUM WAVE 260oC TEMPERATURE (oC) SECOND PREHEAT FIRST PREHEAT
TIME (MINUTES)
FIGURE WAVE SOLDER PROFILE
TIME (MINUTES)
FIGURE VAPOR PHASE SOLDER PROFILE
Termination Options
Littelfuse offers types electrode termination finish Multilayer product series: Silver/Platinum (standard) Silver/Palladium (optional)
TEMPERATURE (oC) 40-80 SECONDS ABOVE 183oC RAMP RATE <2oC/s PREHEAT DWELL PREHEAT ZONE MAXIMUM TEMPERATURE 222oC
TIME (MINUTES)
FIGURE REFLOW SOLDER PROFILE
5-36
AUML Series Recommended Outline
Leakage Current (IL)
nonconducting mode, device very high impedance (approaching rated working voltage) appears almost open circuit system. leakage current drawn this level very (<25µA ambient temperature) and, unlike zener diode, multilayer added advantage that, when operated maximum temperature, leakage current will increase above 500µA.
NOTE
NOTE: Avoid metal runs this area.
CHIP SIZE 1206 SYMBOL 1210 1812 2220
Nominal Voltage (VN(DC)) This voltage which AUML enters conduction state begins suppress transients. automotive environment this voltage defined 10mA point minimum (VN(DC) MIN) maximum (VN(DC) MAX) voltage specified.
0.203 5.15 0.219 5.51 0.272 6.91 0.315 8.00 0.103 2.62 0.147 3.73 0.172 4.36 0.240 6.19 0.065 1.65 0.073 1.85 0.073 1.85 0.073
Mechanical Dimensions
Explanation Terms
Maximum Continuous Working Voltage (VM(DC))
This maximum continuous voltage which applied, maximum operating temperature (125oC), suppressor. This voltage used reference test point leakage current always less than breakdown voltage device.
CHIP SIZE 1206 SYMBOL 0.071 1.80 1210 0.070 1.80 1812 0.07 2220 0.118 3.00
Load Dump Energy Rating (WLD)
This actual energy part rated dissipate under load dump conditions (not confused with "source energy" load dump test specification).
Maximum Clamping Voltage (VC)
This peak voltage appearing across suppressor when measured conditions specified pulse current specified waveform (8/20µs). important note that peak current peak voltage necessarily coincidental time.
0.02 0.50 0.02 0.50 0.02 0.03 0.75 ±0.01 ±0.25 ±0.01 ±0.25 ±0.01 ±0.25 ±0.01 ±0.25 0.125 3.20 0.125 3.20 0.18 0.225 ±0.012 ±0.03 ±0.012 ±0.30 ±0.014 ±0.35 ±0.016 ±0.4 0.06 1.60 0.10 2.54 0.125 0.197 ±0.011 ±0.28 ±0.012 ±0.30 ±0.012 ±0.30 ±0.016 ±0.4
5-37
AUML Series Ordering Information
V18AUMLAXXXX TYPES
AUML
2220
AUML SERIES
DEVICE FAMILY TVSS Device MAXIMUM WORKING VOLTAGE AUTOMOTIVE MULTILAYER DESIGNATOR LOAD DUMP ENERGY RATING INDICATOR DEVICE SIZE: i.e., NOTE: quantity table.
PACKING OPTIONS <100 Bulk Pack (178mm) Diameter Reel (Note) 13in (330mm) Diameter Reel (Note) TERMINATION OPTION Letter: Ag/Pt (Standard) Ag/Pd Ni/Sn (1206/1210 Only)
Standard Shipping Quantities
DEVICE SIZE 1206 1210 1812 2220 "13" INCH REEL ("T" OPTION) 10,000 8,000 4,000 4,000 INCH REEL ("H" OPTION) 2,500 2,000 1,000 1,000 BULK PACK ("A" OPTION)
Tape Reel Specifications
Conforms 481, Revision Supplied Publication
TAPE Chip Size WIDE TAPE 1206 1210 12mm WIDE TAPE
1812
2220
5-38
AUML Series
TAPE WIDTH SYMBOL Width Cavity Length Cavity Depth Cavity Width Tape Distance Between Drive Hole Centers Cavity Centers Distance Between Drive Hole Centers Tape Edge Distance Between Cavity Center Axial Distance Between Drive Hole Centers Cavity Centers Axial Distance Between Drive Hole Centers Drive Hole Diameter Diameter Cavity Piercing Embossed Tape Thickness Tape Thickness 1.05 0.05 1.55 0.05 1.55 0.05 DESCRIPTION 12mm
Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. Dependent Chip Size Minimize Rotation. 1.75
NOTE: Dimensions millimeters.
Standard Packaging
Tape reel standard packaging method AUML series. standard millimeter inch) reel utilized contains 4000 pieces 2220 1812 chips, 8000 pieces 1210 chip 10,000 pieces 1206 size. order standard part number, e.g. V18AUMLA2220T.
PLASTIC CARRIER TAPE
PRODUCT IDENTIFYING LABEL
Special Packaging
Option millimeter inch) reels containing 1000 (2220, 1812), 2000 (1210), 2500 (1206), pieces available. order standard part number, e.g. V18AUMLA2220H. Option small sample quantities (less than pieces) units shipped bulk pack. order standard part number, e.g. V18AUMLA2220A.
EMBOSSMENT TAPE NOMINAL 178MM 330MM DIA. REEL
5-39
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