Cautions Keep safety first your circuit designs! Renesas Technolo

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Cautions Keep safety first your circuit designs! Renesas Technolo

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Cautions
Keep safety first your circuit designs! Renesas Technology Corporation puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corporation product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corporation third party. Renesas Technology Corporation assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corporation without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corporation authorized Renesas Technology Corporation product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corporation assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corporation various means, including Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corporation assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corporation semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corporation authorized Renesas Technology Corporation product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corporation necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corporation further details these materials products contained therein.
HD74HC1G66
Analog Switch
ADE-205-314F 7th. Edition Feb. 2003 Description
HD74HC1G66 high speed CMOS analog switch using silicon gate CMOS process. With CMOS power dissipation, provides high speed. device resistance good transfer characteristics take wide range input voltage.
Features
basic gate function lined hitachi logic series. Supplied emboss taping high speed automatic mounting. Electrical characteristics equivalent HD74HC4066 Supply voltage range Operating temperature range +85°C Ordering Information
Part Name HD74HC1G66CME Package Type CMPAK-5 Package Code CMPAK-5A Package Abbreviation Taping Abbreviation (Quantity) (3,000 pcs/reel)
HD74HC1G66
Outline Article Indication
HD74HC1G66
Index band Marking
CMPAK-5
Control code blank)
Function Table
Control High level level VOUT Switch
Arrangement
IN/OUT
OUT/IN
Control
(Top view)
Rev.6, Feb. 2003, page
HD74HC1G66
Absolute Maximum Ratings
Item Supply voltage range Input voltage range
Symbol IGND Tstg
Ratings -0.5 -0.5 -0.5
Unit
Test Conditions
Output voltage range Input clamp current Output clamp current
Output >VCC
Continuous output current Continuous current through Maximum power dissipation 25°C still air) Storage temperature Notes:
absolute maximum ratings values which must individually exceeded, furthermore, which realized same time. input output voltage ratings exceeded input output clamp-current ratings observed. This value limited maximum. maximum package power dissipation calculated using junction temperature 150°C.
Recommended Operating Conditions
Item Supply voltage range Input voltage range Output voltage range Input rise fall time (Control input 90%) Symbol VI/O Operating temperature 1000 Unit Test Conditions
Note: Unused floating control inputs must held high low.
Rev.6, Feb. 2003, page
HD74HC1G66
Electrical Characteristics
Item Input voltage Symbol resistance Peak resistance Leak current (off) 25°C 3.15 1.35 1500 ±0.1 85°C 3.15 1.35 2000 ±1.0 VCC, VOUT GND, VOUT IIN/OUT Unit Test Conditions Control input only
(on) Input current Operating current
±0.1 ±0.1
±1.0 ±1.0 10.0
Rev.6, Feb. 2003, page
HD74HC1G66
Switching Characteristics
Item Propagation delay time Symbol tPLH, tPHL Output enable time tZH, Output disable time tHZ, Maximum control frequency Control input capacitance Switch capacitance Feed through capacitance Power dissipation capacitance CIN/OUT CIN-OUT 25°C 85°C Unit Test Conditions
Rev.6, Feb. 2003, page
HD74HC1G66
Test Circuit
(ON) VOUT
VIN-OUT 10-3
VIN-OUT
(off), (on)
(OFF) VOUT (ON) VOUT OPEN
tPLH, tPHL
(ON) VOUT VOUT tPHL
tPLH
Rev.6, Feb. 2003, page
HD74HC1G66
tZH,
tHZ,
VOUT
Waveform
Item
VOUT
Waveform
Notes: Waveform output with internal conditions such that output high except when disabled output control. Waveform output with internal conditions such that output except when disabled output control.
Maximum control frequency
VOUT
VOUT
VCC/2
CIN/OUT, CIN-OUT
CIN-OUT
(OFF) CIN/OUT CIN/OUT
Rev.6, Feb. 2003, page
HD74HC1G66
Package Dimensions
Unit:
(0.65)
(0.65)
(0.425)
0.15- 0.05
1.25
(0.2)
(0.425)
0.05
*Sn-Bi plating
Hitachi Code JEDEC JEITA Mass (reference value)
CMPAK-5V Conforms 0.006
Rev.6, Feb. 2003, page
HD74HC1G66
Disclaimer
Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products.
Sales Offices
Hitachi, Ltd.
Semiconductor Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109
further information write
Hitachi Semiconductor (America) Inc. East Tasman Drive Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Europe GmbH Electronic Components Group Dornacher D-85622 Feldkirchen Postfach 201, D-85619 Feldkirchen Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Hitachi Asia Ltd. Hitachi Tower Collyer Quay #20-00 Singapore 049318 <65>-6538-6533/6538-8577 <65>-6538-6933/6538-3877 Hitachi Asia Ltd. (Taipei Branch Office) 4/F, 167, North Road Hung-Kuo Building Taipei (105), Taiwan <886>-(2)-2718-3666 <886>-(2)-2718-8180 Telex 23222 HAS-TP Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Tsui, Kowloon Hong Kong <852>-2735-9218 <852>-2730-0281
Copyright Hitachi, Ltd., 2003. rights reserved. Printed Japan.
Colophon
Rev.6, Feb. 2003, page

Cautions Keep safety first your circuit designs! Renesas Technolo

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