Cautions Keep safety first your circuit designs! Renesas Technolo

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Cautions Keep safety first your circuit designs! Renesas Technolo

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Cautions
Keep safety first your circuit designs! Renesas Technology Corporation puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corporation product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corporation third party. Renesas Technology Corporation assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corporation without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corporation authorized Renesas Technology Corporation product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corporation assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corporation various means, including Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corporation assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corporation semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corporation authorized Renesas Technology Corporation product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corporation necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corporation further details these materials products contained therein.
4AK26
Silicon N-Channel Power Array
ADE-208-1208 1st. Edition Mar. 2001 Application
High speed power switching
Features
on-resistance DS(on) 0.06 DS(on) 0.075 Capable gate drive drive current High speed switching High density mounting Suitable motor driver solenoid driver lamp driver
Outline
SP-12
1112
Gate Drain Source
4AK26
Absolute Maximum Ratings 25°C)
Item Drain source voltage Gate source voltage Drain current Drain peak current Body drain diode reverse drain current Channel dissipation Channel dissipation Channel temperature Storage temperature Notes: duty cycle Devices operation Symbol VDSS VGSS D(pulse)* 25°C)* Pch* Tstg
Ratings +150
Unit
4AK26
Electrical Characteristics 25°C)
Item Drain source breakdown voltage Gate source breakdown voltage Gate source leak current Symbol V(BR)DSS V(BR)GSS Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Body drain diode forward voltage Body drain diode reverse recovery time Note: Pulse Test |yfs| Ciss Coss Crss d(on) d(off) 0.045 0.056 1400 1.05 0.06 0.075 Unit dIF/dt A/µs Test conditions ±100
Zero gate voltage drain current Gate source cutoff voltage Static drain source state resistance VGS(off) RDS(on)
4AK26
Maximum Channel Dissipation Curve Condition Channel dissipation each idetical Device Operation Device Operation Device Operation Device Operation Maximum Channel Dissipation Curve Condition Channel dissipation each idetical Device Operation Device Operation Device Operation Device Operation
Channel Dissipation
Channel Dissipation
Ambient Temperature (°C)
Case Temperature (°C)
Typical Output Characteristics
Typical Transfer Characteristics
75°C Pulse Test 25°C -25°C
Drain Current Pulse Test
Drain Current
Drain Source Voltage
Gate Source Voltage
4AK26
Drain Source Saturation Voltage Gate Source Voltage
Drain Source Saturation Voltage (on) Pulse Test
Static Drain Source Static Resistance (on)
Static Drain Source State Resistance Drain Current
Pulse Test
0.05
0.02 0.01 0.005 Drain Current
Gate Source Voltage
Static Drain Source State Resistance Temperature
Static Drain Source State Resistance (on) Pulse Test Forward Transfer Admittance
Forward Transfer Admittance Drain Current Pulse Test -25°C 25°C
0.10
0.08
0.06
75°C
0.04
0.02
Case Temperature (°C)
Drain Current
4AK26
Body Diode Reverse Recovery Time 1,000 Reverse Recovery Time (ns) di/dt A/µs, 25°C Pulse Test Capacitance (pF) 10,000 3,000 Ciss 1,000 Coss Crss Reverse Drain Current Drain Source Voltage Typical Capacitance Drain Source Voltage
Dynamic Input Characteristics
Drain Source Voltage Gate Source Voltage 1000 Switching Time (ns)
Switching Characteristics
(off)
2µs, duty
(on) Drain Current
Gate Charge (nc)
4AK26
Reverse Drain Current Source Drain Voltage Reverse Drain Current Pulse Test
Source Drain Voltage
4AK26
Package Dimensions January, 2001
Unit:
31.0
10.0
10.5
0.85
2.54
0.55 -0.06
+0.1
Hitachi Code JEDEC EIAJ Mass (reference value)
SP-12
4AK26
Cautions
Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products.
Hitachi, Ltd.
Semiconductor Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109
NorthAmerica Europe Asia Japan
http://sicapac.hitachi-asia.com
Hitachi Asia Ltd. Hitachi Tower Collyer Quay #20-00, Singapore 049318 <65>-538-6533/538-8577 <65>-538-6933/538-3877 http://www.hitachi.com.sg Hitachi Asia Ltd. (Taipei Branch Office) 4/F, 167, North Road, Hung-Kuo Building, Taipei (105), Taiwan <886>-(2)-2718-3666 <886>-(2)-2718-8180 Telex 23222 HAS-TP http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road Tsim Tsui, Kowloon, Hong Kong <852>-(2)-735-9218 <852>-(2)-730-0281 http://www.hitachi.com.hk
further information write
Hitachi Semiconductor (America) Inc. East Tasman Drive, Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic Components Group Dornacher Strae D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585160
Copyright Hitachi, Ltd., 2000. rights reserved. Printed Japan.
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