Provides Robust Driver Interface between D.C. Relay Coil Sensitiv

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Provides Robust Driver Interface between D.C. Relay Coil Sensitiv

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Integrated Relay/ Inductive Load Driver
Provides Robust Driver Interface between D.C. Relay Coil
Sensitive Logic Circuits Optimized Switch Relays from Rail Capable Driving Relay Coils Rated Features Input Drive Current Good Back-to-Front Transient Isolation Internal Zener Eliminates Need Free-Wheeling Diode Internal Zener Clamp Routes Induced Current Ground Quieter System Operation Guaranteed State with Input Connection Supports Large Systems with Minimal Off-State Leakage Resistant Accordance with 2000 Human Body Model Voltage Reduces System Current Drain Allowing Higher Resistance Relay Coils
MDC3105LT1
RELAY/INDUCTIVE LOAD DRIVER SILICON SMALLBLOCKINTEGRATED CIRCUIT
CASE 318-08, STYLE SOT-23 (TO-236AB)
Applications Include:
INTERNAL CIRCUIT DIAGRAM Vout
Telecom: Line Cards, Modems, Answering Machines, Computer Office: Photocopiers, Printers, Desktop Computers Consumer: VCRs, Stereo Receivers, Players, Cassette
Recorders, Boxes Industrial: Small Appliances, White Goods, Security Systems, Automated Test Equipment, Garage Door Openers Automotive: Driven Relays, Motor Controls, Power Latches, Lamp Drivers This device intended replace array three discrete components with integrated part. available SOT-23 package. used switch inductive loads such relays, solenoids, incandescent lamps, small motors without need free-wheeling diode.
MAXIMUM RATINGS 25°C unless otherwise noted)
Rating Power Supply Voltage Input Voltage Reverse Input Voltage Repetitive Pulse Zener Energy Limit (Duty Cycle 0.01%) Output Sink Current Continuous Junction Temperature Operating Ambient Temperature Range Storage Temperature Range Symbol Vin(fwd) Vin(rev) Ezpk Tstg Value -0.5 +150
Machines, Feature Phone Electronic Hook Switch
Unit
Semiconductor Components Industries, LLC, 2001
March, 2001 Rev.
Publication Order Number: MDC3105LT1/D
MDC3105LT1
THERMAL CHARACTERISTICS
Characteristic Total Device Power Dissipation(1) Derate above 25°C Thermal Resistance Junction Ambient FR-5 0.75 0.062, 25°C Symbol RqJA Value Unit mW/°C °C/W
ELECTRICAL CHARACTERISTICS 25°C unless otherwise noted)
Characteristic Symbol Unit
CHARACTERISTICS
Output Zener Breakdown Voltage Pulse) Output Leakage Current Input Voltage Vdc, O.C., 25°C) Vdc, O.C., 85°C) Guaranteed "OFF" State Input Voltage V(BRout) V(-BRout) Vin(off) -0.7
CHARACTERISTICS
Input Bias Current (HFE Limited) 0.25 Vdc, -40°C) Output Saturation Voltage -40°C) Output Sink Current Continuous -40°C, 0.25 Vdc, VO(sat) IO(on) 0.25 mAdc
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MDC3105LT1
TYPICAL APPLICATION-DEPENDENT SWITCHING PERFORMANCE SWITCHING CHARACTERISTICS
Characteristic Propagation Delay Times: High Propagation Delay; Figure (5.0 74HC04) High Propagation Delay; Figure (5.0 74HC04) High Propagation Delay; Figures (3.0 74HC04) High Propagation Delay; Figures (3.0 74HC04) High Propagation Delay; Figures (5.0 74LS04) High Propagation Delay; Figures (5.0 74LS04) Transition Times: Fall Time; Figure (5.0 74HC04) Rise Time; Figure (5.0 74HC04) Fall Time; Figures (3.0 74HC04) Rise Time; Figures (3.0 74HC04) Fall Time; Figures (5.0 74LS04) Rise Time; Figures (5.0 74LS04) Symbol tPHL tPLH tPHL tPLH tPHL tPLH Units
tPLH Vout tPHL
Figure Switching Waveforms
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MDC3105LT1
TYPICAL PERFORMANCE CHARACTERISTICS
CHARACTERISTICS)
HFE, TRANSISTOR CURRENT GAIN 0.25 1000 -40°C 25°C 85°C INPUT VOLTAGE (VOLTS) MC54LS04 +BAL99LT1 MC68HC05C8 MC14049B 25°C 0.25 MC74HC04 MC68HC05C8 MDC3105LT1 MC74HC04
OUTPUT SINK CURRENT (mA)
INPUT CURRENT (mA)
Figure Transistor Current Gain
Figure Input Requirement Compared Possible Source Logic Outputs
-40°C 25°C Iout OUTPUT CURRENT (mA) OUTPUT CURRENT (mA) 85°C
0.01 0.02 0.03 0.04
0.05 0.06 0.07 0.08
0.09
INPUT CURRENT (mA)
OUTPUT VOLTAGE (Vdc)
Figure Threshold Effects
Figure Transistor Output Characteristic
0.04
25°C ZENER CLAMP VOLTAGE (VOLTS) -40°C
85°C 25°C -40°C 1000
Vout OUTPUT VOLTAGE (Vdc)
Iout Iin, INPUT CURRENT (mA)
ZENER CURRENT (mA)
Figure Output Saturation Voltage versus t/Ii http://onsemi.com
Figure Zener Clamp Voltage versus Zener rrent
MDC3105LT1
TYPICAL PERFORMANCE CHARACTERISTICS
(OFF CHARACTERISTICS)
10,000 1000 OUTPUT LEAKAGE CURRENT (nA) JUNCTION TEMPERATURE (°C) 0.35 OUTPUT LEAKAGE CURRENT (nA) 25°C
0.35
VCC, SUPPLY VOLTAGE (Vdc)
Figure Output Leakage Current versus Temperature
Figure Output Leakage Current versus Supply Voltage
RCE(sat)
Iout(max)
25°C TRANSISTOR THERMAL LIMIT FROM ZENER PULSED ENERGY LIMIT (REFER FIGURE
°CONTINUOUS DUTY
*232
*375
VCC(max) +6.0 0.01 Vout (VOLTS)
TYPICAL
Figure Safe Operating Area
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MDC3105LT1
25°C Emax Emax (Vzpk Izpk)
TIME CONSTANT (ms)
0.001
0.01 Izpk (AMPS)
Figure Zener Repetitive Pulse Energy Limit Time Constant
r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
0.05 0.02 0.01 Pd(pk)
0.01 SINGLE PULSE 0.001
PERIOD
DUTY CYCLE t1/t2 PULSE WIDTH (ms) 1000 10,000 100,000 1,000,000
0.01
Figure Transient Thermal Response
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MDC3105LT1
Using Designing Pulsed Operation
repetitive pulse operating condition, time averaging allows increase device's peak power dissipation rating above average rating dividing duty cycle repetitive pulse train. Thus, continuous rating dissipation increased peak duty cycle pulse train. However, this only holds true pulse widths which short compared thermal time constant semiconductor device which they applied. pulse widths which significant compared thermal time constant device, peak operating condition begins look more like continuous duty operating condition over time duration pulse. these cases, peak power dissipation rating cannot merely time averaged dividing continuous power rating duty cycle pulse train. Instead, average power rating only scaled reduced amount accordance with device's transient thermal response, that device's junction temperature exceeded. Figure MDC3105LT1 data sheet plots transient thermal resistance, r(t) function pulse width various pulse train duty cycles well single pulse illustrates this effect. short pulse widths near left side chart, r(t), factor, which continuous duty thermal resistance multiplied determine much peak power rating increased above average power rating, approaches duty cycle pulse train, which expected value. However, pulse width increased, that factor eventually approaches duty cycles indicating that pulse width sufficiently long appear continuous duty condition this device. MDC3105LT1, this pulse width about seconds. this larger pulse widths, peak power dissipation capability same continuous duty power capability. Figure determine peak power rating specific application, enter chart with worst case pulse condition, that pulse width duty cycle determine worst case r(t) your application. Then calculate peak power dissipation allowed using equation,
Pd(pk) (TJmax TAmax) (RqJA r(t)) Pd(pk) (150°C TAmax) (556°C/W r(t))
Pd(pk) calculated above. circuit simulator having waveform calculator prove very useful this purpose.
Notes Time Constant Limitations
Figure Safe Operating Area (SOA) MDC3105LT1. Device instantaneous operation should never pushed beyond these limits. shows Transistor "ON" condition well zener during turn-off transient. current limited Izpk capability zener well transistor addition input current through resistor. should exceeded temperature. power dissipation limits shown various pulse widths duty cycles ambient temperature 25°C. voltage limit that applied device. When input device switched off, "ON" current instantaneously dumped into zener diode where begins exponential decay. zener clamp voltage function that current level seen bowing versus curve higher currents. addition zener's current limit impacting this device's rating, clamping diode also peak energy limit well. This energy limit measured using rectangular pulse then translated exponential equivalent using relationship between time constant exponential pulse pulse width rectangular pulse having equal energy content. These time constant limits appear along versus curve various values which lines intersect limit. time constant given load should exceed these limits their respective currents. Precise limits zener energy intermediate current levels obtained from Figure
Thus duty cycle Figure yields r(t) when entered above equation, allowable Pd(pk) 85°C. Also note that these calculations assume rectangular pulse shape which rise fall times insignificant compared pulse width. this case specific application, then waveforms should multiplied together resulting power waveform integrated find total dissipation across device. This then would number that less than equal
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MDC3105LT1
Designing with this Data Sheet
Determine maximum inductive load current VCC, coil resistance usually minimum temperature) that MDC3105 will have drive make sure less than rated current. pulsed operation, Transient Thermal Response Figure instructions with determine maximum limit transistor power dissipation desired duty cycle temperature range. Figures with notes above insure that instantaneous operation does push device beyond limits plot. While keeping VO(sat) requirements mind, determine input current needed achieve that output current from Figures levels input current below input threshold curves Figure verify that
there will adequate input current available turn MDC3105 temperatures. levels input current above enter Figure using that input current determine input voltage required drive MDC3105 from solid versus line. Select suitable drive source family from those whose dotted lines cross solid input characteristic line right Iin, point. Using output current calculated step check Figure insure that range zener clamp voltage over temperature will satisfy system requirements. Using Figures insure that "OFF" state leakage over temperature voltage extremes does violate system requirements. Review circuit operation insure none device ratings being exceeded.
APPLICATIONS DIAGRAMS
+3.0 +3.75 +4.5 +5.5
AROMAT TX2-L2-5
Vout MDC3105LT1 74HC04 EQUIVALENT
Vout MDC3105LT1 74HC04 EQUIVALENT
Figure Dual Coil Latching Relay Application with V-HCMOS Level Translating Interface
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MDC3105LT1
Continuous Current Calculation TX2-5V Relay, Nominal 25°C Assuming ±10% Make Tolerance, 25°C Annealed Copper Wire 0.4%/°C [1+(0.004) (-40°-25°)] -40°C (5.5 0.25V) /118 +4.5 +5.5 AROMAT TX2-5V Vout MDC3105LT1 74LS04 BAL99LT1 74HC04 EQUIVALENT AROMAT JS1E-5V +4.5 +5.5 AROMAT JS1E-5V Vout MDC3105LT1 AROMAT JS1E-5V AROMAT JS1E-5V
Figure Relay with Interface
Figure Quad Coil Relay Bank
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MDC3105LT1
TYPICAL OPERATING WAVEFORMS
(VOLTS) (mA) TIME (ms)
TIME (ms)
Figure Square Wave Input
Figure Square Wave Response
Vout (VOLTS) (mA) TIME (ms)
TIME (ms)
Figure Square Wave Response
Figure Square Wave Response
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MDC3105LT1 INFORMATION USING SOT-23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT SURFACE MOUNTED APPLICATIONS Surface mount board layout critical portion total interface between board package. With design. footprint semiconductor packages must correct geometry, packages will self align when correct size insure proper solder connection subjected solder reflow process.
0.037 0.95 0.037 0.95
0.079
0.035
0.031
inches
SOT-23 SOT-23 POWER DISSIPATION calculate power dissipation device which this power dissipation SOT-23 function case milliwatts. size. This vary from minimum size soldering size given maximum power 150°C 25°C milliwatts dissipation. Power dissipation surface mount device 556°C/W determined TJ(max), maximum rated junction temperature die, RJA, thermal resistance from 556°C/W SOT-23 package assumes device junction ambient, operating temperature, recommended footprint glass epoxy printed circuit Using values provided data sheet board achieve power dissipation milliwatts. SOT-23 package, calculated follows: There other alternatives achieving higher power dissipation from SOT-23 package. Another alternative TJ(max) would ceramic substrate aluminum core board such Thermal CladTM. Using board material such Thermal Clad, aluminum core board, power values equation found maximum dissipation doubled using same footprint. ratings table data sheet. Substituting these values into equation ambient temperature 25°C, SOLDERING PRECAUTIONS melting temperature solder higher than rated soldering temperature time should exceed temperature device. When entire device heated 260°C more than seconds. high temperature, failure complete soldering within When shifting from preheating soldering, short time could result device failure. Therefore, maximum temperature gradient should less. following items should always observed order After soldering been completed, device should minimize thermal stress which devices allowed cool naturally least three minutes. subjected. Gradual cooling should used forced Always preheat device. cooling will increase temperature gradient delta temperature between preheat result latent failure mechanical stress. soldering should 100°C less.* Mechanical stress shock should applied When preheating soldering, temperature during cooling leads case must exceed maximum Soldering device without preheating cause temperature ratings shown data sheet. When excessive thermal shock stress which result using infrared heating with reflow soldering damage device. method, difference should maximum 10°C.
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MDC3105LT1
PACKAGE DIMENSIONS SOT-23 (TO-236) CASE 318-08 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS MINIMUM THICKNESS BASE MATERIAL.
STYLE BASE EMITTER COLLECTOR
INCHES 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236
MILLIMETERS 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60
SMALLBLOCK trademark Semiconductor6or Components Industries, LLC(SCILLC) Thermal Clad trademark Bergquist Company.
Semiconductor trademarks Semiconductor Components Industries, (SCILLC). SCILLC reserves right make changes without further notice products herein. SCILLC makes warranty, representation guarantee regarding suitability products particular purpose, does SCILLC assume liability arising application product circuit, specifically disclaims liability, including without limitation special, consequential incidental damages. "Typical" parameters which provided SCILLC data sheets and/or specifications vary different applications actual performance vary over time. operating parameters, including "Typicals" must validated each customer application customer's technical experts. SCILLC does convey license under patent rights rights others. SCILLC products designed, intended, authorized components systems intended surgical implant into body, other applications intended support sustain life, other application which failure SCILLC product could create situation where personal injury death occur. Should Buyer purchase SCILLC products such unintended unauthorized application, Buyer shall indemnify hold SCILLC officers, employees, subsidiaries, affiliates, distributors harmless against claims, costs, damages, expenses, reasonable attorney fees arising directly indirectly, claim personal injury death associated with such unintended unauthorized use, even such claim alleges that SCILLC negligent regarding design manufacture part. SCILLC Equal Opportunity/Affirmative Action Employer.
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MDC3105LT1/D

Provides Robust Driver Interface between D.C. Relay Coil Sensitiv

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