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Integrated Relay / Inductive Load Driver

· Provides a Robust Driver Interface between D.C. Relay Coil and · · · · · · · · ·

ON Semiconductort
Integrated Relay / Inductive Load Driver
· Provides a Robust Driver Interface between D.C. Relay Coil and · · · · · · · · ·
Sensitive Logic Circuits Optimized to Switch Relays from a 3 V to 5 V Rail Capable of Driving Relay Coils Rated up to 2.5 W at 5 V Features Low Input Drive Current & Good Back-to-Front Transient Isolation Internal Zener Eliminates Need for Free-Wheeling Diode Internal Zener Clamp Routes Induced Current to Ground for Quieter System Operation Guaranteed Off State with No Input Connection Supports Large Systems with Minimal Off-State Leakage ESD Resistant in Accordance with the 2000 V Human Body Model Low Sat Voltage Reduces System Current Drain by Allowing Use of Higher Resistance Relay Coils
MDC3105LT1
RELAY / INDUCTIVE LOAD DRIVER SILICON SMALLBLOCK INTEGRATED CIRCUIT
CASE 318-08, STYLE 6 SOT-23 (TO-236AB)
Applications Include:
INTERNAL CIRCUIT DIAGRAM Vout Vin 1.0 k (1) 33 k GND (2) (3)
· Telecom: Line Cards, Modems, Answering Machines, FAX · Computer & Office: Photocopiers, Printers, Desktop Computers · Consumer: TVs & VCRs, Stereo Receivers, CD Players, Cassette
Recorders, TV Set Top Boxes · Industrial: Small Appliances, White Goods, Security Systems, Automated Test Equipment, Garage Door Openers · Automotive: 5.0 V Driven Relays, Motor Controls, Power Latches, Lamp Drivers This device is intended to replace an array of three to six discrete components with an integrated SMT part. It is available in a SOT-23 package. It can be used to switch 3 to 6 Vdc inductive loads such as relays, solenoids, incandescent lamps, and small DC motors without the need of a free-wheeling diode.
Machines, Feature Phone Electronic Hook Switch
Unit Vdc Vdc Vdc mJ mA °C °C °C
March, 2001 - Rev. 2
Publication Order Number: MDC3105LT1 / D
MDC3105LT1
THERMAL CHARACTERISTICS
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
ON CHARACTERISTICS
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MDC3105LT1
TYPICAL APPLICATION-DEPENDENT SWITCHING PERFORMANCE SWITCHING CHARACTERISTICS
Characteristic Propagation Delay Times: High to Low Propagation Delay Figure 1 (5.0 V 74HC04) Low to High Propagation Delay Figure 1 (5.0 V 74HC04) High to Low Propagation Delay Figures 1, 13 (3.0 V 74HC04) Low to High Propagation Delay Figures 1, 13 (3.0 V 74HC04) High to Low Propagation Delay Figures 1, 14 (5.0 V 74LS04) Low to High Propagation Delay Figures 1, 14 (5.0 V 74LS04) Transition Times: Fall Time Figure 1 (5.0 V 74HC04) Rise Time Figure 1 (5.0 V 74HC04) Fall Time Figures 1, 13 (3.0 V 74HC04) Rise Time Figures 1, 13 (3.0 V 74HC04) Fall Time Figures 1, 14 (5.0 V 74LS04) Rise Time Figures 1, 14 (5.0 V 74LS04) Symbol tPHL tPLH tPHL tPLH tPHL tPLH tf tr tf tr tf tr Min - - - - - - - - - - - - Typ 55 430 85 315 55 2.4 45 160 70 195 45 2.4 Max - - - - - - - - - - - - Units nS
Figure 1. Switching Waveforms
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MDC3105LT1
TYPICAL PERFORMANCE CHARACTERISTICS
(ON CHARACTERISTICS)
IO, OUTPUT SINK CURRENT (mA)
INPUT CURRENT (mA)
Figure 2. Transistor DC Current Gain
Figure 3. Input V-I Requirement Compared to Possible Source Logic Outputs
0.4 mA 0.2 mA 0.1 mA
INPUT CURRENT (mA)
VO, OUTPUT VOLTAGE (Vdc)
Figure 4. Threshold Effects
Figure 5. Transistor Output V-I Characteristic
Vout , OUTPUT VOLTAGE (Vdc)
IZ, ZENER CURRENT (mA)
Figure 6. Output Saturation Voltage versus I t / Ii http://onsemi.com
Figure 7. Zener Clamp Voltage versus Zener C rrent
MDC3105LT1
TYPICAL PERFORMANCE CHARACTERISTICS
(OFF CHARACTERISTICS)
2.0 3.0 4.0 5.0 VCC, SUPPLY VOLTAGE (Vdc)
Figure 8. Output Leakage Current versus Temperature
Figure 9. Output Leakage Current versus Supply Voltage
RCE(sat)
232 ms
375 ms
TYPICAL IZ vs VZ 10
Figure 10. Safe Operating Area
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MDC3105LT1
MAX L / R TIME CONSTANT (ms)
0.01 Izpk (AMPS)
Figure 11. Zener Repetitive Pulse Energy Limit on L / R Time Constant
1.0 r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED)
0.1 0.05 0.02 0.01 Pd(pk)
0.01 SINGLE PULSE 0.001
PERIOD
Figure 12. Transient Thermal Response
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MDC3105LT1
Using TTR Designing for Pulsed Operation
the Pd(pk) calculated above. A circuit simulator having a waveform calculator may prove very useful for this purpose.
Notes on SOA and Time Constant Limitations
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MDC3105LT1
Designing with this Data Sheet
1. Determine the maximum inductive load current (at max VCC, min coil resistance & usually minimum temperature) that the MDC3105 will have to drive and make sure it is less than the max rated current. 2. For pulsed operation, use the Transient Thermal Response of Figure 12 and the instructions with it to determine the maximum limit on transistor power dissipation for the desired duty cycle and temperature range. 3. Use Figures 10 & 11 with the SOA notes above to insure that instantaneous operation does not push the device beyond the limits of the SOA plot. 4. While keeping any VO(sat) requirements in mind, determine the max input current needed to achieve that output current from Figures 2 & 6. 5. For levels of input current below 100 mA, use the input threshold curves of Figure 4 to verify that
there will be adequate input current available to turn on the MDC3105 at all temperatures. 6. For levels of input current above 100 mA, enter Figure 3 using that max input current and determine the input voltage required to drive the MDC3105 from the solid Vin versus Iin line. Select a suitable drive source family from those whose dotted lines cross the solid input characteristic line to the right of the Iin, Vin point. 7. Using the max output current calculated in step 1, check Figure 7 to insure that the range of zener clamp voltage over temperature will satisfy all system & EMI requirements. 8. Using Figures 8 & 9, insure that "OFF" state leakage over temperature and voltage extremes does not violate any system requirements. 9. Review circuit operation and insure none of the device max ratings are being exceeded.
APPLICATIONS DIAGRAMS
+3.0 VDD +3.75 Vdc +4.5 VCC +5.5 Vdc
+ + AROMAT TX2-L2-5 V
Vout (3) MDC3105LT1 74HC04 OR EQUIVALENT Vin (1)
Vout (3) MDC3105LT1 Vin (1) 74HC04 OR EQUIVALENT
GND (2)
Figure 13. A 200 mW, 5.0 V Dual Coil Latching Relay Application with 3.0 V-HCMOS Level Translating Interface
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MDC3105LT1
Vin (1) GND (2)
Figure 14. A 140 mW, 5.0 V Relay with TTL Interface
Figure 15. A Quad 5.0 V, 360 mW Coil Relay Bank
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MDC3105LT1
TYPICAL OPERATING WAVEFORMS
3.5 V in (VOLTS) IC (mA) 10 30 50 TIME (ms) 70 90
25 10 30 50 TIME (ms) 70 90
Figure 16. 20 Hz Square Wave Input
Figure 17. 20 Hz Square Wave Response
7 Vout (VOLTS) IZ (mA) 10 30 50 TIME (ms) 70 90
12 10 30 50 TIME (ms) 70 90
Figure 18. 20 Hz Square Wave Response
Figure 19. 20 Hz Square Wave Response
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MDC3105LT1 INFORMATION FOR USING THE SOT-23 SURFACE MOUNT PACKAGE
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total interface between the board and the package. With the design. The footprint for the semiconductor packages must correct pad geometry, the packages will self align when be the correct size to insure proper solder connection subjected to a solder reflow process.
inches mm
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MDC3105LT1
PACKAGE DIMENSIONS SOT-23 (TO-236) CASE 318-08 ISSUE AF
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
STYLE 6: PIN 1. BASE 2. EMITTER 3. COLLECTOR
INCHES MIN MAX 0.1102 0.1197 0.0472 0.0551 0.0350 0.0440 0.0150 0.0200 0.0701 0.0807 0.0005 0.0040 0.0034 0.0070 0.0140 0.0285 0.0350 0.0401 0.0830 0.1039 0.0177 0.0236
MILLIMETERS MIN MAX 2.80 3.04 1.20 1.40 0.89 1.11 0.37 0.50 1.78 2.04 0.013 0.100 0.085 0.177 0.35 0.69 0.89 1.02 2.10 2.64 0.45 0.60
SMALLBLOCK is a trademark of Semiconductor6or Components Industries, LLC(SCILLC) Thermal Clad is a trademark of the Bergquist Company.
PUBLICATION ORDERING INFORMATION
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MDC3105LT1 / D