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Cautions Keep safety first your circuit designs! Renesas Technolo
Top Searches for this datasheetCautions Keep safety first your circuit designs! Renesas Technology Corporation puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap. Notes regarding these materials These materials intended reference assist customers selection Renesas Technology Corporation product best suited customer's application; they convey license under intellectual property rights, other rights, belonging Renesas Technology Corporation third party. Renesas Technology Corporation assumes responsibility damage, infringement third-party's rights, originating product data, diagrams, charts, programs, algorithms, circuit application examples contained these materials. information contained these materials, including product data, diagrams, charts, programs algorithms represents information products time publication these materials, subject change Renesas Technology Corporation without notice product improvements other reasons. therefore recommended that customers contact Renesas Technology Corporation authorized Renesas Technology Corporation product distributor latest product information before purchasing product listed herein. information described here contain technical inaccuracies typographical errors. Renesas Technology Corporation assumes responsibility damage, liability, other loss rising from these inaccuracies errors. Please also attention information published Renesas Technology Corporation various means, including Renesas Technology Corporation Semiconductor home page (http://www.renesas.com). When using information contained these materials, including product data, diagrams, charts, programs, algorithms, please sure evaluate information total system before making final decision applicability information products. Renesas Technology Corporation assumes responsibility damage, liability other loss resulting from information contained herein. Renesas Technology Corporation semiconductors designed manufactured device system that used under circumstances which human life potentially stake. Please contact Renesas Technology Corporation authorized Renesas Technology Corporation product distributor when considering product contained herein specific purposes, such apparatus systems transportation, vehicular, medical, aerospace, nuclear, undersea repeater use. prior written approval Renesas Technology Corporation necessary reprint reproduce whole part these materials. these products technologies subject Japanese export control restrictions, they must exported under license from Japanese government cannot imported into country other than approved destination. diversion reexport contrary export control laws regulations Japan and/or country destination prohibited. Please contact Renesas Technology Corporation further details these materials products contained therein. HA17904A Series Dual Operational Amplifier ADE-204-069 Rev.0 2001 Description HA17904A series dual operational amplifier that provide high gain internal phase compensation, with single power supply. They widely applied control equipments general use. Features Wide range supply voltage, single power supply used Wide range common mode voltage, possible operate with input about output around available Frequency characteristics input bias current temperature compensated electro-magnetic susceptibility level Measurement Condition +7.5 -7.5 0.01 signal source (for quasi-RF noise) Vout 100Vio) Output offset voltage (arb. unit) Output Offset Voltage Input Interference -1.0 100E+3 HA17904A series HA17904 series Improvement 1E+6 10E+6 100E+6 1E+9 Input frequency (Hz) 10E+9 HA17904A Series Ordering Information Type HA17904APS HA17904AFP Application Industrial Package DP-8B FP-8D Arrangement Vout1 Vout2 Vin(-)1 Vin(+)1 Vin(-)2 Vin(+)2 (Top View) Circuit Schematic (1/2) Vin(-) Vin(+) Vout Rev.0, 2001, page HA17904A Series Absolute Maximum Ratings 25°C) Ratings Item Supply voltage Sink current Power dissipation Common mode input voltage Differential input voltage Operating temperature Storage temperature Symbol Isink (diff) Topr Tstg HA17904APS ±VCC +125 HA17904AFP ±VCC +125 Unit -0.3 -0.3 Notes: This allowable values 50°C. Derate mW/°C. These allowable values 25°C mounting air. When mounted glass epoxy board with wiring density, allowable value 45°C. 45°C, derate 7.14 mW/°C. Rev.0, 2001, page HA17904A Series Electrical Characteristics (VCC 25°C) Item Input offset voltage Input offset current Input bias current Power source rejection ratio Voltage gain Common mode rejection ratio Common mode input voltage range Peak-to-peak output voltage Output source current Output sink current Output sink current Supply current Slew rate Channel separation Symbol PSRR Vop-p Iosource Iosink Iosink 13.5 13.6 -0.3 Unit V/µs Test Conditions 7.5V, 7.5V, 7.5V 100k 100k 100k 100k 100Hz, 20k, 100k 2.5V Vout 200mV GND, 7.5V, 1.5kHz 1kHz Rev.0, 2001, page HA17904A Series Characteristic Curves Output source current Iosource (mA) Output Source Current Ambient Temperature Ambeint temperature (°C) Input Bias Current Ambient Temperature Input bias current (nA) Ambeint temperature (°C) Supply Current Supply Voltage Input Bias Current Supply Voltage Input bias current (nA) 25°C 25°C Supply current (mA) Supply voltage Supply voltage Voltage Gain Supply Voltage Maxlmum Output Voltage Frequency Maximum output voltage VOP-P 25°C Voltage gain (dB) 25°C Supply voltage Frequency (Hz) Rev.0, 2001, page HA17904A Series Voltage Gain Frequency 25°C Voltage gain (dB) Frequency (Hz) Common Mode Rejection Ratio Frequency Common mode rejection ratio (dB) 25°C Frequency (Hz) Rev.0, 2001, page HA17904A Series Solder Mounting Method Small light surface-mount packages require spicial attentions solder mounting. solder mounting, pre-heating before soldering needed. following figure show example infrared rays refow. difference thermal expansion coefficeient between mounted substrates leads cause failure like solder peeling soler wet, electrical characteristics change thermal stress. Therefore, mounting should done after sufficient confirmation especially case ceramic substrates. Temperature 235°C 160°C 5°C/s 4°C/s Time Figure Example Infrared Rays Reflow Conditions Rev.0, 2001, page HA17904A Series Package Dimensions Unit: 10.6 0.89 2.54 5.06 1.27 7.62 0.25 0.05 Hitachi Code JEDEC EIAJ Mass (reference value) 0.10 2.54 0.25 0.48 0.10 DP-8B Conforms Conforms 0.51 Unit: 4.85 5.25 *0.22 0.05 0.20 0.04 2.03 0.75 0.25 6.50 0.15 1.05 0.10 0.10 1.27 *0.42 0.08 0.40 0.06 0.25 0.60 0.18 0.15 0.12 *Dimension including plating thickness Base material dimension Hitachi Code JEDEC EIAJ Mass (reference value) FP-8D Conforms 0.10 Rev.0, 2001, page HA17904A Series Disclaimer Hitachi neither warrants grants licenses rights Hitachi's third party's patent, copyright, trademark, other intellectual property rights information contained this document. Hitachi bears responsibility problems that arise with third party's rights, including intellectual property rights, connection with information contained this document. Products product specifications subject change without notice. Confirm that have received latest product standards specifications before final design, purchase use. Hitachi makes every attempt ensure that products high quality reliability. However, contact Hitachi's sales office before using product application that demands especially high quality reliability where failure malfunction directly threaten human life cause risk bodily injury, such aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment medical equipment life support. Design your application that product used within ranges guaranteed Hitachi particularly maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions other characteristics. Hitachi bears responsibility failure damage when used beyond guaranteed ranges. Even within guaranteed ranges, consider normally foreseeable failure rates failure modes semiconductor devices employ systemic measures such failsafes, that equipment incorporating Hitachi product does cause bodily injury, fire other consequential damage operation Hitachi product. This product designed radiation resistant. permitted reproduce duplicate, form, whole part this document without written approval from Hitachi. Contact Hitachi's sales office questions regarding this document Hitachi semiconductor products. Sales Offices Hitachi, Ltd. Semiconductor Integrated Circuits Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: (03) 3270-2111 Fax: (03) 3270-5109 NorthAmerica Europe Asia Japan http://sicapac.hitachi-asia.com Hitachi Asia Ltd. Hitachi Tower Collyer Quay #20-00 Singapore 049318 <65>-538-6533/538-8577 <65>-538-6933/538-3877 http://www.hitachi.com.sg Hitachi Asia Ltd. (Taipei Branch Office) 4/F, 167, North Road Hung-Kuo Building Taipei (105), Taiwan <886>-(2)-2718-3666 <886>-(2)-2718-8180 Telex 23222 HAS-TP http://www.hitachi.com.tw Hitachi Asia (Hong Kong) Ltd. Group (Electronic Components) 7/F., North Tower World Finance Centre, Harbour City, Canton Road Tsim Tsui, Kowloon Hong Kong <852>-(2)-735-9218 <852>-(2)-730-0281 further information write Hitachi Semiconductor (America) Inc. East Tasman Drive Jose,CA 95134 Tel: (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe Ltd. Electronic Components Group Whitebrook Park Lower Cookham Road Maidenhead Berkshire 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 585200 Hitachi Europe GmbH Electronic Components Group Dornacher D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9180-0 Fax: <49> (89) Copyright Hitachi, Ltd., 2001. rights reserved. Printed Japan. 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