| The Datasheet Archive - 100 Million Datasheets from 7500 Manufacturers. |
2SK3353 DESCRIPTION 2SK3353 N-channel Field Effect Transisto
Top Searches for this datasheetFIELD EFFECT TRANSISTOR 2SK3353 DESCRIPTION 2SK3353 N-channel Field Effect Transistor designed high current switching applications. ORDERING INFORMATION PART NUMBER 2SK3353 2SK3353-S PACKAGE TO-220AB TO-262 TO-263 TO-220SMD Note FEATURES Super on-state resistance: RDS(on)1 MAX. (VGS RDS(on)2 MAX. (VGS Ciss: Ciss 4650 TYP. Built-in gate protection diode 2SK3353-ZJ 2SK3353-Z Note TO-220SMD package produced only Japan (TO-220AB) ABSOLUTE MAXIMUM RATINGS 25°C) Drain Source Voltage (VGS Gate Source Voltage (VDS Drain Current (DC) 25°C) Drain Current (pulse) Note1 VDSS VGSS ID(DC) ID(pulse) Tstg ±328 +150 Total Power Dissipation 25°C) Total Power Dissipation 25°C) Channel Temperature Storage Temperature Single Avalanche Current Single Avalanche Energy Note2 Note2 (TO-262) Notes Duty cycle Starting 25°C, (TO-263, TO-220SMD) information this document subject change without notice. Before using this document, please confirm that this latest version. devices/types available every country. Please check with local representative availability additional information. Document D14130EJ2V0DS00 (2nd edition) Date Published November 2000 CP(K) Printed Japan mark shows major revised points. 1999 2SK3353 ELECTRICAL CHARACTERISTICS 25°C) Characteristics Zero Gate Voltage Drain Current Gate Leakage Current Gate Cut-off Voltage Forward Transfer Admittance Drain Source On-state Resistance Symbol IDSS IGSS VGS(off) RDS(on)1 RDS(on)2 Input Capacitance Output Capacitance Reverse Transfer Capacitance Turn-on Delay Time Rise Time Turn-off Delay Time Fall Time Total Gate Charge Gate Source Charge Ciss Coss Crss td(on) td(off) VF(S-D) di/dt A/µs Test Conditions VGS(on) 10.5 4650 1550 MIN. TYP. MAX. Unit Gate Drain Charge Body Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge TEST CIRCUIT AVALANCHE CAPABILITY D.U.T. TEST CIRCUIT SWITCHING TIME D.U.T. Wave Form VGS(on) BVDSS Duty Cycle Wave Form td(on) td(off) toff Starting TEST CIRCUIT GATE CHARGE D.U.T. Data Sheet D14130EJ2V0DS 2SK3353 TYPICAL CHARACTERISTICS 25°C TOTAL POWER DISSIPATION CASE TEMPERATURE Total Power Dissipation DERATING FACTOR FORWARD BIAS SAFE OPERATING AREA Percentage Rated Power Channel Temperature Case Temperature FORWARD BIAS SAFE OPERATING AREA 1000 ID(pulse) Drain Current ID(DC) 25°C Single Pulse Drain Source Voltage TRANSIENT THERMAL RESISTANCE PULSE WIDTH 1000 rth(t) Transient Thermal Resistance °C/W Rth(ch-A) 83.3°C/W Rth(ch-C) 1.32°C/W 0.01 Single Pulse 1000 Pulse Width Data Sheet D14130EJ2V0DS 2SK3353 FORWARD TRANSFER CHARACTERISTICS 1000 Pulsed Drain Current DRAIN CURRENT DRAIN SOURCE VOLTAGE Drain Current -50°C 25°C 75°C 150°C Pulsed Drain Source Voltage Gate Source Voltage RDS(on) Drain Source On-state Resistance FORWARD TRANSFER ADMITTANCE DRAIN CURRENT DRAIN SOURCE ON-STATE RESISTANCE GATE SOURCE VOLTAGE Pulsed Forward Transfer Admittance Pulsed 150°C 75°C 25°C -50°C Gate Source Voltage Drain Current RDS(on) Drain Source On-state Resistance DRAIN SOURCE ON-STATE RESISTANCE DRAIN CURRENT Pulsed GATE CUT-OFF VOLTAGE CHANNEL TEMPERATURE VGS(off) Gate Cut-off Voltage 1000 Drain Current Channel Temperature Data Sheet D14130EJ2V0DS 2SK3353 RDS(on) Drain Source On-state Resistance DRAIN SOURCE ON-STATE RESISTANCE CHANNEL TEMPERATURE Diode Forward Current SOURCE DRAIN DIODE FORWARD VOLTAGE 1000 Pulsed Pulsed Channel Temperature Source Drain Voltage CAPACITANCE DRAIN SOURCE VOLTAGE 100000 SWITCHING CHARACTERISTICS 10000 td(on), td(off), Switching Time Ciss, Coss, Crss Capacitance 1000 td(off) td(on) 10000 Ciss 1000 Coss Crss Drain Source Voltage Drain Current REVERSE RECOVERY TIME DRAIN CURRENT 1000 Reverse Recovery Time Drain Source Voltage di/dt A/µs DYNAMIC INPUT/OUTPUT CHARACTERISTICS Gate Source Voltage Drain Current Gate Charge Data Sheet D14130EJ2V0DS 2SK3353 SINGLE AVALANCHE CURRENT INDUCTIVE LOAD 1000 Single Avalanche Current Energy Derating Factor SINGLE AVALANCHE ENERGY DERATING FACTOR Inductive Load Starting Starting Channel Temperature Data Sheet D14130EJ2V0DS 2SK3353 PACKAGE DRAWINGS (Unit: TO-220AB(MP-25) TO-262(MP-25 Cut) 3.0±0.3 10.6 MAX. 10.0 MAX. 1.0±0.5 MAX. 1.3±0.2 3.6±0.2 MIN. (10) 1.3±0.2 15.5 MAX. MAX. 1.3±0.2 12.7 MIN. 1.3±0.2 12.7 MIN. 8.5±0.2 0.75±0.3 2.54 TYP. 0.5±0.2 2.54 TYP. 1.Gate 2.Drain 3.Source 4.Fin (Drain) 2.8±0.2 0.75±0.1 2.54 TYP. 0.5±0.2 2.54 TYP. 1.Gate 2.Drain 3.Source 4.Fin (Drain) 2.8±0.2 TO-263 (MP-25ZJ) TO-220SMD(MP-25Z) Note (10) 1.0±0.5 8.5±0.2 MAX. 1.3±0.2 (10) MAX. 1.3±0.2 1.0±0.5 5.7±0.4 11±0.4 3.0±0.5 8.5±0.2 1.4±0.2 0.7±0.2 2.54 TYP. 1.4±0.2 1.0±0.3 0.5±0.2 2.54 TYP. 0.5±0.2 2.54 TYP. 2.54 TYP. 1.Gate 2.Drain 3.Source 4.Fin (Drain) 2.8±0.2 Note This Package produced only Japan. EQUIVALENT CIRCUIT Drain Remark Gate Body Diode diode connected between gate source transistor serves protector against ESD. When this device actually used, additional protection circuit externally required voltage exceeding rated voltage applied this device. Gate Protection Diode Source 2.8±0.2 1.Gate 2.Drain 3.Source 4.Fin (Drain) Data Sheet D14130EJ2V0DS 2SK3353 information this document current November, 2000. information subject change without notice. actual design-in, refer latest publications NEC's data sheets data books, etc., most up-to-date specifications semiconductor products. products and/or types available every country. Please check with sales representative availability additional information. part this document copied reproduced form means without prior written consent NEC. assumes responsibility errors that appear this document. does assume liability infringement patents, copyrights other intellectual property rights third parties arising from semiconductor products listed this document other liability arising from such products. license, express, implied otherwise, granted under patents, copyrights other intellectual property rights others. Descriptions circuits, software other related information this document provided illustrative purposes semiconductor product operation application examples. incorporation these circuits, software information design customer's equipment shall done under full responsibility customer. assumes responsibility losses incurred customers third parties arising from these circuits, software information. While endeavours enhance quality, reliability safety semiconductor products, customers agree acknowledge that possibility defects thereof cannot eliminated entirely. minimize risks damage property injury (including death) persons arising from defects semiconductor products, customers must incorporate sufficient safety measures their design, such redundancy, fire-containment, anti-failure features. semiconductor products classified into following three quality grades: "Standard", "Special" "Specific". "Specific" quality grade applies only semiconductor products developed based customer-designated "quality assurance program" specific application. recommended applications semiconductor product depend quality grade, indicated below. Customers must check quality grade each semiconductor product before using particular application. "Standard": Computers, office equipment, communications equipment, test measurement equipment, audio visual equipment, home electronic appliances, machine tools, personal electronic equipment industrial robots "Special": Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment medical equipment (not specifically designed life support) "Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems medical equipment life support, etc. quality grade semiconductor products "Standard" unless otherwise expressly specified NEC's data sheets data books, etc. customers wish semiconductor products applications intended NEC, they must contact sales representative advance determine NEC's willingness support given application. (Note) "NEC" used this statement means Corporation also includes majority-owned subsidiaries. "NEC semiconductor products" means semiconductor product developed manufactured defined above). Other recent searchesVZU-6997CY - VZU-6997CY VZU-6997CY Datasheet Sn3Ag-0 - Sn3Ag-0 Sn3Ag-0 Datasheet M68EM05V12UM - M68EM05V12UM M68EM05V12UM Datasheet LC2H - LC2H LC2H Datasheet DG2612 - DG2612 DG2612 Datasheet 2613 - 2613 2613 Datasheet CRO3093A-LF - CRO3093A-LF CRO3093A-LF Datasheet CLC415 - CLC415 CLC415 Datasheet CDT3400 - CDT3400 CDT3400 Datasheet C8051F700 - C8051F700 C8051F700 Datasheet
Privacy Policy | Disclaimer |