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Multilayer Surface Mount Transient Voltage Surge Suppressors Seri
Top Searches for this datasheetSeries Multilayer Surface Mount Transient Voltage Surge Suppressors Series family Transient Voltage Surge Suppression devices based Littelfuse Multilayer fabrication technology. These components designed suppress variety transient events, including those specified other standards used Electromagnetic Compliance (EMC). Series typically applied protect integrated circuits other components circuit board level. wide operating voltage energy range make Series suitable numerous applications power supply, control signal lines. Series manufactured from semiconducting ceramics, providing bi-directional voltage clamping supplied leadless, surface mount form compatible with modern reflow wave soldering procedures. operate over wider temperature range than zener diodes, inherently bi-directional, much smaller footprint than plastic-housed components. Littelfuse Inc. manufactures other Multilayer Series products. Series data sheet applications, series data sheet high speed applications, multiline protection AUML Series automotive applications. Features Leadless 0402, 0603, 0805, 1206 1210 Chip Size Multilayer Ceramic Construction Technology Operating Temperature Range Operating Voltage Range VM(DC) =5.5V 120V Rated Surge Current (8x20µs) Rated Energy (10x1000µs) Inherent Bi-directional Clamping Plastic Epoxy Packaging Assures Better than 94V-0 Flammability Rating. Standard Capacitance Types Available Applications Suppression Inductive Switching Other Transient Events Such Surge Voltage Circuit Board Level. Protection Components Sensitive 61000-4-2, MIL-STD 883C Method 3015.7 Other Industry Specifications (See Also Series). Provides On-Board Transient Voltage Protection Transistors. Used Help Achieve Electromagnetic Compliance Products Replace Larger Surface Mount Zeners Many Applications Series Absolute Maximum Ratings. ratings individual members series, Device Ratings Specifications table. Series Continuous: Steady State Applied Voltage: Voltage Range (VM(DC)). Voltage Range (VM(AC)RMS). Transient: Non-Repetitive Surge Current, 8/20µs Waveform (ITM). Non-Repetitive Surge Energy, 10/1000µs Waveform (WTM). UNITS 0.02 +125 +150 <0.01 Operating Ambient Temperature range (TA). Storage Temperature (TSTG). Temperature Coefficient Clamping Voltage (VC) Device Ratings Specifications MAXIMUM RATINGS MAXIMUM NONREPETITIVE SURGE CURRENT (8/20µs) I(A) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs) W(J) 0.050 0.050 0.020 0.050 MAXIMUM CLAMPING VOLTAGE NOTED) SPECIFICATIONS PART NUMBER MAXIMUM CONTINUOUS WORKING VOLTAGE VM(DC) VM(AC) (8/20µs) NOMINAL VOLTAGE TEST CURRENT VN(DC) VN(DC) 15.9 15.9 15.9 15.9 15.9 18.5 20.3 20.3 20.3 20.3 20.3 TYPICAL CAPACITANCE 1MHz (pF) 1100 2200 1200 6000 1600 4500 1600 V3.5MLA0603 V3.5MLA0805 V3.5MLA0805L V3.5MLA1206 V5.5MLA0402 V5.5MLA0603 V5.5MLA0805 V5.5MLA0805L V5.5MLA1206 V9MLA0402 V9MLA0402L V9MLA0603 V9MLA0805L V12MLA0805L V14MLA0402 V14MLA0603 V14MLA0805 V14MLA0805L V14MLA1206 15.5 15.5 15.5 15.5 15.5 Series MAXIMUM RATINGS MAXIMUM NONREPETITIVE SURGE CURRENT (8/20µs) I(A) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000µs) W(J) 0.050 MAXIMUM CLAMPING VOLTAGE NOTED) SPECIFICATIONS PART NUMBER MAXIMUM CONTINUOUS WORKING VOLTAGE VM(DC) VM(AC) (8/20µs) NOMINAL VOLTAGE TEST CURRENT VN(DC) VN(DC) 29.5 29.5 29.5 29.5 54.5 54.5 38.5 38.5 38.5 38.5 66.5 66.5 TYPICAL CAPACITANCE 1MHz (pF) 1100 1250 1000 1575 1530 V18MLA0402 V18MLA0603 V18MLA0805 V18MLA0805L V18MLA1206 V18MLA1210 V26MLA0603 V26MLA0805 V26MLA0805L V26MLA1206 V26MLA1210 V30MLA0603 V30MLA0805L V30MLA1210 V30MLA1210L V33MLA1206 V42MLA1206 V48MLA1210 V48MLA1210L V56MLA1206 V60MLA1210 V68MLA1206 V85MLA1210 V120MLA1210 NOTES: -suffix capacitance energy version, Contact your Littelfuse Sales Representative custom capacitance requirements. Typical leakage <25µA, maximum leakage 50µA VM(DC); 0402-size, typical leakage <5µA, maximum leakage 10µA VM(DC); Average power dissipation transients 0402, 0603, 0805, 1206 1210 sizes exceed 0.03W, 0.05W, 0.1W, 0.1W 0.15W respectively. Series When transients occur rapid succession, average power dissipation energy (wattseconds) pulse times number pulses second. power developed must within specifications shown Device Ratings Specifications table specific device. applications exceeding ambient temperature, peak surge current energy ratings must derated shown Figure AMBIENT TEMPERATURE PERCENT PEAK VALUE Temperature De-rating TIME Figure FIGURE PEAK PULSE CURRENT TEST WAVEFORM CLAMPING VOLTAGE VIRTUAL ORIGIN WAVE TIME FROM PEAK VIRTUAL FRONT TIME 1.25 VIRTUAL TIME HALF VALUE (IMPULSE DURATION) EXAMPLE: 8/20µs CURRENT WAVEFORM: VIRTUAL FRONT TIME 20µs VIRTUAL TIME HALF VALUE FIGURE PEAK CURRENT ENERGY DERATING CURVE Maximum Transient Characteristic Curves MAXIMUM CLAMPING VOLTAGE Varistor Voltage MAXIMUM LEAKAGE V18MLA0402 V14MLA0402 V9MLA0402 V5.5MLA0402 10µA 100µA Current 10mA 100mA 100A FIGURE LIMIT CHARACTERISTIC V5.5MLA0402 V18MLA0402 Series Maximum Transient Characteristic Curves (Continued) Varistor Voltage MAXIMUM CLAMPING VOLTAGE V9MLA0402L MAXIMUM LEAKAGE 10µA 100µA Current 10mA 100mA FIGURE LIMIT CHARACTERISTIC V9MLA0402L MAXIMUM CLAMPING VOLTAGE MAXIMUM LEAKAGE Varistor Voltage V30MLA0603 V26MLA0603 V18MLA0603 V14MLA0603 V9MLA0603 V5.5MLA0603 10µA 100µA 10mA 100mA V3.5MLA0603 100A Current FIGURE LIMIT CHARACTERISTIC V3.5MLA0603 V30MLA0603 MAXIMUM CLAMPING VOLTAGE MAXIMUM LEAKAGE Varistor Voltage V30MLA0805L V26MLA0805L V18MLA0805L V14MLA0805L V12MLA0805L V9MLA0805L V5.5MLA0805L V3.5MLA0805L 10µA 100µA 10mA 100mA 100A Current FIGURE LIMIT CHARACTERISTIC V3.5MLA0805L V30MLA0805L Series Maximum Transient Characteristic Curves (Continued) MAXIMUM CLAMPING VOLTAGE MAXIMUM LEAKAGE Varistor Voltage V26MLA0805 V18MLA0805 V14MLA0805 V5.5MLA0805 V3.5MLA0805 10µA 100µA 10mA 100mA 100A Current FIGURE LIMIT CHARACTERISTIC V3.5MLA0805 V26MLA0805 1000 V68MLA1206 MAXIMUM LEAKAGE V56MLA1206 V42MLA1206 MAXIMUM CLAMPING VOLTAGE Varistor Voltage V33MLA1206 V26MLA1206 V18MLA1206 V14MLA1206 V5.5MLA1206 V3.5MLA1206 10µA 100µA 10mA 100mA 100A Current FIGURE LIMIT CHARACTERISTIC V3.5MLA1206 V68MLA1206 1000 MAXIMUM CLAMPING VOLTAGE MAXIMUM LEAKAGE Varistor Voltage V120MLA1210 V85MLA1210 V60MLA1210 V48MLA1210, V48MLA1210L V30MLA1210, V30MLA1210L V26MLA1210 V18MLA1210 10µA 100µA 10mA 100mA 100A Current FIGURE LIMIT CHARACTERISTIC V18MLA1210 V120MLA1210 Series Device Characteristics current levels, curve multilayer transient voltage suppressor approaches linear (ohmic) relationship shows temperature dependant effect (figure 10). below maximum working voltage, suppressor high resistance mode (approaching maximum rated working voltage). Leakage currents maximum rated voltage below 50µA, typically 25µA; 0402-size: below 10µA, typically 5µA. SUPPRESSOR VOLTAGE PERCENT VNOM 25°C FIGURE MULTILAYER INTERNAL CONSTRUCTION CLAMPING VOLTAGE V26MLA1206 V5.5MLA1206 100% TEMPERATURE (°C) FIGURE CLAMPING VOLTAGE OVER TEMPERATURE 10A) 25°c 100° 125°C 1E-9 1E-8 1E-7 1E-6 1E-5 1E-4 1E-3 1E-2 Energy Absorption/Peak Current Capability Energy dissipated within calculated multiplying clamping voltage, transient current transient duration. important advantage multilayer interdigitated electrode construction within mass dielectric material. This results excellent current distribution peak temperature energy absorbed very low. matrix semiconducting grains combine absorb distribute transient energy (heat) (Figure 11). This dramatically reduces peak temperature, thermal stresses enhances device reliability. measure device capability energy peak current handling, V26MLA1206A part tested with multiple pulses peak current rating (150A, 8/20µs). test, 10,000 pulses later, device voltage characteristics still well within specification (figure 13). SUPPRESSOR CURRENT FIGURE TYPICAL TEMPERATURE DEPENDANCE CHARACTERISTIC CURVE LEAKAGE REGION Speed Response Multilayer Suppressor leadless device. response time limited parasitic lead inductances found other surface mount packages. response time Zinc Oxide dielectric material less than 1nanosecond clamp very fast dV/dt events such ESD. Additionally, "real world" applications, associated circuit wiring often greatest factor affecting speed response. Therefore, transient suppressor placement within circuit considered important certain instances. PEAK CURRENT =150A 8/20µs DURATION, BETWEEN PULSES VOLTAGE V26MLA1206 2000 4000 6000 8000 10000 12000 NUMBER PULSES FIGURE REPETITIVE PULSE CAPABILITY Series Soldering Recommendations principal techniques used soldering components surface mount technology infrared (IR) re-flow, vapour phase re-flow wave soldering. Typical profiles shown figures When wave soldering, suppressor attached circuit board means adhesive. assembly then placed conveyor through soldering process contact wave. With vapour phase re-flow, device placed solder paste substrate. solder paste heated, re-flows solders unit board. recommended solder suppressor 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb) 63/37 (Sn/Pb). Littelfuse also recommends solder flux. Wave soldering most strenuous processes. avoid possibility generating stresses thermal shock, preheat stage soldering process recommended, peak temperature solder process should rigidly controlled. 0402-size devices, re-flow recommended. When using re-flow process, care should taken ensure that chip subjected thermal gradient steeper than degrees second; ideal gradient being degrees second. During soldering process, preheating within degrees solder's peak temperature essential minimize thermal shock. Examples soldering conditions suppressor given tables below. Once soldering process been completed, still necessary ensure that further thermal shocks avoided. possible cause thermal shock printed circuit boards being removed from solder process subjected cleaning solvents room temperature. boards must allowed cool gradually less than before cleaning. AXIM PERATURE RATE SECONDS ABOVE PREHEAT DWELL PREHEAT ZONE TIME (MINUTES) FIGURE REFLOW SOLDER PROFILE AXIM WAVE SECOND PREHEAT FIRST PREHEAT TIME MINUTES) FIGURE WAVE SOLDER PROFILE Termination Options Littelfuse offers types electrode termination finish Multilayer product series: Silver/Platinum (standard, available 0402) Silver/Palladium (optional) AXIM PERATURE RATE SECONDS ABOVE (The ordering information section describes designate them.) PREHEAT ZONE TIME MINUTES) FIGURE VAPOR PHASE SOLDER PROFILE Series Recommended Outline Note: Avoid metal runs this area TABLE LAYOUT DIMENSIONS SIZE 1206 SIZE 0805 SIZE 0603 SIZE DEVICE DEVICE DEVICE Inch Inch Inch 0.203 5.15 0.144 3.65 0.110 2.80 0.103 2.62 0.084 2.13 0.064 1.62 0.065 1.65 0.058 1.48 0.044 1.12 DIMENSION 1210 SIZE DEVICE Inch 0.219 5.53 0.147 3.73 0.073 1.85 0402 SIZE DEVICE Inch 0.100 2.54 0.048 1.22 0.030 0.76 Explanation Terms Rated Voltage (VM(DC)) This maximum continuous voltage which applied maximum operating temperature device. rated operating voltage (working voltage) also used reference point leakage current. This voltage always less than breakdown voltage device. Rated Voltage (VM(AC)RMS) This maximum continuous sinusoidal voltage which applied. This voltage applied temperature maximum operating temperature device. Maximum Non-Repetitive Surge Current (ITM) This maximum peak current which applied 8/20µs impulse, with rated voltage also appled, without causing device failure. pulse applied either polarity with same confidence factor. Figure waveform description. Maximum Non-Repetitive Surge Energy (WTM) This maximum rated transient energy which dissipated single current impulse specified impulse duration (10/1000µs), with rated voltage applied, without causing device failure. Leakage (IL) Rated Voltage non-conducting mode, device very high impedance (>106) appears essentially open circuit system. leakage current drawn this level very low. device ratings. Nominal Voltage (VN(DC)) This voltage which device changes from state state enters conduction mode operation. voltage usually characterized point specified minimum maximum voltage listed. Clamping Voltage (VC) This voltage appearing across suppressor when measured conditions specified pulse current specified waveform. Device Ratings. Capacitance This capacitance device specified frequency (1MHz) bias (1Vp-p). Device Ratings. Series Mechanical Dimensions DIMENSION Max. 1210 Inch 1206 Inch CHIP SIZE 0805 Inch 0603 Inch 0402 Inch 0.113 2.87 0.071 1.80 0.043 1.10 0.035 0.90 0.024 0.60 0.02±0.01 0.50±0.25 0.02±0.01 0.50±0.25 0.01±0.029 0.50±0.25 0.015±0.008 0.4±0.2 0.010 0.006 0.25 0.15 0.125±.012 3.20±0.30 0.125±0.012 3.20±0.30 0.079±0.008 2.01±0.20 0.063±0.006 1.6±0.15 0.039 0.004 0.10±0.012 2.54±0.30 0.06±0.011 1.60±0.28 0.049±0.008 1.25±0.20 0.032±0.06 0.8±0.15 0.020 0.004 Ordering Information VxxML TYPES DEVICE FAMILY Littelfuse TVSS Device MAXIMUM WORKING VOLTAGE MULTILAYER SERIES DESIGNATOR PERFORMANCE DESIGNATOR Standard (See Data Sheet) Array (See Data Sheet) 1206 PACKING OPTIONS 13in (330mm) Diameter Reel (178mm) Diameter Reel Bulk Pack TERMINATION OPTION Letter: Ag/Pt (Standard) Ag/Pd (0402- 0603-size only available Ag/Pd CAPACITANCE OPTION Letter: Standard Capacitance Version (Where available device ratings standard versions) DEVICE SIZE i.e. 120mil 60mil (3mm 1.5mm) Standard Shipping Quantities DEVICE SIZE 1210 1206 0805 0603 0402 INCH REEL ("T" OPTION) 8,000 10,000 10,000 10,000 INCH REEL ("H" OPTION) 2,500 2,500 2,500 2,500 10,000 BULK PACK ("A" OPTION) 2,500 2,500 2,500 2,500 Series Tape Reel Specifications Conforms EIA-481-1, Revision supplied publication 286-3 DESCRIPTION Width Cavity Length Cavity Depth Cavity Width Tape Distance Between Drive Hole Centers Cavity Centers Distance Between Drive Hole Centers Tape Edge Distance Between Cavity Centers Axial Drive Distance Between Drive Hole Centers Cavity Centers Axial Drive Distance Between Drive Hole Centers Drive Hole Diameter Diameter Cavity Piercing Tape Thickness DIMENSIONS MILLIMETERS 0402-Size 0603- 0805- 1206- 1210-Sizes Dependent Chip Size Minimize Rotation Dependent Chip Size Minimize Rotation Dependent Chip Size Minimize Rotation ±0.2 ±0.05 ±0.05 1.75 ±0.1 ±0.1 ±.0.1 ±0.1 1.55 ±0.05 1.05 ±0.05 Max. SYMBOL Littelfuse products manufactured, assembled tested under ISO9000 quality systems certification. Littelfuse products sold description only. Littelfuse reserves right make changes specification time without notice. Accordingly, reader cautioned verify that data sheets current before placing orders. Information furnished Littelfuse believed accurate reliable. However responsibility assumed Littelfuse subsidiaries use, infringements patents patent rights third parties which result from use. license granted implication otherwise under patent patent rights Littelfuse Inc. subsidiaries. Other recent searchesuPD70F3750 - uPD70F3750 uPD70F3750 Datasheet STSJ3NM50 - STSJ3NM50 STSJ3NM50 Datasheet MCF5234 - MCF5234 MCF5234 Datasheet IDT74FST163233 - IDT74FST163233 IDT74FST163233 Datasheet HYM7V64801B - HYM7V64801B HYM7V64801B Datasheet EC10E - EC10E EC10E Datasheet CEP13N10 - CEP13N10 CEP13N10 Datasheet CEB13N10 - CEB13N10 CEB13N10 Datasheet
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