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REJ03G0033-0100Z Rev.1.00 Jun.12.2003 High capacitance ratio. 2.4


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HVL385B
REJ03G0033-0100Z Rev.1.00 Jun.12.2003
High capacitance ratio. 2.43 min) series resistance. 0.75 max) Extremely small Flat Package (EFP) suitable surface mount design.
Ordering Information
Type HVL385B Laser Mark Package Code
Arrangement
Cathode mark Mark
Cathode Anode
Rev.1.00, Jun.12.2003, page
HVL385B
Absolute Maximum Ratings
25°C)
Item Reverse voltage Junction temperature Storage temperature Symbol Tstg Value +125 Unit
Electrical Characteristics
25°C)
Item Reverse current Symbol Capacitance C0.5 C2.5 Capacitance ratio Series resistance 7.20 2.70 2.43 7.70 3.20 2.57 0.75 Unit Test Condition 60°C C0.5 C2.5
Notes: Please soldering iron avoid high stress package. material lead exposed cutting plane. Therefore, soldering nature lead part considered unquestioned. Please kindly consider soldering nature.
Rev.1.00, Jun.12.2003, page
HVL385B
Main Characteristic
10-10 f=1MHz
Reverse current
Capacitance (pF)
10-12
10-14
Reverse voltage
Reverse voltage
Fig.1 Reverse current Reverse voltage
Fig.2 Capacitance Reverse voltage
f=470MHz
Series resistance (LogC)/(LogVR)
-0.2 -0.4 -0.6 -0.8 -1.0 -1.2
Reverse voltage
Reverse voltage
Fig.3 Series resistance Reverse voltage
Fig.4 Linearity factor Reverse voltage
Rev.1.00, Jun.12.2003, page
HVL385B
Package Dimensions
January, 2003
Unit:
0.05 0.05
0.13 0.05
0.47± 0.03
0.05 0.05
Package Code JEDEC JEITA Mass (reference value)
0.0007
Rev.1.00, Jun.12.2003, page
HVL385B
Sales Strategic Planning Div.
Keep safety first your circuit designs!
Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
Renesas Technology Corporation puts maximum effort into making semiconductor products better more reliable, there always possibility that trouble occur with them. Trouble with semiconductors lead personal injury, fire property damage. Remember give consideration safety when making your circuit designs, with appropriate measures such placement substitutive, auxiliary circuits, (ii) nonflammable material (iii) prevention against malfunction mishap.
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Rev.1.00, Jun.12.2003, page

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