MC74HC1G04 high speed CMOS inverter fabricated with silicon gate CMOS

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MC74HC1G04 high speed CMOS inverter fabricated with silicon gate CMOS

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MC74HC1G04 Single Inverter
MC74HC1G04 high speed CMOS inverter fabricated with silicon gate CMOS technology. internal circuit composed multiple stages, including buffer output which provides high noise immunity stable output. MC74HC1G04 output drive current compared MC74HC series.
High Speed: (Typ) Power Dissipation: (Max) 25_C High Noise Immunity Balanced Propagation Delays (tpLH tpHL) Symmetrical Output Impedance (IOH Chip Complexity:
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SC70-5/SC-88A/SOT-353 SUFFIX CASE 419A
SOT23-5/TSOP-5/SC59-5 SUFFIX CASE Date Code
Figure Pinout (Top View)
ASSIGNMENT
Figure Logic Symbol
FUNCTION TABLE
Input Output
ORDERING INFORMATION
detailed ordering shipping information package dimensions section page this data sheet.
Semiconductor Components Industries, LLC, 2001
October, 2001 Rev.
Publication Order Number: MC74HC1G04/D
MC74HC1G04
MAXIMUM RATINGS1
Symbol VOUT IOUT TSTG VESD Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Sink Current Supply Current Supply Storage Temperature Range Lead Temperature, from Case Seconds Junction Temperature Under Bias Thermal Resistance Power Dissipation Still 85_C Moisture Sensitivity Flammability Rating Withstand Voltage Oxygen Index: Human Body Model (Note Machine Model (Note Charged Device Model (Note Above Below 125_C (Note SC70-5/SC-88A (Note TSOP-5 SC70-5/SC-88A TSOP-5 Parameter Value *0.5 )7.0 *0.5 )0.5 *0.5 )0.5 $12.5 )150 )150 Level 0.125 u2000 u200 $500 Unit _C/W
ILATCH-UP
Latch-Up Performance
Maximum Ratings those values beyond which damage device occur. Exposure these conditions conditions beyond those indicated adversely affect device reliability. Functional operation under absolute-maximum-rated conditions implied. Functional operation should restricted Recommended Operating Conditions. Measured with minimum spacing board, using mm-by-1 inch, ounce copper trace with flow. Tested EIA/JESD22-A114-A. Tested EIA/JESD22-A115-A. Tested JESD22-C101-A. Tested EIA/JESD78.
RECOMMENDED OPERATING CONDITIONS
Symbol VOUT Supply Voltage Input Voltage Output Voltage Operating Temperature Range Input Rise Fall Time Parameter )125 1000 Unit
NORMALIZED FAILURE RATE
DEVICE JUNCTION TEMPERATURE VERSUS TIME 0.1% BOND FAILURES
Junction Temperature Time, Hours 1,032,200 419,300 178,700 79,600 37,000 17,800 8,900 Time, Years 117.8 47.9 20.4
FAILURE RATE PLASTIC CERAMIC UNTIL INTERMETALLICS OCCUR 130_C 120_C 100_C 110_C 90_C 80_C TIME, YEARS
1000
Figure Failure Rate Time Junction Temperature
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MC74HC1G04
ELECTRICAL CHARACTERISTICS
Symbol Parameter Minimum High-Level Input Voltage Test Conditions 4.18 5.68 4.31 5.80 0.17 0.18 0.26 0.26 $0.1 3.15 4.20 1.35 1.80 4.13 5.63 0.33 0.33 $1.0 25_C 85_C 3.15 4.20 1.35 1.80 4.08 5.58 0.40 0.40 $1.0 *55_C 125_C 3.15 4.20 1.35 1.80 Unit
Maximum Low-Level Input Voltage
Minimum High-Level Output Voltage
-2.6 Maximum Low-Level Output Voltage
Maximum Input Leakage Current Maximum Quiescent Supply Current
ELECTRICAL CHARACTERISTICS (Input
25_C Symbol tPLH, tPHL Parameter Test Conditions Maximum Propagation Delay Delay, Input 85_C *55_C 125_C Unit
tTLH, tTHL Output Transition Time Maximum Input Capacitance Typical 25_C, Power Dissipation Capacitance (Note defined value internal equivalent capacitance which calculated from operating current consumption without load. Average operating current obtained equation: ICC(OPR) ICC. used determine no-load dynamic power consumption; VCC2 VCC.
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MC74HC1G04
tPHL OUTPUT tTHL tTLH tPLH INPUT OUTPUT
INPUT
*Includes probe capacitance. 1-MHz square input wave recommended propagation delay tests.
Figure Switching Waveforms
Figure Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature Logic Circuit Indicator Temp Range Identifier Tape Reel Suffix Package Type (Name/SOT#/ Common Name) SC70-5/SC-88A/ SOT-353 SC70-5/SC-88A/ SOT-353 SOT23-5/TSOP-5/ SC59-5
Device Order Number MC74HC1G04DFT1 MC74HC1G04DFT2 MC74HC1G04DTT1
Technology HC1G HC1G HC1G
Device Function
Package Suffix
Tape Reel Size 3000 Unit 3000 Unit 3000 Unit
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MC74HC1G04
CAVITY TAPE
TAPE
TAPE TRAILER (Connected Reel Hub) COMPONENTS
COMPONENTS DIRECTION FEED
TAPE LEADER COMPONENTS
Figure Tape Ends Finished Goods
TAPE DIMENSIONS 2.00
4.00 4.00 1.50 1.75
8.00 $0.30
3.50 $0.50
1.00 DIRECTION FEED
Figure DFT1 Reel Configuration/Orientation
TAPE DIMENSIONS 2.00
4.00 4.00 1.50 1.75
8.00 $0.30
3.50 $0.50
1.00 DIRECTION FEED
Figure DFT2/DTT1 Reel Configuration/Orientation
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MC74HC1G04
(0.06 20.2 (0.795
13.0 $0.2 (0.512 $0.008
(1.969
FULL RADIUS
Figure Reel Dimensions
REEL DIMENSIONS
Tape Size Suffix )1.5 *0.0 (0.33 )0.059 *0.00) 14.4 (0.56
DIRECTION FEED
BARCODE LABEL POCKET HOLE
Figure Reel Winding Direction
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MC74HC1G04
PACKAGE DIMENSIONS
SC70-5/SC-88A/SOT-353 SUFFIX 5-LEAD PACKAGE CASE 419A-01 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: INCH. INCHES 0.071 0.087 0.045 0.053 0.031 0.043 0.004 0.012 0.026 -0.004 0.004 0.010 0.004 0.012 0.008 0.079 0.087 0.012 0.016 MILLIMETERS 1.80 2.20 1.15 1.35 0.80 1.10 0.10 0.30 0.65 -0.10 0.10 0.25 0.10 0.30 0.20 2.00 2.20 0.30 0.40
(0.008)
(min)
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(min)
0.65 0.65
MC74HC1G04
PACKAGE DIMENSIONS
SOT23-5/TSOP-5/SC59-5 SUFFIX 5-LEAD PACKAGE CASE 483-01 ISSUE
NOTES: DIMENSIONING TOLERANCING ANSI Y14.5M, 1982. CONTROLLING DIMENSION: MILLIMETER. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS MINIMUM THICKNESS BASE MATERIAL. MILLIMETERS 2.90 3.10 1.30 1.70 0.90 1.10 0.25 0.50 0.85 1.00 0.013 0.100 0.10 0.26 0.20 0.60 1.25 1.55 2.50 3.00 INCHES 0.1142 0.1220 0.0512 0.0669 0.0354 0.0433 0.0098 0.0197 0.0335 0.0413 0.0005 0.0040 0.0040 0.0102 0.0079 0.0236 0.0493 0.0610 0.0985 0.1181
0.05 (0.002)
0.037 0.95 0.074
0.037 0.95
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PUBLICATION ORDERING INFORMATION
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0.039
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0.028 inches
0.094
MC74HC1G04/D

MC74HC1G04 high speed CMOS inverter fabricated with silicon gate CMOS

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