BT139X series GENERAL DESCRIPTION Passivated triacs full pac

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BT139X series GENERAL DESCRIPTION Passivated triacs full pac

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BT139X series
GENERAL DESCRIPTION
Passivated triacs full pack, plastic envelope, intended applications requiring high bidirectional transient blocking voltage capability high thermal cycling performance. Typical applications include motor control, industrial domestic lighting, heating static switching.
QUICK REFERENCE DATA
SYMBOL PARAMETER BT139XBT139XBT139XRepetitive peak off-state voltages on-state current Non-repetitive peak on-state current MAX. 600F 600G MAX. UNIT
VDRM IT(RMS) ITSM
PINNING SOT186A
DESCRIPTION main terminal
CONFIGURATION
case
SYMBOL
main terminal gate
case isolated
LIMITING VALUES
Limiting values accordance with Absolute Maximum System (IEC 134). SYMBOL VDRM IT(RMS) ITSM PARAMETER Repetitive peak off-state voltages on-state current Non-repetitive peak on-state current fusing Repetitive rate rise on-state current after triggering full sine wave; full sine wave; prior surge 16.7 dIG/dt A/µs GT2- GT2- CONDITIONS MIN. -600 6001 MAX. -800 UNIT A/µs A/µs A/µs A/µs
dIT/dt
PG(AV) Tstg
Peak gate current Peak gate voltage Peak gate power Average gate power Storage temperature Operating junction temperature
over period
Although recommended, off-state voltages 800V applied without damage, triac switch on-state. rate rise current should exceed A/µs. April 2003 1.500
BT139X series
ISOLATION LIMITING VALUE CHARACTERISTIC
unless otherwise specified SYMBOL Visol PARAMETER R.M.S. isolation voltage from three terminals external heatsink CONDITIONS 50-60 sinusoidal waveform; R.H. clean dustfree MIN. TYP. MAX. 2500 UNIT
Cisol
Capacitance from external heatsink
THERMAL RESISTANCES
SYMBOL j-hs PARAMETER Thermal resistance junction heatsink Thermal resistance junction ambient CONDITIONS full half cycle with heatsink compound without heatsink compound free MIN. TYP. MAX. UNIT
STATIC CHARACTERISTICS
unless otherwise stated SYMBOL PARAMETER Gate trigger current CONDITIONS BT139XVD GT2- GT2- GT2- GT2- VDRM(max); MIN. TYP. 0.25 MAX. UNIT
Latching current
Holding current On-state voltage Gate trigger voltage Off-state leakage current
April 2003
1.500
BT139X series
DYNAMIC CHARACTERISTICS
unless otherwise stated SYMBOL dVD/dt PARAMETER Critical rate rise off-state voltage Critical rate change commutating voltage Gate controlled turn-on time CONDITIONS BT139XVDM VDRM(max); exponential waveform; gate open circuit IT(RMS) dIcom/dt A/ms; gate open circuit VDRM(max); dIG/dt A/µs MIN. TYP. MAX. UNIT V/µs
dVcom/dt
V/µs
April 2003
1.500
BT139X series
Ptot
Ths(max)
IT(RMS)
BT139X
IT(RMS)
Fig.1. Maximum on-state dissipation, Ptot, versus on-state current, IT(RMS), where conduction angle.
ITSM
Fig.4. Maximum permissible current IT(RMS) versus heatsink temperature Ths.
IT(RMS)
1000
limit quadrant 10us time
initial 100us 10ms 100ms
0.01
surge duration
Fig.2. Maximum permissible non-repetitive peak on-state current ITSM, versus pulse width sinusoidal currents, 20ms.
ITSM ITSM time
Fig.5. Maximum permissible repetitive on-state current IT(RMS), versus surge duration, sinusoidal currents, 38°C.
VGT(Tj) VGT(25
initial
Number cycles 50Hz
1000
Fig.3. Maximum permissible non-repetitive peak on-state current ITSM, versus number cycles, sinusoidal currents,
Fig.6. Normalised gate trigger voltage VGT(Tj)/ VGT(25°C), versus junction temperature
April 2003
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BT139X series
IGT(Tj) IGT(25 GT2- GT2-
1.195 0.018 Ohms
Fig.7. Normalised gate trigger current IGT(Tj)/ IGT(25°C), versus junction temperature
IL(Tj) IL(25
Fig.10. Typical maximum on-state characteristic.
j-hs (K/W) with heatsink compound without heatsink compound
unidirectional bidirectional
0.01
0.001 10us 0.1ms 10ms 0.1s
Fig.8. Normalised latching current IL(Tj)/ IL(25°C), versus junction temperature
IH(Tj) IH(25C)
Fig.11. Transient thermal impedance j-hs, versus pulse width
dV/dt (V/us) off-state dV/dt limit
BT139.G SERIES
1000
BT139 SERIES
BT139.F SERIES
dIcom/dt A/ms
Fig.9. Normalised holding current IH(Tj)/ IH(25°C), versus junction temperature
Fig.12. Typical commutation dV/dt versus junction temperature, parameter commutation dIT/dt. triac should commutate when dV/dt below value appropriate curve pre-commutation dIT/dt.
April 2003
1.500
BT139X series
MECHANICAL DATA
Dimensions Mass:
10.3
Recesses (2x) max. depth
seating plane 15.8
15.8 max. max. tinned
max.
13.5 min.
(2x) 2.54
5.08
Fig.13. SOT186A; seating plane electrically isolated from terminals. Notes Refer mounting instructions F-pack envelopes. Epoxy meets UL94 1/8".
April 2003
1.500
BT139X series
DEFINITIONS
DATA SHEET STATUS DATA SHEET STATUS2 Objective data PRODUCT STATUS3 Development DEFINITIONS This data sheet contains data from objective specification product development. Philips Semiconductors reserves right change specification manner without notice This data sheet contains data from preliminary specification. Supplementary data will published later date. Philips Semiconductors reserves right change specification without notice, order improve design supply best possible product This data sheet contains data from product specification. Philips Semiconductors reserves right make changes time order improve design, manufacturing supply. Changes will communicated according Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A
Preliminary data
Qualification
Product data
Production
Limiting values Limiting values given accordance with Absolute Maximum Rating System (IEC 134). Stress above more limiting values cause permanent damage device. These stress ratings only operation device these other conditions above those given Characteristics sections this specification implied. Exposure limiting values extended periods affect device reliability. Application information Where application information given, advisory does form part specification. Philips Electronics N.V. 2003 rights reserved. Reproduction whole part prohibited without prior written consent copyright owner. information presented this document does form part quotation contract, believed accurate reliable changed without notice. liability will accepted publisher consequence use. Publication thereof does convey imply license under patent other industrial intellectual property rights.
LIFE SUPPORT APPLICATIONS
These products designed life support appliances, devices systems where malfunction these products reasonably expected result personal injury. Philips customers using selling these products such applications their risk agree fully indemnify Philips damages resulting from such improper sale.
Please consult most recently issued datasheet before initiating completing design. product status device(s) described this datasheet have changed since this datasheet published. latest information available Internet April 2003 1.500

BT139X series GENERAL DESCRIPTION Passivated triacs full pac

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